公开(公告)号：US20080251719A1

公开(公告)日：2008-10-16

申请号：US12016290

申请日：2008-01-18

申请人： Kenji Nakahira ,  Toshifumi Honda ,  Atsushi Miyamoto

发明人： Kenji Nakahira ,  Toshifumi Honda ,  Atsushi Miyamoto

IPC分类号： G01N23/00

CPC分类号： G01N23/225 ,  G01N2223/401

摘要： In the case where a specimen is imaged by a scanning electron microscope, it is intended to acquire an image of a high quality having a noise component reduced, thereby to improve the precision of an image processing. The intensity distribution of a beam is calculated on the basis of an imaging condition or specimen information, and an image restoration is performed by using a resolving power deterioration factor other than the beam intensity distribution as a target of a deterioration mode, so that a high resolving power image can be acquired under various conditions. In the scanning electron microscope for semiconductor inspections and semiconductor measurements, the restored image is used for pattern size measurement, defect detections, defect classifications and so on, so that the measurements can be improved in precision and so that the defect detections and classifications can be made high precise.

摘要翻译： 在通过扫描电子显微镜对样本进行成像的情况下，旨在获取具有降低噪声成分的高质量图像，从而提高图像处理的精度。 基于成像条件或样本信息计算光束的强度分布，并且通过使用除了光束强度分布之外的分辨率劣化因子作为劣化模式的目标来执行图像恢复，使得高 可以在各种条件下获得分辨率的图像。 在用于半导体检查和半导体测量的扫描电子显微镜中，恢复的图像用于图案尺寸测量，缺陷检测，缺陷分类等，从而可以提高测量精度，从而可以使缺陷检测和分类 做出高精度。

公开(公告)号：US20080067371A1

公开(公告)日：2008-03-20

申请号：US11747253

申请日：2007-05-11

申请人： Masaki Kurihara ,  Toshifumi Honda ,  Ryo Nakagaki

发明人： Masaki Kurihara ,  Toshifumi Honda ,  Ryo Nakagaki

IPC分类号： G01N23/00

CPC分类号： G01N21/9501 ,  G01N2223/053 ,  G01N2223/6116

摘要： In order to achieve high throughput in a SEM-type defect-reviewing apparatus and method for automatically acquiring images of review defects present on samples, including: a cell comparison step subdivided into the steps of (a) providing a defect detection success ratio or defect detection success map due to at least a cell comparison scheme for each wafer or each chip, (b) selecting a review sequence of either the cell comparison scheme or a die comparison scheme on the basis of the provided defect detection success ratio or defect detection success map, (c) if the cell comparison scheme is selected, judging whether detection of the review defect is possible by executing the cell comparison scheme; and a die comparison step in which die comparison is performed if the judgment result indicates that the detection of the review defect is impossible, or if the die comparison scheme is selected in the selection step.

摘要翻译： 为了在SEM型缺陷检查装置中实现高通量，以及用于自动获取样品上存在的检查缺陷的图像的方法，包括：细胞比较步骤，其细分为以下步骤：（a）提供缺陷检测成功率或缺陷 检测成功图由于至少每个晶片或每个芯片的单元比较方案，（b）基于提供的缺陷检测成功率或缺陷检测成功来选择单元比较方案或管芯比较方案的检查序列 映射，（c）如果选择了小区比较方案，则通过执行小区比较方案判断检查缺陷的检测是否可能; 以及如果判断结果指示检查缺陷的检测不可能执行管芯比较，或者在选择步骤中选择管芯比较方案的管芯比较步骤。

公开(公告)号：US20060289752A1

公开(公告)日：2006-12-28

申请号：US11415286

申请日：2006-05-02

申请人： Munenori Fukunishi ,  Toshifumi Honda ,  Yuuji Takagi

发明人： Munenori Fukunishi ,  Toshifumi Honda ,  Yuuji Takagi

IPC分类号： G21K7/00

CPC分类号： H01J37/28 ,  H01J2237/2817

摘要： The present invention relates to high-speed acquisition of both a perpendicular observation image and a tilt observation image, in observation using a scanning electron microscope. An electron-beam observation apparatus includes: a first electro-optical system which scans a converged electron beam from a substantially perpendicular direction to a defect on a target wafer to be observed, and acquires a defect image signal with perpendicular observation by detecting a secondary electron image or a reflected electron image generated from the defect; and a second electro-optical system which scans a converged electron beam from a tilt direction to the defect, and acquires a defect image signal with tilt observation by detecting a secondary electron image or a reflected electron image generated from the defect.

