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公开(公告)号：US20090209175A1
公开(公告)日：2009-08-20
申请号：US11631417
申请日：2005-07-21
CPC分类号： B24B37/0053 , B24B49/12
摘要： A polishing apparatus can detect escape of a substrate from a top ring during polishing. The polishing apparatus including: a polishing table (10) having a polishing pad (11); a top ring (21); and a substrate escape detection section for detecting escape of the substrate from the top ring, including a light irradiation member (26) for irradiating an area of the upper surface of the polishing pad with light, a controller (32) for controlling the light irradiation of the light irradiation member, an image-taking member (27) for taking an image of the area irradiated with the light, and an information processing member (31) for processing information outputted from the image-taking member, wherein said controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad.
摘要翻译： 抛光装置可以在抛光期间检测衬底从顶环的逸出。 该抛光装置包括：抛光台（10），具有抛光垫（11）; 顶环（21）; 以及用于检测基板从顶环脱落的基板逃逸检测部，包括用于用光照射抛光垫的上表面的区域的光照射部件（26），用于控制光照射的控制器（32） ，用于拍摄照射光的区域的图像的摄像部件（27）和用于处理从摄像部件输出的信息的信息处理部件（31），其中所述控制器控制 光照射部件至少在基板被认为与抛光垫接触的时间段内进行光照射。
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公开(公告)号：US08128458B2
公开(公告)日：2012-03-06
申请号：US11631417
申请日：2005-07-21
IPC分类号： B24B49/00
CPC分类号： B24B37/0053 , B24B49/12
摘要： A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate escape detection section for detecting escape of the substrate from the top ring. The detection section includes a light irradiation member for irradiating an area of the upper surface of the polishing pad with light, a controller for controlling the light irradiation of the light irradiation member, an image-taking member for taking an image of the area irradiated with the light, and an information processing member for processing information outputted from the image-taking member. The controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad.
摘要翻译： 抛光装置在抛光期间检测衬底从顶环的逸出。 抛光装置包括具有抛光垫，顶环和用于检测基板从顶环的逸出的基板逸出检测部的抛光台。 检测部分包括用于用光照射抛光垫的上表面的区域的光照射部件，用于控制光照射部件的光照射的控制器，用于拍摄被照射的区域的图像的摄像部件 光，以及用于处理从摄像部件输出的信息的信息处理部件。 控制器控制光照射部件，使得其至少在基板被认为与抛光垫接触的时间段内进行光照射。
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公开(公告)号：US06824613B2
公开(公告)日：2004-11-30
申请号：US10156791
申请日：2002-05-30
申请人： Naoki Dai , Masaya Seki , Akihiro Yazawa , Toshio Yokoyama , Akira Owatari
发明人： Naoki Dai , Masaya Seki , Akihiro Yazawa , Toshio Yokoyama , Akira Owatari
IPC分类号： B05C1102
CPC分类号： H01L21/67051 , C23C18/1632 , H01L21/67046 , H01L21/67742 , Y10S134/902 , Y10S414/137 , Y10S414/141
摘要： A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.
摘要翻译： 基板处理装置可以有效地形成，例如， 通过化学镀，在基板的表面上以设备的初始成本低的布线保护层和低的运行成本，而不需要宽的安装空间。 基板处理装置包括容纳第一传送机器人的装载/卸载和清洁区域，第一传送机器人具有适于处理干燥基板的手和适于处理湿基板的手，装载容纳基板的基板盒的装载口， 以及用于清洁基板的清洁单元。 电镀处理区域容纳具有设置有反转机构的背面吸引型手的第二传送机器人，用于在电镀之前进行基板的预处理的预处理单元和用于对电镀处理进行电镀处理的电镀处理单元 基质。
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