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公开(公告)号：US20220324751A1
公开(公告)日：2022-10-13
申请号：US17596887
申请日：2020-06-19
发明人： Aya NAKAMURA , Hidetoshi FUKUCHI , Junji KURACHI , Riku SAWAI , Takaharu MIYAZAKI , Yoshito NAWA , Kohji HATTORI
摘要： The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO2≤60, 25≤B2O3≤45, 0≤Al2O3≤18, 0
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2.发明授权公开(公告)号：US10018753B2
公开(公告)日：2018-07-10
申请号：US14631096
申请日：2015-02-25
发明人： Koutarou Kikuchi , Masato Kimura , Taishi Torikai
CPC分类号： G02B5/0236 , F21V5/002 , G02B5/0278 , H01L51/5246 , H01L51/5268
摘要： A light diffusion sheet for an organic electroluminescent element to be used in an organic electroluminescent panel. The light diffusion sheet includes: a glass fiber cloth composed of at least one glass fiber; silica on a surface of the glass fiber or between the glass fibers; and at least one selected from a group consisting of metal alkoxides and reaction products of metal alkoxides.
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公开(公告)号：US20230113079A1
公开(公告)日：2023-04-13
申请号：US17915219
申请日：2021-03-26
发明人： Goro Araki , Hiroshi Ashihara , Hazumu Nagano
IPC分类号： C08G63/183
摘要： To provide a biaxially stretched polyester resin film that has excellent properties equal to or better than those of biaxially stretched polyester film that does not use recycled raw material, and in particular that has an excellent flexural resistance in low-temperature environments. A biaxially stretched polyester resin film that characteristically satisfies both of the following properties (1) and (2): (1) in differential scanning calorimetry (DSC), after heating from 25° C. to 300° C. at a heating rate of 20° C./minute and holding for 10 minutes at 300° C., the temperature of crystallization during cooling at a cooling rate of 40° C./minute is 160° C. to 180° C.; and (2) the number of pinholes after the execution of 200 repetitive cycles of a flexural fatigue test in a −10° C. atmosphere using a Gelbo Flex Tester is not more than 10/500 cm2.
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公开(公告)号：US20220402811A1
公开(公告)日：2022-12-22
申请号：US17880202
申请日：2022-08-03
发明人： Aya NAKAMURA , Hidetoshi FUKUCHI , Junji KURACHI , Riku SAWAI , Takaharu MIYAZAKI , Yoshito NAWA , Kohji HATTORI
摘要： The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO2≤60, 25≤B2O3≤45, 0
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公开(公告)号：US20220371945A1
公开(公告)日：2022-11-24
申请号：US17880199
申请日：2022-08-03
发明人： Aya NAKAMURA , Hidetoshi FUKUCHI , Junji KURACHI , Riku SAWAI , Takaharu MIYAZAKI , Yoshito NAWA , Kohji HATTORI
摘要： The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO2≤60, 25≤B2O3≤45, 0
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公开(公告)号：US11174191B2
公开(公告)日：2021-11-16
申请号：US16617402
申请日：2018-05-18
发明人： Yoshiyuki Inaka , Takaharu Miyazaki , Koji Hayashi , Riku Sawai , Yoshito Nawa , Daisuke Nishinaka , Tomoki Sekida
摘要： A glass composition of the present disclosure includes, in wt %, 50≤SiO2≤56, 20≤B2O3≤30, 10≤Al2O3≤20, 3.5≤MgO+CaO≤10, and 0≤R2O≤1.0, further includes Fe2O3, and has a permittivity of less than 5.0 at a frequency of 1 MHz. R is at least one element selected from Li, Na, and K. The glass composition of the present disclosure is a low-permittivity glass composition with which the occurrence of fiber breakage during fiber forming can be reduced even when glass fibers to be formed have a small fiber diameter, and the occurrence of defects such as fiber breakage and fluffing during processing of the glass fibers can be reduced.
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公开(公告)号：US11773009B2
公开(公告)日：2023-10-03
申请号：US17880202
申请日：2022-08-03
发明人： Aya Nakamura , Hidetoshi Fukuchi , Junji Kurachi , Riku Sawai , Takaharu Miyazaki , Yoshito Nawa , Kohji Hattori
CPC分类号： C03C13/00 , C03B37/02 , C03C3/091 , C03C4/16 , C08J5/244 , H05K1/0306 , H05K1/038 , C03C2204/00 , C03C2213/00 , H05K2201/029
摘要： The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO2≤60, 25≤B2O3≤45, 0
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公开(公告)号：US11840477B2
公开(公告)日：2023-12-12
申请号：US17880199
申请日：2022-08-03
发明人： Aya Nakamura , Hidetoshi Fukuchi , Junji Kurachi , Riku Sawai , Takaharu Miyazaki , Yoshito Nawa , Kohji Hattori
CPC分类号： C03C13/00 , C03B37/02 , C03C3/091 , C03C4/16 , C08J5/244 , H05K1/0306 , H05K1/038 , C03C2204/00 , C03C2213/00 , H05K2201/029
摘要： The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO2≤60, 25≤B2O3≤45, 0
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公开(公告)号：US20190144329A1
公开(公告)日：2019-05-16
申请号：US16097033
申请日：2016-11-01
摘要： A glass composition of the present disclosure includes, in wt %, 50≤SiO2≤54, 25≤B2O3≤30, 12≤Al2O3≤15, 0.5≤MgO≤1.9, 3.0≤CaO≤5.5, 0≤ZnO≤3.5, 0.1≤Li2O≤0.5, and 0.1≤Na2O≤0.3, and has a permittivity of less than 5.0 at a frequency of 1 MHz. The glass composition of the present disclosure has a low permittivity. The use of this glass composition can reduce the occurrence of devitrification and the inclusion of bubbles in glass fibers to be formed or in a shaped glass material to be formed even when the glass fibers have a small fiber diameter or the shaped glass material has a small thickness.
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10.发明公开公开(公告)号：US20230331987A1
公开(公告)日：2023-10-19
申请号：US18021689
申请日：2021-09-13
申请人： UNITIKA LTD.
发明人： Yusuke YAGI , Ami HIROTA , Makoto NAKAI , Takeshi MARUO , Naoki TAKAISHI
CPC分类号： C08L77/10 , C08G69/265 , C08L2203/16 , C08L2201/08
摘要： The present invention provides a polyamide and a polyamide film which are more sufficiently superior in all of heat-resisting properties, flexibility properties and rubber elastic properties. The present invention relates to a polyamide comprising a unit comprised of an aliphatic dicarboxylic acid (A) having 18 or more carbon atoms, a unit comprised of an aliphatic diamine (B) having 18 or more carbon atoms, a unit comprised of an aromatic dicarboxylic acid (C) having 12 or less carbon atoms and a unit comprised of an aliphatic diamine (D) having 12 or less carbon atoms, wherein the polyamide has a melting point of 240° C. or more, a crystalline melting enthalpy of 20 J/g or more and an elongation recovery rate of 50% or more in a hysteresis test, and a polyamide film comprising the polyamide.
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