公开(公告)号：US20060108525A1

公开(公告)日：2006-05-25

申请号：US11268568

申请日：2005-11-08

申请人： Ryo Nakagaki ,  Toshifumi Honda

发明人： Ryo Nakagaki ,  Toshifumi Honda

IPC分类号： G21K7/00

CPC分类号： H01J37/222 ,  G03F7/7065 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/24592 ,  H01J2237/2817

摘要： A scanning electron microscope has an electron source for illuminating a primary electron beam on a specimen wafer, an accelerating electrode, a condenser lens, a deflector, an objective lens, a detector for acquiring a digital image by sampling a signal of emissive electrons generated from the specimen wafer, a digitizing means, an image memory for storing, displaying or processing the acquired digital image, an input/output unit, an image creation unit and an image processor. The scanning electron microscope is provided with a sampling unit for sampling the emissive electron signal at intervals each smaller than the pixel size of the digital image to be stored, displayed or processed and an image creation process means for enlarging the pixel size on the basis of the sampled emissive electron signal to create a digital image.

摘要翻译： 扫描电子显微镜具有用于照射样品晶片上的一次电子束的电子源，加速电极，聚光透镜，偏转器，物镜，用于通过对从...产生的发射电子的信号进行采样来获取数字图像的检测器 样本晶片，数字化装置，用于存储，显示或处理所获取的数字图像的图像存储器，输入/输出单元，图像创建单元和图像处理器。 该扫描电子显微镜设置有采样单元，用于以比要存储，显示或处理的数字图像的像素大小更小的间隔对发射电子信号进行采样，以及图像创建处理装置，用于基于 采样发射电子信号以产生数字图像。

公开(公告)号：US20050087686A1

公开(公告)日：2005-04-28

申请号：US10954421

申请日：2004-10-01

申请人： Toshifumi Honda ,  Toshiro Kubo

发明人： Toshifumi Honda ,  Toshiro Kubo

IPC分类号： G01N23/225 ,  G06T1/00 ,  G21K7/00 ,  H01J37/20 ,  H01L21/66 ,  G01N23/00

CPC分类号： G01N23/2251 ,  H01J2237/2814 ,  H01J2237/2815 ,  H01J2237/2817

摘要： This invention provides a technique for observing defects, which can automatically decide a direction from inclined observation and take an inclined review image. In a defect observing system for detecting the defects and thereafter observing images of the defects from various directions in detail, positions of inclined images to be taken are automatically displayed on a display screen from a planar image (top-down image) of a SEM using CAD data, and the defects are selected from the images displayed on the display screen based on specification by a user, an inclined angle and direction are determined per selected image to take an inclined image (beam-tilt image), and the inclined image of each defect is acquired.

摘要翻译： 本发明提供了一种用于观察缺陷的技术，其可以自动地确定倾斜观察的方向并采取倾斜的审查图像。 在用于检测缺陷的缺陷观察系统中，然后详细地从各个方向观察缺陷的图像，将要采用的倾斜图像的位置从SEM的平面图像（自顶向下图像）自动显示在显示屏上，使用 CAD数据，并且根据用户的指定从显示屏上显示的图像中选择缺陷，根据所选图像确定倾斜角度和方向以获取倾斜图像（波束倾斜图像），并且倾斜图像 每个缺陷获得。

公开(公告)号：US06553323B1

公开(公告)日：2003-04-22

申请号：US09661182

申请日：2000-09-13

申请人： Kenji Obara ,  Yuji Takagi ,  Toshifumi Honda ,  Ryo Nakagaki ,  Toshiei Kurosaki ,  Yasuhiko Ozawa

发明人： Kenji Obara ,  Yuji Takagi ,  Toshifumi Honda ,  Ryo Nakagaki ,  Toshiei Kurosaki ,  Yasuhiko Ozawa

