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公开(公告)号：US20210333053A1
公开(公告)日：2021-10-28
申请号：US17371106
申请日：2021-07-09
摘要： A structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.
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公开(公告)号：US08792238B2
公开(公告)日：2014-07-29
申请号：US13365739
申请日：2012-02-03
IPC分类号： F28D15/04 , H05K7/20 , F28D15/02 , H01L23/427 , H01L23/473 , F28F13/00
CPC分类号： F28D15/04 , F28D15/0233 , F28D15/0275 , F28D15/046 , F28F2013/006 , F28F2275/02 , F28F2275/04 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/2029 , H01L2924/00
摘要： A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.
摘要翻译： 具有环型蒸气室的散热模块包括散热体，环型蒸气室和导热介质。 环形蒸气室被散热体完全覆盖。 环型蒸气室包括环体，芯结构和支撑结构。 环体包括底板和盖板。 在底板和盖板之间形成真空室。 芯体结构布置在盖板和底板的内表面上。 支撑结构朝向盖板和底板抵接芯体结构。 环形蒸汽室经由导热介质与散热体紧密连接。
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公开(公告)号：US20130199757A1
公开(公告)日：2013-08-08
申请号：US13365739
申请日：2012-02-03
IPC分类号： F28D15/04
CPC分类号： F28D15/04 , F28D15/0233 , F28D15/0275 , F28D15/046 , F28F2013/006 , F28F2275/02 , F28F2275/04 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/2029 , H01L2924/00
摘要： A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.
摘要翻译： 具有环型蒸气室的散热模块包括散热体，环型蒸气室和导热介质。 环形蒸气室被散热体完全覆盖。 环型蒸气室包括环体，芯结构和支撑结构。 环体包括底板和盖板。 在底板和盖板之间形成真空室。 芯体结构布置在盖板和底板的内表面上。 支撑结构朝向盖板和底板抵接芯体结构。 环形蒸汽室经由导热介质与散热体紧密连接。
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公开(公告)号：US20110310563A1
公开(公告)日：2011-12-22
申请号：US12818341
申请日：2010-06-18
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.
摘要翻译： 用于存储器的夹式散热器包括两个导热模块，枢转轴和弹性元件。 导热模块包括等温蒸气室板和耦合到等温蒸气室板的散热体。 散热体包括基板和从基板延伸的散热片。 基板包括用于使枢轴穿过的轴孔，使得每个散热体串联安装，并且弹性元件被套在枢轴上，并且包括从弹性元件延伸并抵靠每个散热体的两个弹性臂 使得每个等温蒸气室板被夹紧并附接到存储器的外部侧，以提高组装和移除过程的便利性和完整性，以实现快速组装或去除效果并防止部件丢失。
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公开(公告)号：US08011361B2
公开(公告)日：2011-09-06
申请号：US12411702
申请日：2009-03-26
IPC分类号： F24J2/10
CPC分类号： F28F1/34 , F24S10/90 , F24S23/31 , F24S23/72 , F24S40/55 , F24S2010/752 , F28D15/0233 , F28D15/0275 , H01L31/052 , Y02E10/43 , Y02E10/44 , Y02E10/50
摘要： A tower type heat dissipating structure is applied to dissipate the heat of a solar power system. The solar power system is provided with a reflector having a hemispheric surface for reflecting the sunlight to a solar cell. The heat dissipating structure comprises a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate is connected with the solar cell, and the other side is provided with a groove for being embedded an end of the plate type heat pipe. The heat dissipating fins is arranged with an inclination angle against the plate type heat pipe that can promote the heated air within the gaps to rise. The heat is rapidly conduced to prevent the solar cell from being destroyed by overheating for reducing the repairing costs.
