公开(公告)号：US20050156324A1

公开(公告)日：2005-07-21

申请号：US11036135

申请日：2005-01-18

申请人： Yoshimi Nakase ,  Yoshitaugu Sakamoto ,  Hiroshi Ohki ,  Tomomasa Yoshida ,  Norio Kano

发明人： Yoshimi Nakase ,  Yoshitaugu Sakamoto ,  Hiroshi Ohki ,  Tomomasa Yoshida ,  Norio Kano

IPC分类号： B23K1/00 ,  H01L21/58 ,  H01L21/60 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/83101 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A method for manufacturing a connection construction having a first and a second connection members bonded therebetween with a solder layer includes the steps of: sandwiching the solder layer between the first and the second connection members; decompressing the solder layer down to a first pressure with maintaining a first temperature, which is lower than a solidus of the solder; heating the solder layer up to a second temperature with maintaining the first pressure, the second temperature being higher than a luquidus of the solder; compressing the solder layer up to a second pressure with maintaining the second temperature, the second pressure being higher than the first pressure; and hardening the solder with maintaining the second pressure.

摘要翻译： 一种用于制造具有用焊料层接合在其间的第一和第二连接构件的连接结构的方法包括以下步骤：将焊料层夹在第一和第二连接构件之间; 将焊料层减压至第一压力，同时保持低于焊料固相线的第一温度; 在保持第一压力的同时将焊料层加热至第二温度，第二温度高于焊料的流动性; 在保持第二温度的同时将焊料层压缩至第二压力，第二压力高于第一压力; 并在保持第二压力的同时硬化焊料。