公开(公告)号：US09610669B2

公开(公告)日：2017-04-04

申请号：US14042600

申请日：2013-09-30

申请人： Strasbaugh

发明人： Thomas A. Walsh ,  Larry A. Spiegel

IPC分类号： B24B7/22

CPC分类号： B24B7/228

摘要： A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle.

公开(公告)号：US20140134927A1

公开(公告)日：2014-05-15

申请号：US14042600

申请日：2013-09-30

申请人： Strasbaugh

发明人： Thomas A. Walsh ,  Larry A. Spiegel

IPC分类号： B24B41/047 ,  B24B7/22

CPC分类号： B24B7/228

摘要： A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle.

摘要翻译： 研磨机包括工作主轴; 工作卡盘与工作主轴配合; 研磨主轴; 磨轮与研磨主轴配合; 以及相对于研磨主轴定位的多个对准调整系统，其中来自任何一个对准调节系统的调整被配置成引起工作主轴和研磨主轴之间对准的改变。

公开(公告)号：US20130130593A1

公开(公告)日：2013-05-23

申请号：US13740101

申请日：2013-01-11

申请人： Strasbaugh

发明人： William J. Kalenian ,  Thomas A. Walsh ,  Michael R. Vogtmann ,  Benjamin C. Smedley ,  Larry A. Spiegel ,  Thomas E. Brake

IPC分类号： B24B49/00 ,  B24B49/04

CPC分类号： B24B49/00 ,  B24B7/228 ,  B24B49/04

摘要： Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.

摘要翻译： 一些实施例提供了处理晶片的方法，包括：将堆叠的晶片定位到待研磨的位置，其中堆叠的晶片包括用载体晶片固定的第一晶片，其中第一晶片与载体晶片固定，使得表面 的第一个晶片暴露于地面; 在由载体晶片支撑的同时开始研磨第一晶片; 在研磨第一晶片时相对于第一晶片激活一个或多个传感器; 在研磨所述第一晶片的同时，根据来自所述一个或多个传感器的数据的函数，确定所述第一晶片的厚度与所述载体晶片的厚度分离; 确定所确定的所述第一晶片的厚度是否具有与第一厚度阈值的预定关系; 以及当所述第一晶片的厚度与所述第一厚度阈值具有预定关系时，停止所述晶片研磨。

公开(公告)号：US08052504B2

公开(公告)日：2011-11-08

申请号：US11829798

申请日：2007-07-27

申请人： William J. Kalenian ,  Tom Walsh ,  Dave Halley

发明人： William J. Kalenian ,  Tom Walsh ,  Dave Halley

IPC分类号： B24B49/00

CPC分类号： B24B37/345 ,  B24B37/30 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/68785

摘要： The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

摘要翻译： 本实施例提供了用于处理诸如晶片的物体的方法和系统，包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人，传送站和多个端部执行器。 处理模块与前端模块耦合，使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴，所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。

公开(公告)号：US20100062685A1

公开(公告)日：2010-03-11

申请号：US12205861

申请日：2008-09-06

申请人： Randolph E. Truer ,  Michael Starman

发明人： Randolph E. Truer ,  Michael Starman

IPC分类号： B24B49/12 ,  B24B7/20 ,  B24D11/00

CPC分类号： B24B49/12 ,  B24B37/013 ,  B24B37/205

摘要： A CMP polishing pad with an optical sensor assembly embedded in the pad, connected to a transceiver and/or power supply mounted at the center of the pad or at the outer edge of the pad which communicates wirelessly with a control system.

摘要翻译： CMP抛光垫，其具有嵌入垫中的光学传感器组件，连接到安装在垫的中心或垫的外边缘处的收发器和/或电源，其与控制系统无线通信。

公开(公告)号：US20090061734A1

公开(公告)日：2009-03-05

申请号：US11729303

申请日：2007-03-27

申请人： Stephan H. Wolf

发明人： Stephan H. Wolf

IPC分类号： B24B49/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12

摘要： An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

摘要翻译： 用于CMP的晶片抛光垫组件包括用于在抛光过程中感测晶片的反射率的光学传感器，并产生相应的信号，并将该信号从旋转焊盘传输到组件的固定部分。 信号通过非接触耦合，如感性耦合或光耦合，在被转换为能够进行非接触传输的信号格式之后传输掉。

公开(公告)号：US20070010181A1

公开(公告)日：2007-01-11

申请号：US11455897

申请日：2006-06-19

申请人： Larry Spiegel

发明人： Larry Spiegel

IPC分类号： B24B29/00 ,  B24B41/06

CPC分类号： B24B37/32

摘要： A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is disposed within the carrier such that if the pressure in the bladder is regulated, the amount of force on the edge of the wafer changes. If a polishing process would cause material near the edge of the wafer to be removed at a higher rate than from the rest of the wafer, then the pressure is regulated within the bladder to reduce the force against the edge of the wafer. By reducing the force against the edge of the wafer, material is removed from the front side of the wafer at a uniform rate.

摘要翻译： 用于在化学机械平面化期间控制边缘效应的晶片载体。 第一囊状物设置在保持环内以控制保持环相对于晶片载体的底表面的高度。 第二气囊设置在载体内，使得如果气囊中的压力被调节，则晶片边缘上的力的量发生变化。 如果抛光过程会导致晶片边缘附近的材料以比晶片的其余部分更高的速率被移除，则压力被调节在囊内以减小对晶片边缘的力。 通过减小对晶片边缘的力，材料以均匀的速率从晶片的前侧移除。

公开(公告)号：US20060205322A1

公开(公告)日：2006-09-14

申请号：US11430637

申请日：2006-05-08

申请人： William Kalenian ,  Thomas Walsh

发明人： William Kalenian ,  Thomas Walsh

IPC分类号： B24B51/00

CPC分类号： B24B49/16 ,  B24B37/042

摘要： The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending on the wafer carrier configuration, to determine a unique calibration in real time for the particular wafer carrier that is being tested and used during the polishing process.

摘要翻译： 下面描述的方法和装置允许CMP工具的用户使用机构，称重传感器，控制计算机和力方程来快速校准主轴力，晶片力和保持力。 控制计算机可以根据晶片载体配置测试充气密封件或可充气膜中的各种压力，以确定在抛光过程中正被测试和使用的特定晶片载体的实时唯一校准。

公开(公告)号：US07059942B2

公开(公告)日：2006-06-13

申请号：US10717032

申请日：2003-11-18

申请人： Alan Strasbaugh ,  Salman M. Kassir

发明人： Alan Strasbaugh ,  Salman M. Kassir

IPC分类号： B24B1/00

CPC分类号： B24B41/061 ,  B24B7/228 ,  B24B37/30 ,  H01L21/67132

摘要： A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.

摘要翻译： 背面研磨晶片的方法，其中将后研磨带或垫施加到卡盘而不是施加到晶片。 当将每个晶片顺序地放置在带或垫上的背景中，背面研磨胶带或垫留在卡盘上，背景在背面漂洗，从带上移除，然后在前侧和背面清洁。 如本文所述的用于将胶带施加到卡盘的工具有助于该方法。

公开(公告)号：US07040955B1

公开(公告)日：2006-05-09

申请号：US11046502

申请日：2005-01-28

申请人： William Kalenian ,  Thomas A. Walsh

发明人： William Kalenian ,  Thomas A. Walsh

IPC分类号： B24B1/00

CPC分类号： B24B49/16 ,  B24B37/042

摘要： The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending on the wafer carrier configuration, to determine a unique calibration in real time for the particular wafer carrier that is being tested and used during the polishing process.