公开(公告)号：US07000467B2

公开(公告)日：2006-02-21

申请号：US10736947

申请日：2003-12-16

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

IPC分类号： G01F23/00

CPC分类号： H05K7/2079 ,  G01F1/007 ,  G01F23/18 ,  G01F23/74 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201

摘要： Method, system and program product are provided for monitoring coolant within a cooling system designed to provide system coolant to one or more electronics subsystems. The monitoring technique includes employing at least one pressure transducer to obtain multiple pressure measurements related to an amount of coolant within an expansion tank of the cooling system, and determining a rate of volume change of coolant within the expansion tank employing the multiple pressure measurements. Successive pressure measurements can be taken at a known time interval to determine the rate of volume change of coolant within the expansion tank. An automatic determination can also be made on the immediacy of action to be taken for service of the cooling system based on the rate of volume change of coolant within the expansion tank.

摘要翻译： 提供了方法，系统和程序产品，用于在冷却系统内监测冷却系统，该冷却系统被设计成向一个或多个电子子系统提供系统冷却剂。 监测技术包括采用至少一个压力传感器以获得与冷却系统的膨胀箱内的冷却剂量相关的多个压力测量，以及使用多个压力测量来确定膨胀罐内的冷却剂的体积变化率。 可以在已知的时间间隔进行连续压力测量，以确定膨胀罐内冷却剂的体积变化率。 还可以基于膨胀箱内的冷却剂的体积变化率，对冷却系统的服务的即时性进行自动确定。

公开(公告)号：US06819563B1

公开(公告)日：2004-11-16

申请号：US10612355

申请日：2003-07-02

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K720

CPC分类号： H05K7/20736 ,  G11B33/1406 ,  H05K7/20727 ,  H05K7/20772

摘要： Augmenting air cooling of electronics systems using a cooling fluid to cool air entering the electronics system, and to remove a portion of the heat dissipated by the electronics. A cooled electronics system includes a frame, electronics drawers, fans or air moving devices, and an inlet heat exchanger. A cooling fluid such as chilled water is supplied to the inlet heat exchanger, to cool incoming air below ambient temperature. Fans cause ambient air to enter the system, flow through the inlet heat exchanger, through electronic devices, and exit the system. An optional exhaust heat exchanger further transfers heat dissipated by electronic devices to the cooling fluid. Heat exchangers are pivotally mounted, providing drawer access. Segmented heat exchangers provide access to individual drawers. Heat exchangers are integrated into cover assemblies. Airflow guides such as louvers are provided at inlets and outlets. Cover assemblies provide a degree of acoustic and electromagnetic shielding.

摘要翻译： 使用冷却流体增强电子系统的空气冷却，以冷却进入电子系统的空气，以及去除由电子设备消散的部分热量。 冷却的电子系统包括框架，电子抽屉，风扇或空气移动装置以及入口热交换器。 冷却流体如冷冻水被供应到入口热交换器，以将进入的空气冷却到低于环境温度。 风扇会导致环境空气进入系统，流经入口热交换器，通过电子设备，并退出系统。 可选的排气热交换器进一步将由电子设备耗散的热量传递给冷却流体。 热交换器枢转安装，提供抽屉通道。 分段热交换器提供对各个抽屉的访问。 热交换器集成到盖组件中。 入口和出口设有气流导板，如百叶窗。 盖组件提供一定程度的声和电磁屏蔽。

公开(公告)号：US07088585B2

公开(公告)日：2006-08-08

申请号：US10726377

申请日：2003-12-03

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Takeshi Tsukamoto

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Takeshi Tsukamoto

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： A cooling system is provided employing at least two modular cooling units (MCUs). Each MCU is capable of providing system coolant to multiple electronics subsystems to be cooled, and each includes a heat exchanger, a first cooling loop with at least one control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof through the heat exchanger, with the portion being controlled by the at least one control valve. The second cooling loop provides cooled system coolant to the multiple electronics subsystems, and expels heat in the heat exchanger from the multiple electronics subsystems to the chilled facility coolant in the first cooling loop. The at least one control valve allows regulation of facility coolant flow through the heat exchanger, thereby allowing control of temperature of system coolant in the second cooling loop.

