公开(公告)号：US10256120B2

公开(公告)日：2019-04-09

申请号：US14523827

申请日：2014-10-24

Applicant: Applied Materials, Inc.

Inventor： Clinton P. Sakata ,  Hui Chen ,  Jim K. Atkinson ,  Brian J. Brown ,  Jianshe Tang ,  Yufei Chen ,  Yunshuang Ding

IPC: H01L21/00 ,  H01L21/67 ,  B08B1/00 ,  B08B1/04

Abstract: In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

公开(公告)号：US20180079048A1

公开(公告)日：2018-03-22

申请号：US15703740

申请日：2017-09-13

Applicant: Applied Materials, Inc.

Inventor： Shih-Haur Shen ,  Jianshe Tang ,  Jimin Zhang ,  David Maxwell Gage

IPC: B24B37/013

CPC classification number: B24B37/013 ,  B24B37/105 ,  B24B37/205 ,  B24B37/22 ,  B24B49/12

Abstract: During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top surface of an underlying dielectric layer of the substrate exposed and determine based on the first signal. An initial value of the second signal at the determined clearance time is determined. An offset is added to the initial value to generate a threshold value, and a polishing endpoint is triggered when the second signal crosses the threshold value.

公开(公告)号：US20150114430A1

公开(公告)日：2015-04-30

申请号：US14523827

申请日：2014-10-24

Applicant: Applied Materials, Inc.

Inventor： Clinton P. Sakata ,  Hui Chen ,  Jim K. Atkinson ,  Brian J. Brian ,  Jianshe Tang ,  Yufei Chen ,  Yunshuang Ding

IPC: B08B1/00

CPC classification number: B08B1/006 ,  B08B1/04 ,  H01L21/67046

Abstract: In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

Abstract translation: 在一些实施例中，提供了一种用于清洁衬底的设备，其包括（1）衬底卡盘，其构造成支撑具有可接近的衬底的前侧的衬底; （2）抛光垫组件，其构造成支撑直径小于所述基底的直径的抛光垫; 和（3）摆动臂，其联接到所述抛光垫并且构造成沿着所述基板的前侧定位和旋转所述抛光垫，并且在清洁期间控制由所述抛光垫施加在所述基板的前侧上的力的量。 衬底卡盘，抛光垫组件和摆臂配置为抛光清洁衬底。 公开了许多附加方面。