摘要翻译： 应用塔式散热结构来散发太阳能发电系统的热量。 太阳能发电系统设置有具有用于将太阳光反射到太阳能电池的半球面的反射器。 散热结构包括导热板，板式热管和多个散热片。 导热板的一侧与太阳能电池连接，另一侧设置有用于嵌入板式热管的端部的凹槽。 散热翅片布置成与板式热管倾斜的角度，其能够促使间隙内的加热空气升高。 快速地进行热量以防止太阳能电池被过热破坏以降低维修成本。
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公开(公告)号：US07599185B2
公开(公告)日：2009-10-06
申请号：US12170556
申请日：2008-07-10
CPC分类号： H01L23/427 , H01L23/4006 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A cooling device for dissipating heat generated by an electronic element includes a fixing seat, a cooling body, and a vapor chamber. The fixing seat is arranged an opening. The cooling body includes a bottom plate attached onto the fixing seat and a plurality of cooling fins that are interspaced to each other and are attached to the bottom plate, in which a fixing hole is arranged at one side of the bottom plate, and an accommodating space is configured at the cooling fins in corresponding to the fixing hole. The vapor chamber is accommodated in the opening of the fixing seat, and one side of the vapor chamber contacts a bottom part of the cooling body, while another side contacts the electronic element.
摘要翻译： 用于散发由电子元件产生的热量的冷却装置包括固定座，冷却体和蒸气室。 固定座设置开口。 所述冷却体包括安装在所述固定座上的底板和多个相互间隔的冷却翅片，并且安装在所述底板上，所述底板在所述底板的一侧配置有固定孔， 在与固定孔对应的冷却翅片处构成空间。 蒸气室容纳在固定座的开口中，蒸气室的一侧与冷却体的底部接触，另一侧接触电子元件。
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7.发明授权公开(公告)号：US11092386B2
公开(公告)日：2021-08-17
申请号：US16546568
申请日：2019-08-21
摘要： A manufacturing method and structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.
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公开(公告)号：US10571201B2
公开(公告)日：2020-02-25
申请号：US15828559
申请日：2017-12-01
摘要： A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.
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公开(公告)号：US20120279687A1
公开(公告)日：2012-11-08
申请号：US13101180
申请日：2011-05-05
IPC分类号： F28D15/04
CPC分类号： F28D15/046
摘要： The present invention provides a flat-type heat pipe and a wick structure thereof. The flat-type heat pipe has a flat tube. The wick structure is arranged inside the flat tube along an axial line of the flat tube. The wick structure comprises a first wick portion and two second wick portions connected on both sides of the first wick portion. The thickness of the first wick portion is larger than that of the second wick portion. The first wick portion abuts against an upper inner wall of the flat tube. An air channel is formed between each of the second wick portions and the upper inner wall of the flat tube. The wick structure supports the inner wall of the flat-type heat pipe without providing additional supporting structure, so that the heat pipe can be made more compact.
摘要翻译： 本发明提供一种扁平型热管及其灯芯结构。 扁平型热管具有扁平管。 芯体结构沿着扁平管的轴线布置在扁平管内。 芯体结构包括连接在第一芯部两侧的第一芯部和两个第二芯部。 第一灯芯部分的厚度大于第二灯芯部分的厚度。 第一个芯部分靠在扁平管的上部内壁上。 在第二芯体部分和扁平管的上内壁之间形成空气通道。 芯体结构支撑扁平型热管的内壁，而不需要额外的支撑结构，从而使热管更加紧凑。
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公开(公告)号：US20120097371A1
公开(公告)日：2012-04-26
申请号：US12910207
申请日：2010-10-22
CPC分类号： F28F1/30 , F28D15/02 , F28F2275/10
摘要： A serially-connected heat-dissipating fin assembly includes a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins. With the interference fit between the respective abutting portions and the surface of the thermal-conducting element, it is unnecessary to use solders.
摘要翻译： 串联连接的散热片组件包括多个散热翅片和导热元件。 每个散热翅片设置有用于允许导热元件穿过的中空连接部分。 各散热片的连接部的内缘设有突出壁。 突出壁设置有多个朝向连接部分稍微突出的邻接部分。 导热元件的表面与邻接部分摩擦接触，从而紧密地配合到相应的散热片的连接部分。 通过相应的邻接部分和导热元件的表面之间的过盈配合，不需要使用焊料。
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