IPC分类号： G01B528

CPC分类号： H01L22/20 ,  G01N21/88 ,  G01N2021/8861

摘要： The present invention improves inspection efficiency in detailed inspections of defects performed based on inspection information from a defect inspection. Particles and defects are detected by a defect inspection device 1. If the cause of the particles and defects are to be determined by performing a detailed inspection with a details inspection device 3 using an SEM or the like, attributes are determined on the particles and defects detected by the defects inspection device 1 before the detailed inspection is performed. The attributes are determined with an attribute inspection device using an optical microscope or the like. Based on these attributes, the defects and particles are separated into those that require detailed inspection and those that do not require detailed inspection or that cannot be inspected in detail. A details inspection device 3 is used to inspect the particles and defects requiring detailed inspection.

摘要翻译： 本发明基于来自缺陷检查的检查信息进行的缺陷的详细检查，提高了检查效率。 通过缺陷检查装置1检测颗粒和缺陷。如果通过使用SEM等的细节检查装置3进行详细检查来确定颗粒和缺陷的原因，则根据颗粒和缺陷确定属性 在执行详细检查之前由缺陷检查装置1检测到。 属性由使用光学显微镜等的属性检查装置确定。 基于这些属性，缺陷和颗粒被分成需要详细检查的那些和不需要详细检查或者不能被详细检查的那些。 细节检查装置3用于检查需要详细检查的颗粒和缺陷。

公开(公告)号：US06333992B1

公开(公告)日：2001-12-25

申请号：US08967015

申请日：1997-11-10

申请人： Hisae Yamamura ,  Yukio Matsuyama ,  Toshifumi Honda ,  Ludwig Listl

发明人： Hisae Yamamura ,  Yukio Matsuyama ,  Toshifumi Honda ,  Ludwig Listl

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956

摘要： A defect judgement processing method and apparatus which can optimize image processing and defect judgement parameters for a detection image cut out by each inspection window to avoid erroneous judgement and defect missing and to realize reliable defect judgement. An image data generator cuts out ranges indicated by a plurality of predesignated inspection windows from a detected image and stores them in a memory, a window data generator generates window data having inspection conditions attached thereto with respect to the plurality of inspection windows and stores them in the memory, a feature extractor reads out detection images of the ranges indicated by the inspection windows from the memory and extracts a structural feature parameter therefrom on the basis of an image processing parameter conforming to the inspection condition obtained by the window data, and a defect judger performs its defect judging operation over the extracted structural feature parameter on the basis of a defect judgement parameter conforming to the inspection condition.

摘要翻译： 一种缺陷判断处理方法和装置，其可以优化每个检查窗口切出的检测图像的图像处理和缺陷判断参数，以避免错误判断和缺陷缺失，并实现可靠的缺陷判断。 图像数据发生器从检测到的图像中切出由多个预先指定的检查窗口指示的范围并将其存储在存储器中，窗口数据生成器生成具有关于多个检查窗口附加到其上的检查条件的窗口数据，并将它们存储在 存储器中，特征提取器基于从窗口数据获得的检查条件的图像处理参数，从存储器读出由检查窗口指示的范围的检测图像，并从其提取结构特征参数，并且缺陷 基于符合检查条件的缺陷判断参数，判断器对提取的结构特征参数执行缺陷判断操作。

公开(公告)号：US20120128233A1

公开(公告)日：2012-05-24

申请号：US13362181

申请日：2012-01-31

申请人： Ryo NAKAGAKI ,  Masaki Kurihara ,  Toshifumi Honda

发明人： Ryo NAKAGAKI ,  Masaki Kurihara ,  Toshifumi Honda

IPC分类号： G06K9/00

CPC分类号： G06T7/0006 ,  G06K9/6256 ,  G06T7/0004 ,  G06T7/001 ,  G06T2207/10056 ,  G06T2207/10061 ,  G06T2207/30148

摘要： In apparatuses for automatically acquiring and also for automatically classifying images of defects present on a sample such as a semiconductor wafer, a classifying system is provided which are capable of readily accepting even such a case that a large number of classification classes are produced based upon a request issued by a user, and also even such a case that a basis of the classification class is changed in a high frequency. When the user defines the classification classes, a device for designating attributes owned by the respective classification classes is provided. The classifying system automatically changes a connecting mode between an internally-provided rule-based classifier and an example-based classifier, so that such a classifying system which is fitted to the classification basis of the user is automatically constructed.

