公开(公告)号：US20240115867A1

公开(公告)日：2024-04-11

申请号：US18377030

申请日：2023-10-05

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Jason Woods

IPC: A61N1/375

CPC classification number: A61N1/3754

Abstract: The high-voltage and/or high-frequency pulse dielectric breakdown strength (DBS) of an implantable medical device is increased by strategically positioning insulation materials on or adjacent to the external surfaces of a filter capacitor. Dielectric breakdown strength is further increased by adding polymeric or ceramic nanoscale metal oxide insulative powders to the insulation materials.

公开(公告)号：US11588171B2

公开(公告)日：2023-02-21

申请号：US16812492

申请日：2020-03-09

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Xiaohong Tang ,  Holly Noelle Moschiano ,  Biswa P. Das ,  Brian P. Hohl

IPC: H01M50/10 ,  H01M50/116 ,  H01M10/052 ,  H01M10/0562 ,  H01M4/131 ,  H01M4/66 ,  H01M50/186 ,  H01M50/191 ,  H01M50/124

Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are electrically conductive feedthroughs or pathways, such as of gold, and are formed by brazing gold into tapered via holes machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte of LiPON (LixPOyNz) is used to activate the electrode assembly.

公开(公告)号：US11527795B2

公开(公告)日：2022-12-13

申请号：US16788679

申请日：2020-02-12

Applicant: Greatbatch Ltd.

Inventor： Robert S. Rubino ,  Keith W. Seitz ,  Xiaohong Tang ,  Todd C. Sutay ,  Brian P. Hohl ,  Holly Noelle Moschiano ,  Biswa P. Das ,  Afsar Ali ,  Sourabh Biswas ,  Gary Freitag ,  David Dianetti ,  Ho-Chul Yun ,  Thomas Marzano

IPC: H01M50/10 ,  H01M50/116 ,  H01M50/147 ,  H01M50/155 ,  H01M50/169 ,  H01M50/186 ,  H01M50/191 ,  H01M50/543 ,  H01M4/131 ,  H01M10/0525

Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both of ceramic casing halves. A thin film metallization, such as of titanium, contacts an edge periphery of each ceramic casing half. The first ceramic casing half is moved into registry with the second ceramic casing half so that the first and second ring-shaped metallizations contact each other. Then, a laser welds through one of the casing halves being a substantially transparent ceramic, for example sapphire, to braze the first and second ring-shaped metallizations to each other to thereby join the first and second casing halves together to form a casing housing the electrode assembly. A solid electrolyte (LixPOyNz) activates the electrode assembly.

公开(公告)号：US11344734B2

公开(公告)日：2022-05-31

申请号：US16589752

申请日：2019-10-01

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/40 ,  H01G4/005 ,  A61N1/08 ,  H01R43/00 ,  C22C29/12 ,  H02G3/22 ,  H01G4/30 ,  B23K35/30 ,  H01G2/10 ,  H01G4/35 ,  H01R13/52 ,  H01G4/236 ,  B23K35/32 ,  H01R4/02 ,  H01R13/719 ,  B23K35/02 ,  A61N1/05 ,  H01G4/12 ,  A61N1/372 ,  B22F7/08 ,  B22F1/10

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.

公开(公告)号：US20210154483A1

公开(公告)日：2021-05-27

申请号：US17165500

申请日：2021-02-02

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Brian P. Hohl ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/35 ,  H01G4/236 ,  H01G4/008 ,  H01G4/12

Abstract: A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.

公开(公告)号：US10857368B2

公开(公告)日：2020-12-08

申请号：US15936495

申请日：2018-03-27

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Xiaohong Tang ,  William C. Thiebolt ,  Jonathan Calamel ,  Thomas Shi ,  Thomas Marzano

IPC: A61N1/375 ,  H05K5/00 ,  H05K1/03 ,  H05K3/00 ,  H01L23/15 ,  C03C8/14 ,  H01L23/00 ,  H01L23/10

Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

公开(公告)号：US10770698B1

公开(公告)日：2020-09-08

申请号：US16003868

申请日：2018-06-08

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Brian P. Hohl ,  Todd C. Sutay ,  Gary Freitag

IPC: H01M2/06 ,  H01M2/08 ,  H01M2/02

Abstract: A miniature electrochemical cell having a volume of less than 0.5 cc is described. The cell has a casing of first and second ceramic substrates that are hermetically secured to each other to provide an internal space housing an electrode assembly. First and second conductive pathways extend through the ceramic substrates. The pathways have respective inner surfaces that are conductively connected to the respective anode and cathode current collectors and respective outer surfaces that provide for connection to a load. An electrolyte in the internal space of the housing activates the electrode assembly.

公开(公告)号：US10420949B2

公开(公告)日：2019-09-24

申请号：US16101639

申请日：2018-08-13

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/375 ,  A61N1/05 ,  H01G4/40 ,  B23K35/30 ,  A61N1/08 ,  H01R43/00 ,  H01G4/35 ,  C22C29/12 ,  H01G4/12 ,  H01G2/10 ,  H01G4/005 ,  H02G3/22 ,  H01G4/30 ,  A61N1/372

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.

公开(公告)号：US20190244729A1

公开(公告)日：2019-08-08

申请号：US16362862

申请日：2019-03-25

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: H01B17/30 ,  B23K1/00 ,  H01B19/02 ,  B23K1/008 ,  B23K1/19 ,  B23K26/32 ,  A61N1/375 ,  C04B41/00 ,  C04B41/51 ,  C04B41/88 ,  C04B41/45 ,  B23K26/21

CPC classification number: H01B17/30 ,  A61N1/3754 ,  B22F7/04 ,  B22F7/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K26/21 ,  B23K26/32 ,  B23K2101/36 ,  B23K2103/14 ,  C04B41/0072 ,  C04B41/4578 ,  C04B41/5122 ,  C04B41/5177 ,  C04B41/5194 ,  C04B41/88 ,  H01B19/02

Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

公开(公告)号：US10249415B2

公开(公告)日：2019-04-02

申请号：US15863194

申请日：2018-01-05

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/37 ,  B23K1/00 ,  B23K35/00 ,  C04B41/45 ,  H01B17/30 ,  A61N1/375 ,  C04B41/51 ,  C04B41/88 ,  H01B19/02 ,  C04B41/00 ,  B23K1/008 ,  B23K1/19 ,  B23K26/32 ,  B23K26/21 ,  B22F7/04 ,  B23K101/36 ,  B23K103/14

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.