Polyamide compositions with improved salt resistance and heat stability
    1.
    发明授权
    Polyamide compositions with improved salt resistance and heat stability 失效
    具有改善的耐盐性和热稳定性的聚酰胺组合物

    公开(公告)号:US08349932B2

    公开(公告)日:2013-01-08

    申请号:US13015616

    申请日:2011-01-28

    CPC classification number: C08G69/265 C08K3/013 C08L29/04 C08L77/06 C08L2666/04

    Abstract: Disclosed is a polyamide composition including at least one semi-aromatic copolyamide, said semi-aromatic copolyamide consisting essentially of about 25 to about 55 mole percent repeat units of the formula —C(O)(CH2)mC(O)NHCH2ArCH2NH—  (I) and about 45 to about 75 mole percent repeat units of the formula —C(O)(CH2)mC(O)NH(CH2)nNH—  (II) wherein m is 8, 10, and/or 12, n is 6, 10 and/or 12 and Ar is a meta-substituted benzene ring; and said polyamide has a melting point equal to or less than 225° C.; and 0.25 to 20 weight percent of one or more polyhydroxy polymer(s) having a number average molecular weight of at least 2000 and selected from the group consisting of ethylene/vinyl alcohol copolymer and poly(vinyl alcohol). Also disclosed are molded or extruded articles including the polyamide composition.

    Abstract translation: 公开了包含至少一种半芳族共聚酰胺的聚酰胺组合物,所述半芳族共聚酰胺基本上由约25至约55摩尔%的式-C(O)(CH 2)m C(O)NHCH 2 ArCH 2 NH-(I )和约45至约75摩尔%的式-C(O)(CH 2)m C(O)NH(CH 2)n NH-(II)的重复单元,其中m为8,10和/或12,n为6 ,10和/或12,Ar是间位取代的苯环; 并且所述聚酰胺具有等于或小于225℃的熔点; 和0.25至20重量%的数均分子量为至少2000的一种或多种多羟基聚合物,并且选自乙烯/乙烯醇共聚物和聚(乙烯醇)。 还公开了包括聚酰胺组合物的模制或挤出制品。

    POLYAMIDE COMPOSITIONS WITH IMPROVED SALT RESISTANCE AND HEAT STABILITY
    3.
    发明申请
    POLYAMIDE COMPOSITIONS WITH IMPROVED SALT RESISTANCE AND HEAT STABILITY 失效
    具有改善耐盐碱性和耐热稳定性的聚酰胺组合物

    公开(公告)号:US20110190433A1

    公开(公告)日:2011-08-04

    申请号:US13015616

    申请日:2011-01-28

    CPC classification number: C08G69/265 C08K3/013 C08L29/04 C08L77/06 C08L2666/04

    Abstract: Disclosed is a polyamide composition including at least one semi-aromatic copolyamide, said semi-aromatic copolyamide consisting essentially of about 25 to about 55 mole percent repeat units of the formula —C(O)(CH2)mC(O)NHCH2ArCH2NH—  (I) and about 45 to about 75 mole percent repeat units of the formula —C(O)(CH2)mC(O)NH(CH2)nNH—  (II) wherein m is 8, 10, and/or 12, n is 6, 10 and/or 12 and Ar is a meta-substituted benzene ring; and said polyamide has a melting point equal to or less than 225° C.; and 0.25 to 20 weight percent of one or more polyhydroxy polymer(s) having a number average molecular weight of at least 2000 and selected from the group consisting of ethylene/vinyl alcohol copolymer and poly(vinyl alcohol). Also disclosed are molded or extruded articles including the polyamide composition.

    Abstract translation: 公开了包含至少一种半芳族共聚酰胺的聚酰胺组合物,所述半芳族共聚酰胺基本上由约25至约55摩尔%的式-C(O)(CH 2)m C(O)NHCH 2 ArCH 2 NH-(I )和约45至约75摩尔%的式-C(O)(CH 2)m C(O)NH(CH 2)n NH-(II)的重复单元,其中m为8,10和/或12,n为6 ,10和/或12,Ar是间位取代的苯环; 并且所述聚酰胺具有等于或小于225℃的熔点; 和0.25至20重量%的数均分子量为至少2000的一种或多种多羟基聚合物,并且选自乙烯/乙烯醇共聚物和聚(乙烯醇)。 还公开了包括聚酰胺组合物的模制或挤出制品。

    POLYAMIDE COMPOSITIONS WITH IMPROVED SALT RESISTANCE AND HEAT STABILITY
    4.
    发明申请
    POLYAMIDE COMPOSITIONS WITH IMPROVED SALT RESISTANCE AND HEAT STABILITY 失效
    具有改善耐盐碱性和耐热稳定性的聚酰胺组合物

    公开(公告)号:US20120029134A1

    公开(公告)日:2012-02-02

    申请号:US13015613

    申请日:2011-01-28

    CPC classification number: C08G69/265 C08K5/053 C08K5/06 C08L51/06 C08L77/06

    Abstract: Disclosed is a polyamide composition including at least one semi-aromatic copolyamide, said semi-aromatic copolyamide consisting essentially of about 25 to about 55 mole percent repeat units of the formula —C(O)(CH2)mC(O)NHCH2ArCH2NH—  (I) and about 45 to about 75 mole percent repeat units of the formula —C(O)(CH2)mC(O)NH(CH2)2NH—(II) wherein m is 8, 10, and/or 12, n is 6, 10 and/or 12 and Ar is a meta-substituted benzene ring; and said polyamide has a melting point equal to or less than 225° C.; and 0.1 to 15 weight percent of one or more polyhydric alcohols having more than two hydroxyl groups and having a number average molecular weight (Mn) of less than 2000. Also disclosed are molded or extruded articles including the polyamide composition.

    Abstract translation: 公开了包含至少一种半芳族共聚酰胺的聚酰胺组合物,所述半芳族共聚酰胺基本上由约25至约55摩尔%的式-C(O)(CH 2)m C(O)NHCH 2 ArCH 2 NH-(I )和约45至约75摩尔%的式-C(O)(CH 2)m C(O)NH(CH 2)2 NH-(II)的重复单元,其中m为8,10和/或12,n为6 ,10和/或12,Ar是间位取代的苯环; 并且所述聚酰胺具有等于或小于225℃的熔点; 和0.1至15重量%的一种或多种具有多于两个羟基并且数均分子量(Mn)小于2000的多元醇。还公开了包含聚酰胺组合物的模制或挤出制品。

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