摘要翻译： 在用于自动获取并且还自动分类诸如半导体晶片的样本上存在的缺陷的图像的设备中，提供了能够容易地接受甚至基于以下情况产生大量分类等级的情况的分类系统 由用户发出的请求，甚至是分类等级的基础被高频地改变的情况。 当用户定义分类类时，提供用于指定由各个分级类所拥有的属性的设备。 分类系统自动地在内部提供的基于规则的分类器和基于示例的分类器之间改变连接模式，从而自动构建适合用户分类基础的这样的分类系统。

公开(公告)号：US08106357B2

公开(公告)日：2012-01-31

申请号：US12016290

申请日：2008-01-18

申请人： Kenji Nakahira ,  Toshifumi Honda ,  Atsushi Miyamoto

发明人： Kenji Nakahira ,  Toshifumi Honda ,  Atsushi Miyamoto

IPC分类号： G01N23/00

CPC分类号： G01N23/225 ,  G01N2223/401

摘要： In the case where a specimen is imaged by a scanning electron microscope, it is intended to acquire an image of a high quality having a noise component reduced, thereby to improve the precision of an image processing. The intensity distribution of a beam is calculated on the basis of an imaging condition or specimen information, and an image restoration is performed by using a resolving power deterioration factor other than the beam intensity distribution as a target of a deterioration mode, so that a high resolving power image can be acquired under various conditions. In the scanning electron microscope for semiconductor inspections and semiconductor measurements, the restored image is used for pattern size measurement, defect detections, defect classifications and so on, so that the measurements can be improved in precision and so that the defect detections and classifications can be made high precise.

摘要翻译： 在通过扫描电子显微镜对样本进行成像的情况下，旨在获取具有降低噪声成分的高质量图像，从而提高图像处理的精度。 基于成像条件或样本信息计算光束的强度分布，并且通过使用除了光束强度分布之外的分辨力退化因子作为劣化模式的目标来执行图像恢复，使得高 可以在各种条件下获得分辨率的图像。 在用于半导体检查和半导体测量的扫描电子显微镜中，恢复的图像用于图案尺寸测量，缺陷检测，缺陷分类等，从而可以提高测量精度，从而可以使缺陷检测和分类 做出高精度。

公开(公告)号：US20110188735A1

公开(公告)日：2011-08-04

申请号：US13057782

申请日：2009-06-05

申请人： Naoki Hosoya ,  Toshifumi Honda ,  Takashi Hiroi

发明人： Naoki Hosoya ,  Toshifumi Honda ,  Takashi Hiroi

IPC分类号： G06K9/00

CPC分类号： G01N21/956 ,  G01N2223/6116 ,  G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

摘要： Provided are a method and a device for defect inspection, wherein, in a state where a few DOIs exist in a large number of nuisances, a classification performance can be improved by a few appropriate defect instructions and a high classification performance is ensured while mitigating the burden of user's defect instructions. The method and device for defect inspection is characterized by repeating extraction of one or more defects from a plurality of defects detected by imaging a sample, instruction of a classification class of the extracted defects, and calculation of a classification criterion and a classification performance from the image information and classification class of the defects, and determining, based on the finally obtained classification criterion, the classification class of the unknown defects. This makes it possible to improve a classification performance by a few appropriate defect instructions and ensure a high classification performance while mitigating the burden of user's defect instructions.

摘要翻译： 提供了一种用于缺陷检查的方法和装置，其中，在少数DOI存在大量滋扰的状态下，可以通过少量适当的缺陷指令来提高分类性能，并且在减轻分类性能的同时确保高分类性能 用户的缺陷指示负担。 用于缺陷检查的方法和装置的特征在于，从通过成像样本检测到的多个缺陷中重复提取一个或多个缺陷，提取的缺陷的分类等级的指令，以及来自所述缺陷的分类标准和分类性能的计算 图像信息和分类类的缺陷，并根据最终获得的分类标准确定未知缺陷的分类等级。 这使得可以通过几个适当的缺陷指令提高分类性能，并确保高分类性能，同时减轻用户缺陷指令的负担。