公开(公告)号：US20150295349A1

公开(公告)日：2015-10-15

申请号：US14747582

申请日：2015-06-23

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Michael F. Scalise

IPC: H01R13/52 ,  A61N1/375 ,  H01R43/00 ,  H01R43/20 ,  H01G4/35

CPC classification number: A61N1/3754 ,  H01G4/35 ,  H01R13/426 ,  H01R13/521 ,  H01R13/5224 ,  H01R13/719 ,  Y10T29/49204

Abstract: A feedthrough filter capacitor assembly comprising a terminal pin connector is described. The terminal pin connector is designed to facilitate an electrical connection between the terminal pin comprising a multitude of compositions to a circuit board of an implantable medical device. The terminal pin connector comprises a clip portion positioned within a connector housing. The connector clip mechanically attaches to the terminal pin of the feedthrough with at least one prong and an exterior surface of the connector housing electrically contacts the circuit board, creating an electrical connection therebetween. The connector housing comprises a material that is conducive to a weld or solder attachment process to the circuit board. The feedthrough filter capacitor assembly is particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract translation: 描述了包括端子引脚连接器的馈通滤波电容器组件。 端子针连接器被设计成便于在包括可植入医疗装置的电路板的多种成分的端子销之间的电连接。 端子针连接器包括定位在连接器壳体内的夹子部分。 连接器夹子机械地附接到馈通的端子销，其中至少一个插脚和连接器壳体的外表面电接触电路板，从而在它们之间形成电连接。 连接器壳体包括有助于对电路板的焊接或焊接附着过程的材料。 馈通滤波电容器组件特别可用于结合到诸如心脏起搏器，心律转复除颤器等的可植入医疗装置中，以使医疗装置的内部电子部件脱离和屏蔽不受不利的电磁干扰（EMI）信号的影响。

公开(公告)号：US20150217111A1

公开(公告)日：2015-08-06

申请号：US14688302

申请日：2015-04-16

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Robert Shawn Johnson ,  Warren S. Dabney ,  Thomas Marzano ,  Richard L. Brendel ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Keith W. Seitz ,  John E. Roberts

IPC: A61N1/08 ,  A61N1/375

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3754 ,  A61N1/3758 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H03H1/0007

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

Abstract translation: AIMD包括导电壳体，具有绝缘体的导电套圈密封密封套圈开口。 导电通路密封并通过绝缘体设置。 滤波电容器设置在壳体内并且具有支撑交替插入的至少两个有源和两个接地电极板的电介质体，其中所述至少两个有源电极板电连接到装置侧的导电路径，并且所述至少两个 接地电极板电耦合到套圈和/或导电壳体。 电介质体的介电常数小于1000，电容为10至20,000皮​​法。 滤波电容器被配置为通过低ESR对MRI高RF脉冲功率进行EMI滤波，其中以RF射频脉冲频率或频率范围的滤波电容器的ESR小于2.0欧姆。

公开(公告)号：US20140168917A1

公开(公告)日：2014-06-19

申请号：US14187295

申请日：2014-02-23

Applicant: GREATBATCH LTD.

Inventor： Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel

IPC: H01G4/35 ,  H03H7/00

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G2/02 ,  H01G2/10 ,  H01G4/40 ,  H01R13/5224 ,  H01R13/7195 ,  H01R2201/12 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition.

Abstract translation: 密封的滤波馈通包括设置在器件侧的电路板上的片状电容器。 第一低阻抗电连接在电容器第一端金属化和通过绝缘体设置的导体之间。 第二低阻抗电连接在电容器第二端金属化和套圈或壳体之间。 第二低阻抗电连接可以包括形成绝缘体和套圈或外壳之间的气密密封的氧化物电阻连接以及与第二端金属化之间的电连接，并直接连接到耐氧化电连接。 或者，第二低阻抗电连接可以包括直接连接到套圈或外壳上的耐氧化金属添加剂，以及在第二端金属化之间和与第二端金属化部分之间的电连接，并直接与氧化物抵抗的金属添加物连接。

公开(公告)号：US20140168850A1

公开(公告)日：2014-06-19

申请号：US14187297

申请日：2014-02-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel ,  Robert S. Johnson ,  Dominick J. Frustaci ,  Warren S. Dabney ,  Keith W. Seitz ,  Thomas Marzano ,  John E. Roberts ,  William C. Thiebolt ,  Christopher M. Williams ,  Buehl E. Truex

IPC: H01G4/35

CPC classification number: A61N1/08 ,  A61N1/05 ,  A61N1/3718 ,  A61N1/3754 ,  H01G4/35 ,  H03H1/0007

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮​​法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。

公开(公告)号：US20140161973A1

公开(公告)日：2014-06-12

申请号：US14182569

申请日：2014-02-18

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: H01R43/00

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

公开(公告)号：US08653384B2

公开(公告)日：2014-02-18

申请号：US13743254

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Ricahrd L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: H02G3/18 ,  A61N1/05

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基片从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。