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    Apparatus and methods for thermal management of light emitting diodes
    2.
    发明授权
    Apparatus and methods for thermal management of light emitting diodes 失效
    用于发光二极管的热管理的装置和方法

    公开(公告)号：US08564956B2

    公开(公告)日：2013-10-22

    申请号：US13101815

    申请日：2011-05-05

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: H05K7/20

    CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/10106 ,  H05K2201/10303 ,  H01L2924/00014

    Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

    Abstract translation: 公开了一种可以包括一个或多个印刷电路板（PCB）的装置，并且可以围绕一个或多个PCB的第一表面设置电子封装。 PCB可以包括金属层和芯，并且在一些方面，可以包括插入在多个金属层之间的多个芯，并且在一些实施例中，背板可以沿着芯布置。 多个PCB可以通过引脚分开并连接，以将散热从一个PCB散发到另一个PCB，和/或传送电连接。 引脚可以被配置成穿过或者进入包括芯的一个或两个PCB，以便传导电子封装产生的热量以便分散。 在一些实施例中，销可以进入背板。 该装置可以包括LED，灯，计算机设备，存储器，电信设备或这些的组合。

    Apparatus for housing a light assembly
    4.
    发明授权
    Apparatus for housing a light assembly 失效
    用于容纳灯组件的装置

    公开(公告)号：US08591068B2

    公开(公告)日：2013-11-26

    申请号：US13204114

    申请日：2011-08-05

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: F21V29/00

    CPC classification number: F21V21/00 ,  F21K9/233 ,  F21V23/06 ,  F21V29/004 ,  F21V29/74 ,  F21V29/773 ,  F21V29/80 ,  F21V29/83 ,  F21Y2115/10 ,  F28F3/022 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/10106 ,  H01L2924/00014

    Abstract: An apparatus and related method for housing a light assembly apparatus includes a housing having a housing first end and a housing second end arranged along a central axis, the housing further includes a plurality of fins each having a fin first end and a fin second end, the plurality of fins forming a plurality of vents therebetween, each the plurality of fins has a curvature extending from the fin second end such that the plurality of fins converge towards the central axis proximate each fin first end, an endpiece proximate the housing first end and arranged proximate to the fin first end of each of the plurality of fins, the endpiece having a circular portion including a continuous circumference about the central axis, an electrical connector arranged proximate to the endpiece and arranged along the central axis, and a space arranged along the central axis proximate the housing second end and further configured with the plurality of fins and the plurality of vents arranged therearound, the space configured to, at least in part, house a light assembly. Other embodiments are disclosed as well.

    Abstract translation: 一种用于容纳灯组装设备的装置和相关方法，包括具有壳体第一端和沿着中心轴线布置的壳体第二端的壳体，所述壳体还包括多个翅片，每个鳍片具有翅片第一端和翅片第二端， 所述多个翅片在其间形成多个通气孔，所述多个翅片中的每一个具有从所述翅片第二端部延伸的曲率，使得所述多个翅片朝向靠近每个翼片第一端部的中心轴线会聚，靠近所述壳体第一端部的端部件， 布置成靠近所述多个翅片中的每一个的翅片第一端，所述端件具有包围围绕所述中心轴线的连续圆周的圆形部分，靠近所述端件设置并沿着所述中心轴布置的电连接器以及沿着所述中心轴线布置的空间 靠近壳体第二端的中心轴线并且进一步配置有多个翼片和布置在其上的多个通气孔 nd，所述空间被配置为至少部分地容纳灯组件。 也公开了其它实施例。

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