SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT

    公开(公告)号:US20250048594A1

    公开(公告)日:2025-02-06

    申请号:US18919998

    申请日:2024-10-18

    Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

    ADDITIVELY MANUFACTURED COOLING ASSEMBLIES FOR THERMAL AND/OR MECHANICAL SYSTEMS, AND METHODS FOR MANUFACTURING THE ASSEMBLIES

    公开(公告)号:US20210365086A1

    公开(公告)日:2021-11-25

    申请号:US17394088

    申请日:2021-08-04

    Abstract: A multi-domain cooling assembly configured to be coupled with one or more heat sources includes a body having an outer surface and at least one cooling chamber disposed inside the body. The at least one cooling chamber extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources. The assembly includes a cooling channel disposed within the body and fluidly coupled with a passageway that carries cooling fluid into and out of the cooling channel. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel is fluidly separate from the at least one cooling chamber. The cooling channel is thermally coupled with the at least one cooling chamber. The at least one cooling chamber transfers thermal energy from the working fluid to the cooling fluid.

    CYCLONE COOLER DEVICE
    87.
    发明申请

    公开(公告)号:US20210048255A1

    公开(公告)日:2021-02-18

    申请号:US16539807

    申请日:2019-08-13

    Abstract: A cyclone cooler device includes a housing that defines an interior channel elongated along a center axis. One or more of the fluid passage or configuration of an inlet end of the channel is shaped to induce a swirling flow of a cooling fluid within the channel while the channel is thermally coupled with one or more heat sources. The swirling flow of the cooling fluid removes thermal energy from and cools the one or more heat sources. During the swirling flow, the cooling fluid rotates around the center axis of the channel while also moving along the length of the center axis. The cooling fluid changes phases during the swirling flow to cool the heat source(s).

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