Method and apparatus for tinning tinnable areas on an electronic
component package
    82.
    发明授权
    Method and apparatus for tinning tinnable areas on an electronic component package 失效
    在电子部件包装上镀锡的区域的方法和装置

    公开(公告)号:US5260098A

    公开(公告)日:1993-11-09

    申请号:US811661

    申请日:1991-12-23

    Abstract: A method of tinning tinnable areas of an electronic component package, the method comprising a first step during which additional metal is applied in the liquid state to said tinnable areas, and a following step during which at least one cycle of oscillations about an equilibrium position is applied to the package while said metal thus applied is still in the liquid state, for the purpose of setting up successive and opposite displacements of masses of said metal along said areas in order to obtain a uniform distribution of said metal over said areas.

    Abstract translation: 一种对电子部件封装的镀锡区域进行镀锡的方法,该方法包括第一步骤,在该步骤中,将附加金属以液态施加到所述可镀区域,以及随后的步骤,其中关于平衡位置的至少一个振荡周期为 施加到包装上,同时所施加的所述金属仍然处于液体状态,目的是为了使所述金属在所述区域上的均匀分布得以均匀分布,以便沿着所述区域设置所述金属质量的连续和相对的位移。

Patent Agency Ranking