摘要翻译： 提供采用至少两个模块化冷却单元（MCU）的冷却系统。 每个MCU能够将系统冷却剂提供给要冷却的多个电子子系统，并且每个MCU包括热交换器，具有至少一个控制阀的第一冷却回路和第二冷却回路。 第一冷却回路从源接收冷却设备冷却剂，并使其至少一部分通过热交换器，该部分由至少一个控制阀控制。 第二冷却回路将冷却的系统冷却剂提供给多个电子子系统，并将热交换器中的热量从多个电子系统子系统排出到第一冷却回路中的冷却设备冷却剂。 至少一个控制阀允许调节通过热交换器的设备冷却剂流，从而允许控制第二冷却回路中系统冷却剂的温度。

公开(公告)号：US06967841B1

公开(公告)日：2005-11-22

申请号：US10841748

申请日：2004-05-07

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  H05K7/20809

摘要： A cooling apparatus for electronic drawers utilizing a passive fluid cooling loop in conjunction with an air cooled drawer cover. The air cooled cover provides an increased surface area from which to transfer heat to cooling air flowing through the drawer. The increased cooling surface uses available space within the drawer, which may be other than immediately adjacent to a high power device within the drawer. The passive fluid cooling loop provides heat transfer from the high power device to the air cooled cover assembly, allowing placement of the air cooled cover assembly other than immediately adjacent to the high power device. The cooling apparatus is easily disengaged from the electronics drawer, providing access to devices within the drawer.

摘要翻译： 一种用于电子抽屉的冷却装置，其利用被动流体冷却回路与空气冷却的抽屉盖结合。 空气冷却盖提供了增加的表面积，从而将热量传递到流过抽屉的冷却空气。 增加的冷却表面使用抽屉内的可用空间，其可以不是紧邻抽屉内的大功率设备。 被动流体冷却回路提供从高功率设备到空气冷却盖组件的热传递，允许空气冷却盖组件的布置而不是紧邻大功率设备。 冷却装置容易从电子抽屉中脱离，提供对抽屉内的装置的通路。

公开(公告)号：US06924981B2

公开(公告)日：2005-08-02

申请号：US10812694

申请日：2004-03-30

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Edward Furey ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Edward Furey ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20754

摘要： An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.

摘要翻译： 机壳设备提供机架安装的堆叠式电子部件的组合的空气和液体冷却。 热交换器安装在堆叠的电子设备的侧面上，空气在壳体内侧向流动，由安装在电子设备后面的气动装置推动。 辅助气动装置可以安装在外壳内以增加气流。 在替代实施例中，空气到液体的热交换器跨过外壳的前部和后部设置，并且封闭的空气流动回路由会聚的供气室，电子抽屉产生，空气通过空气移动装置引导， 发散的回风室，底部有一个连接管。 在该实施例的变型中，连接管道位于顶部和底部，并且供应和返回管道分别是双收敛和双重发散的。 可以添加辅助鼓风机以增加总系统空气流量。 外壳还可以设置有自动打开的通气面板，以允许室内空气在过温情况下循环和冷却。 外壳的设计允许其与机架安装的设备分开构造，并且如果需要，则在机架先前已经操作的设施处随后附接到机架上。

公开(公告)号：US06714412B1

公开(公告)日：2004-03-30

申请号：US10243708

申请日：2002-09-13

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K720

CPC分类号： H05K7/2079 ,  Y10T83/8763 ,  Y10T83/8822

摘要： A scalable coolant conditioning unit (SCCU) is designed to accommodate removable modular pumping units (MPU's). The MPU's may comprise one or a plurality of pump/pump motor combinations. The MPU's are connected to coolant supply and discharge mechanisms by an insertion facilitation mechanism comprising an automatic coupling assembly and an isolation valve mechanism and are placed into and removed from the SCCU body with the aid of a seating mechanism. MPU's are added to an operating SCCU as needed to support increased heat loads of electronics frames. A plate heat exchanger is physically integrated within the expansion tank, reducing volumetric requirements for the SCCU and is sized to accommodate the maximum heat load.

摘要翻译： 可扩展的冷却液调节单元（SCCU）设计用于容纳可移动模块化抽油机（MPU）。 MPU可以包括一个或多个泵/泵电机组合。 MPU通过包括自动联接组件和隔离阀机构的插入促进机构连接到冷却剂供应和排出机构，并且借助于就座机构放置到SCCU主体中并从SCCU主体移除。 根据需要将MPU添加到操作的SCCU以支持电子框架的增加的热负荷。 板式换热器物理上集成在膨胀箱内，减少了SCCU的体积要求，其尺寸适应最大的热负荷。

公开(公告)号：US07830657B2

公开(公告)日：2010-11-09

申请号：US12131301

申请日：2008-06-02

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： An apparatus is provided for facilitating cooling of an electronics rack. The apparatus includes a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and second perforated planar surfaces covering first and second main sides, respectively, of the air-to-liquid heat exchanger. The heat exchanger is supported by the support frame and includes inlet and outlet plenums disposed adjacent to the edge of the outlet door cover hingedly mounted to the rack. Each plenum is in fluid communication with a respective connect coupling, and the heat exchanger further includes multiple horizontally-oriented heat exchange tube sections each having serpentine cooling channel with an inlet and an outlet coupled to the inlet plenum and outlet plenum, respectively. Fins extend from the heat exchange tube sections.

