Protese-activated receptor PAR4 (ZCHEMR2)
    82.
    发明授权
    Protese-activated receptor PAR4 (ZCHEMR2) 失效
    Protese激活受体PAR4(ZCHEMR2)

    公开(公告)号:US6111075A

    公开(公告)日:2000-08-29

    申请号:US53866

    申请日:1998-04-01

    CPC分类号: C07K14/705 A61K38/00

    摘要: The present invention relates to polynucleotide and polypeptide molecules for PAR4, a novel member of the protease-activated receptor family. The polypeptides, and polynucleotides encoding them, mediate biological responses and/or cellular signaling in response to proteases. Protease cleavage of PAR4 exposes a PAR4 extracellular amino terminal portion that serves as a ligand for the PAR4 receptor. PAR4 may be used as a target in drug screening, and further used to identify proteinaceous or non-proteinaceous PAR4 agonists and antagonists. The present invention also includes antibodies to the PAR4 polypeptides.

    摘要翻译: 本发明涉及用于PAR4(蛋白酶活化受体家族的新成员)的多核苷酸和多肽分子。 多肽和编码它们的多核苷酸介导响应于蛋白酶的生物反应和/或细胞信号传导。 PAR4的蛋白酶切割暴露了作为PAR4受体配体的PAR4细胞外氨基末端部分。 PAR4可用作药物筛选中的靶标,并进一步用于鉴定蛋白质或非蛋白质PAR4激动剂和拮抗剂。 本发明还包括对PAR4多肽的抗体。

    Hematopoietic cytokine receptor
    84.
    发明授权
    Hematopoietic cytokine receptor 失效
    造血细胞因子受体

    公开(公告)号:US5925735A

    公开(公告)日:1999-07-20

    申请号:US73594

    申请日:1998-05-06

    摘要: Novel receptor polypeptides, polynucleotides encoding the polypeptides, and related compositions and methods are disclosed. The polypeptides comprise an extracellular ligand-binding domain of a cell-surface receptor that is expressed at high levels in lymphoid tissue, including B-cells and T-cells. The polypeptides may be used within methods for detecting ligands that stimulate the proliferation and/or development of lymphoid and myeloid cells in vitro and in vivo. Ligand-binding receptor polypeptides can also be used to block ligand activity in vitro and in vivo.

    摘要翻译: 公开了新型受体多肽,编码多肽的多核苷酸,以及相关组合物和方法。 多肽包含细胞表面受体的细胞外配体结合结构域,其在淋巴组织(包括B细胞和T细胞)中以高水平表达。 多肽可用于检测在体外和体内刺激淋巴样和骨髓细胞的增殖和/或发育的配体的方法。 配体结合受体多肽也可用于在体外和体内阻断配体活性。

    Apparatus and method for removing meltable material from a substrate
    87.
    发明授权
    Apparatus and method for removing meltable material from a substrate 失效
    从基材中除去可熔材料的装置和方法

    公开(公告)号:US5620132A

    公开(公告)日:1997-04-15

    申请号:US461960

    申请日:1995-06-05

    IPC分类号: B23K1/018 H01L21/44

    CPC分类号: B23K1/018 B23K2201/36

    摘要: The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.

    摘要翻译: 本发明一般涉及一种用于从固体材料中除去固体材料和液体材料的新装置和方法,所述固体材料和液体材料可以含有来自基底的固体材料。 更具体地说,本发明包括一种用于去除熔融焊料的装置和方法,该装置和方法可以使用独特的刮板从基板上包含固体颗粒和焊球或者列。 此外,公开了一种使用其上具有粘合剂的衬垫从衬底去除焊球或柱的方法。