公开(公告)号：US11453593B2

公开(公告)日：2022-09-27

申请号：US16397295

申请日：2019-04-29

申请人： Global Graphene Group, Inc.

发明人： Yi-jun Lin ,  Bor Z. Jang

IPC分类号： F28D15/00 ,  C01B32/184 ,  C01B32/198 ,  C01B32/225 ,  H04B1/04 ,  H04B1/08 ,  C01B32/23 ,  H05K7/20 ,  F28D15/04

摘要： Provided is a vapor-based heat transfer apparatus (e.g. a vapor chamber or a heat pipe), comprising: a hollow structure having a hollow chamber enclosed inside a sealed envelope or container made of a thermally conductive material, a wick structure in contact with one or a plurality of walls of the hollow structure, and a working liquid within the hollow structure and in contact with the wick structure, wherein the wick structure comprises a graphene material and the hollow structure walls comprise an evaporator wall having a first surface plane and a condenser wall having a second surface plane, wherein multiple sheets of the graphene material in the wick structure are aligned to be substantially parallel to one another and perpendicular to at least one of the first surface plane and the second surface plane. Also provided is a process for producing this apparatus.

公开(公告)号：US20220295669A1

公开(公告)日：2022-09-15

申请号：US17468426

申请日：2021-09-07

申请人： VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.

发明人： Xue Mei WANG ,  Xianyao LIU

IPC分类号： H05K7/20 ,  F28F23/02 ,  F28D15/04

摘要： A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation structure. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation structure is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.

公开(公告)号：US20220282927A1

公开(公告)日：2022-09-08

申请号：US17825812

申请日：2022-05-26

申请人： Lennox Industries, Inc.

发明人： Vijaykumar Sathyamurthi ,  Der-Kai Hung ,  Hong Lin

IPC分类号： F28D1/053 ,  F28D15/04 ,  F28D1/04

摘要： An apparatus includes first and second microchannel heat exchangers and first and second pipes. The first heat exchanger includes a first inlet, a second inlet, a first tube, a second tube, a first outlet, and a second outlet. Refrigerant at the first inlet is directed through the first tube to the first outlet and the first pipe. Refrigerant at the second inlet is directed through the second tube to the second outlet and the second pipe. The second heat exchanger includes a third inlet, a fourth inlet, a third tube, a fourth tube, a third outlet, and a fourth outlet. The third inlet directs refrigerant from the first pipe through the third tube towards the third outlet. The fourth inlet directs the refrigerant from the second pipe through the fourth tube towards the fourth outlet. The first pipe overlaps the second pipe between the two heat exchangers.

公开(公告)号：US11428475B2

公开(公告)日：2022-08-30

申请号：US16923080

申请日：2020-07-08

申请人： General Electric Company

发明人： Brian Magann Rush ,  Daniel Jason Erno ,  Thomas Adcock ,  Stefano Angelo Mario Lassini

IPC分类号： F28D15/00 ,  F28D15/04 ,  B33Y80/00 ,  B64G1/50 ,  H01L23/427 ,  B23K26/342 ,  B33Y10/00 ,  F28D21/00

摘要： A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

公开(公告)号：US11421940B2

公开(公告)日：2022-08-23

申请号：US17220248

申请日：2021-04-01

申请人： VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.

发明人： Lei Lei Liu ,  Xue Mei Wang

IPC分类号： F28D15/02 ,  F28D15/04

摘要： A vapor chamber accommodating working fluid and including first plate, second plate, first capillary structure and second capillary structure. First plate has thermal contact surface. Second and first plate are attached to each other so as to allow hermetically sealed space to be formed. Hermetically sealed space accommodates working fluid. Thermal contact surface faces away from hermetically sealed space. First capillary structure is located in hermetically sealed space. First capillary structure includes base portion, first protrusions and second protrusions. Base portion is stacked on first plate. First protrusions and second protrusions protrude from a side of base portion. Second protrusions surround first protrusions. Second capillary structure is located in hermetically sealed space. Second capillary structure is stacked on first protrusions. Distance between first protrusions is smaller than distance between second protrusions. Evaporation space and condensation space are respectively formed on two opposite sides of second capillary structure.

公开(公告)号：US20220260321A1

公开(公告)日：2022-08-18

申请号：US17178266

申请日：2021-02-18

申请人： ASIA VITAL COMPONENTS (CHINA) CO., LTD.

发明人： Han-Min Liu ,  Xiao-Xiang Zhou ,  Shi-Lei Wei

IPC分类号： F28D15/02 ,  F28D15/04

摘要： A flexible heat dissipation device includes an evaporator, a vapor tube, a liquid tube and a condenser. The evaporator has at least one vapor chamber. A capillary structure and a working fluid are received in the vapor chamber. Two ends of the vapor tube is respectively in communication with one end of the evaporator and the condenser. Two ends of the liquid tube are respectively in communication with the evaporator and the condenser, whereby the evaporator, the vapor tube, the condenser and the liquid tube form a loop for the working fluid to flow through. At least one bellows section is disposed on one or both of the vapor tube and the liquid tube. The bellows section has multiple waved stripes. More than one of the heights, widths and pitches of the multiple waved stripes are equal to or unequal to each other.

公开(公告)号：US11415373B2

公开(公告)日：2022-08-16

申请号：US16600114

申请日：2019-10-11

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Yoshikatsu Inagaki ,  Hirofumi Aoki ,  Kazuya Takahashi ,  Shinichi Ito ,  Shuta Hikichi

IPC分类号： F28D15/04 ,  B22F5/10

摘要： Provided is a heat pipe which is installed in a cold region in a bottom heat posture in which a longitudinal direction of a container is substantially in parallel with a gravitational direction, is capable of preventing the container from deforming even when a working fluid has become frozen, and has excellent heat transport properties.

公开(公告)号：US11408684B1

公开(公告)日：2022-08-09

申请号：US16157841

申请日：2018-10-11

申请人： ADVANCED COOLING TECHNOLOGIES, INC.

发明人： Bradley Richard ,  William Anderson ,  Richard W. Bonner, III ,  Devin Pellicone ,  Chien-Hua Chen ,  Greg Hoeschele ,  Taylor Maxwell ,  Dan Pounds ,  Dan Reist

IPC分类号： F28D15/04 ,  F28D15/02

摘要： A loop heat pipe evaporator includes a porous primary wick, and a nonporous envelope unseparatingly surrounding the primary wick. The primary wick and the envelope are of one-piece construction.

公开(公告)号：US20220243992A1

公开(公告)日：2022-08-04

申请号：US17163217

申请日：2021-01-29

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Hung-Hsien HUANG ,  Shin-Luh TARNG ,  Ian HU ,  Chien-Neng LIAO ,  Jui-Cheng YU ,  Po-Cheng HUANG

IPC分类号： F28D15/04 ,  F28D15/02 ,  F28F13/18

摘要： A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.

公开(公告)号：US20220221233A1

公开(公告)日：2022-07-14

申请号：US17689081

申请日：2022-03-08

申请人： The Regents of the University of Colorado, a body corporate

发明人： Ronggui Yang ,  Rongfu Wen ,  Shanshan Xu ,  Yung-Cheng Lee

IPC分类号： F28F13/18 ,  F25B39/04 ,  H01L23/427 ,  F28D15/04

摘要： This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.