摘要翻译： 提供了一种用于促进电子机架的冷却的装置。 该装置包括安装到铰链地固定到机架的空气出口侧的出口门盖的热交换组件。 热交换组件包括支撑框架，空气 - 液体热交换器和分别覆盖空气 - 液体热交换器的第一和第二主侧的第一和第二穿孔平面。 热交换器由支撑框架支撑并且包括邻近出口门盖的边缘设置的入口和出口增压室，其铰接地安装到机架。 每个压力室与相应的连接联接件流体连通，并且热交换器还包括多个水平定向的热交换管部分，每个热交换管部分具有蛇形冷却通道，分别具有连接到入口压力室和出口增压室的入口和出口。 翅片从热交换管段延伸。

公开(公告)号：US07385810B2

公开(公告)日：2008-06-10

申请号：US11108306

申请日：2005-04-18

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and second perforated planar surfaces covering first and second main sides, respectively, of the air-to-liquid heat exchanger. The heat exchanger is supported by the support frame and includes inlet and outlet plenums disposed adjacent to the edge of the outlet door cover hingedly mounted to the rack. Each plenum is in fluid communication with a respective connect coupling, and the heat exchanger further includes multiple horizontally-oriented heat exchange tube sections each having serpentine cooling channel with an inlet and an outlet coupled to the inlet plenum and outlet plenum, respectively. Fins extend from the heat exchange tube sections.

摘要翻译： 提供了一种装置和方法，用于促进电子机架的冷却，所述电子机架采用安装在铰链地固定到机架的空气出口侧的出口门盖的热交换组件。 热交换组件包括支撑框架，空气 - 液体热交换器和分别覆盖空气 - 液体热交换器的第一和第二主侧的第一和第二穿孔平面。 热交换器由支撑框架支撑并且包括邻近出口门盖的边缘设置的入口和出口增压室，其铰接地安装到机架。 每个气室与相应的连接联接件流体连通，并且热交换器还包括多个水平定向的热交换管段，每个管路具有蛇形冷却通道，分别具有连接到入口压力室和出口增压室的入口和出口。 翅片从热交换管段延伸。

公开(公告)号：US07270174B2

公开(公告)日：2007-09-18

申请号：US10736944

申请日：2003-12-16

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

IPC分类号： G05D23/00 ,  G01M3/04

CPC分类号： H05K7/2079

摘要： Method, system and program product are provided for facilitating operation of a cooling system designed to provide system coolant to one or more electronics subsystems of a computing environment. The technique includes automatically checking at least one coolant loop of the cooling system for a leak. The automatically checking includes isolating the at least one coolant loop from coolant flow through the cooling system and checking for drop in coolant pressure within the at least one coolant loop. Upon detection of a drop in coolant pressure, isolation of the coolant loop is retained thereby allowing operation of the cooling system to continue notwithstanding detection of a leak in the at least one coolant loop.

摘要翻译： 提供了方法，系统和程序产品，以便于设计用于向计算环境的一个或多个电子子系统提供系统冷却剂的冷却系统的操作。 该技术包括自动检查冷却系统的至少一个冷却剂回路以进行泄漏。 自动检查包括将至少一个冷却剂回路与通过冷却系统的冷却剂流隔离并检查至少一个冷却剂回路内的冷却剂压力的下降。 在检测到冷却剂压力下降时，保持冷却剂回路的隔离，由此即使检测到至少一个冷却剂回路中的泄漏，冷却系统也能继续运行。

公开(公告)号：US07104081B2

公开(公告)日：2006-09-12

申请号：US10812732

申请日：2004-03-30

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： H05K7/20609 ,  F24F13/222 ,  H05K5/0213 ,  H05K7/20736

摘要： System and method are provided for removing condensate from an air-to-liquid heat exchanger of a combined air/liquid enclosed apparatus for cooling rack-mounted electronic equipment. The condensate removal system includes a condensate collector for collecting liquid condensate from the air-to-liquid heat exchanger, and a vaporizing chamber in fluid communication with the condensate collector for receiving collected liquid therefrom. An actively controlled vaporizer vaporizes collected liquid within the vaporizing chamber and a vapor exhaust is in communication with the vaporizing chamber for venting vapor from the vaporizing chamber outside the cabinet containing the combined air/liquid cooling apparatus and rack-mounted electronic equipment.

摘要翻译： 提供了系统和方法，用于从用于冷却机架安装的电子设备的组合的空气/液体封闭装置的空气 - 液体热交换器中去除冷凝物。 冷凝水去除系统包括用于从空气 - 液体热交换器收集液体冷凝物的冷凝收集器，以及与冷凝水收集器流体连通的蒸发室，用于从其收集收集的液体。 主动控制的蒸发器蒸发蒸发室内的收集液体，并且蒸汽排气与蒸发室连通，用于从包含组合的空气/液体冷却装置和机架安装的电子设备的机柜外部的蒸发室排出蒸气。