公开(公告)号：US11114714B2

公开(公告)日：2021-09-07

申请号：US16431025

申请日：2019-06-04

Applicant: Greatbatch Ltd.

Inventor： Robert S. Rubino ,  Keith W. Seitz ,  Brian P. Hohl

IPC: H01M50/116 ,  H01M4/525 ,  H01M50/10

Abstract: A miniature electrochemical cell having a volume of less than 0.5 cc includes a casing having a header assembly comprising a ceramic plate formed by co-firing a metallic-containing paste in first and second via holes extending through a green-state ceramic. The ceramic plate is joined to a metal ring by a gold-braze to form the header assembly that is secured to an open-ended metal container by a weld to provide the casing. The fill material resulting from sintering the metallic-containing paste provides a first conductive pathway to the anode current collector contacting an anode active material and a second conductive pathway to a cathode current collector contacting a cathode active material. A solid electrolyte activates the anode and cathode while also serving as a separator. Outer surfaces of the first and second conductive pathways are configured for electrical connection to a load.

公开(公告)号：US10957884B1

公开(公告)日：2021-03-23

申请号：US16240850

申请日：2019-01-07

Applicant: Greatbatch Ltd.

Inventor： David Dianetti ,  Gary Freitag ,  Robert S. Rubino ,  Keith W. Seitz ,  Ho-Chul Yun ,  Todd C. Sutay ,  Brian P. Hohl ,  David Wutz

IPC: H01M2/02 ,  H01M2/08 ,  H01M2/30

Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The casing enclosure consists of a lower plate supporting a cylindrically-shaped can having an open upper end closed with a cover. The can is selectively coated with a dielectric material to provide electrical isolation of the to-be-housed active materials from the can sidewall. A glass-to-metal seal electrically isolates the lower plate from the can. An electrode assembly comprising a sandwich of cathode active material/separator/anode active material is housed in the casing. That way, the lower plate contacting the cathode active material is the positive terminal and the closing cover connected to the can and contacted to the anode active material serves as the negative cell terminal. An electrolyte filled into the casing activates the electrode assembly and the fill opening is sealed with a plug. The cell can be of either a primary or a secondary chemistry.

公开(公告)号：US10905888B2

公开(公告)日：2021-02-02

申请号：US16362043

申请日：2019-03-22

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Brian P. Hohl ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/35 ,  H01G4/236 ,  H01G4/008 ,  H01G4/12

Abstract: A filter feedthrough for an AIMD includes ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A first conductive pathway is hermetically sealed to and disposed through the insulator. A feedthrough capacitor is disposed on the device side and includes at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate within a capacitor dielectric. A capacitor active metallization is electrically connected to the active electrode plate and is in non-electrically conductive relation with the ground electrode plate. A capacitor ground metallization is electrically connected to the ground electrode plate and is in non-electrically conductive relation with the active electrode plate. An anisotropic conductive layer is disposed on the device side. The anisotropic conductive layer electrically connects the capacitor active metallization to the first conductive pathway.

公开(公告)号：US10881867B2

公开(公告)日：2021-01-05

申请号：US16708881

申请日：2019-12-10

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: A61N1/37 ,  A61N1/375 ,  A61N1/05 ,  H01G4/35 ,  H01G2/10 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

公开(公告)号：US20200303763A1

公开(公告)日：2020-09-24

申请号：US16812492

申请日：2020-03-09

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Xiaohong Tang ,  Brian P. Hohl ,  Biswa P. Das ,  Holly Noelle Moschiano

IPC: H01M10/052 ,  H01M10/0562 ,  H01M2/02 ,  H01M2/06 ,  H01M4/66 ,  H01M4/131

Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are electrically conductive feedthroughs or pathways, such as of gold, and are formed by brazing gold into tapered via holes machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte of LiPON (LixPOyNz) is used to activate the electrode assembly.

公开(公告)号：US20200222691A1

公开(公告)日：2020-07-16

申请号：US16827171

申请日：2020-03-23

Applicant: Greatbatch Ltd

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  H01G4/005 ,  H01G4/30 ,  H01G4/35 ,  A61N1/375 ,  H01G4/236

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.

公开(公告)号：US10589107B2

公开(公告)日：2020-03-17

申请号：US16291356

申请日：2019-03-04

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/018 ,  H01G4/224 ,  H01G4/236 ,  H01G4/35 ,  H05K1/18 ,  H01G4/012 ,  H01G4/40

Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.

公开(公告)号：US20200054881A1

公开(公告)日：2020-02-20

申请号：US16656775

申请日：2019-10-18

Applicant: Greatbatch Ltd.

Inventor： Dominick J. Frustaci ,  Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods

IPC: A61N1/375 ,  A61N1/05 ,  H01G4/40 ,  A61N1/08 ,  H01G2/10 ,  H01G2/22 ,  H01R13/7195 ,  H01G4/35

Abstract: A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

公开(公告)号：US20190351240A1

公开(公告)日：2019-11-21

申请号：US16414996

申请日：2019-05-17

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Keith W. Seitz

IPC: A61N1/375 ,  H03H1/00 ,  H01G4/12 ,  H01G4/228 ,  H01G4/35

Abstract: An RF switchable filter feedthrough housed inside an AIMD is described. The RF switchable filter feedthrough includes an RF switch having a switching pole that is configured to be controlled by an AIMD control signal to switch between first and second throw position. In the first throw position, a conductive leadwire hermetically sealed to and disposed through an insulator is electrically connected to a two-terminal MLCC chip capacitor which in turn is electrically connected to the ferrule. In the first throw position, EMI energy imparted to a body fluid side implanted lead is diverted to the housing of the AIMD by the chip capacitor. In the second throw position, the conductive leadwire is electrically connected to an RF source disposed inside the AIMD housing. In the second throw position, by measuring a reflective return signal from the RF source it can be determined whether the implanted lead has a defective lead conductor.

公开(公告)号：USRE47624E1

公开(公告)日：2019-10-01

申请号：US15016368

申请日：2016-02-05

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominck J. Frustaci ,  Steven W. Winn

IPC: H02G3/18 ,  A61N1/05 ,  A61N1/375 ,  H01G4/30 ,  H01G4/35 ,  C22C29/12 ,  H01G2/10 ,  H01G4/40 ,  H01G4/12 ,  H01R43/00 ,  H02G3/22 ,  A61N1/08 ,  H01G4/005 ,  B23K35/30 ,  A61N1/372

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.