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1.发明授权Semiconductor wafer with reduced thickness variation and method for fabricating same 有权厚度变化减小的半导体晶片及其制造方法公开(公告)号：US08987898B2
公开(公告)日：2015-03-24
申请号：US13154360
申请日：2011-06-06
IPC分类号： H01L23/488 , H01L21/304 , H01L21/683
CPC分类号： H01L21/304 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a semiconductor wafer comprises a plurality of solder bumps for providing device contacts formed over a functional region of the semiconductor wafer, and one or more support rings surrounding the functional region. The one or more support rings and the plurality of solder bumps are formed so as to have substantially matching heights. The presence of the one or more support rings causes the semiconductor wafer to have a substantially uniform thickness in the functional region after a thinning process is performed on the semiconductor wafer. A method for fabricating the semiconductor wafer comprises forming the plurality of solder bumps over the functional region, and forming the one or more support rings surrounding the functional region before performing the thinning process on the semiconductor wafer.
摘要翻译： 根据一个实施例，半导体晶片包括用于提供形成在半导体晶片的功能区域上的器件触点的多个焊料凸块和围绕功能区域的一个或多个支撑环。 一个或多个支撑环和多个焊料凸块被形成为具有基本匹配的高度。 一个或多个支撑环的存在使得半导体晶片在半导体晶片上执行变薄处理之后，在功能区域中具有基本均匀的厚度。 制造半导体晶片的方法包括在功能区域之上形成多个焊料凸块，以及在对半导体晶片进行稀化处理之前形成围绕功能区域的一个或多个支撑环。
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2.发明申请Semiconductor Wafer with Reduced Thickness Variation and Method for Fabricating Same 有权具有降低厚度变化的半导体晶片及其制造方法公开(公告)号：US20120306072A1
公开(公告)日：2012-12-06
申请号：US13154360
申请日：2011-06-06
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L21/304 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a semiconductor wafer comprises a plurality of solder bumps for providing device contacts formed over a functional region of the semiconductor wafer, and one or more support rings surrounding the functional region. The one or more support rings and the plurality of solder bumps are formed so as to have substantially matching heights. The presence of the one or more support rings causes the semiconductor wafer to have a substantially uniform thickness in the functional region after a thinning process is performed on the semiconductor wafer. A method for fabricating the semiconductor wafer comprises forming the plurality of solder bumps over the functional region, and forming the one or more support rings surrounding the functional region before performing the thinning process on the semiconductor wafer.
摘要翻译： 根据一个实施例，半导体晶片包括用于提供形成在半导体晶片的功能区域上的器件触点的多个焊料凸块和围绕功能区域的一个或多个支撑环。 一个或多个支撑环和多个焊料凸块被形成为具有基本匹配的高度。 一个或多个支撑环的存在使得半导体晶片在半导体晶片上执行变薄处理之后，在功能区域中具有基本均匀的厚度。 制造半导体晶片的方法包括在功能区域之上形成多个焊料凸块，以及在对半导体晶片进行稀化处理之前形成围绕功能区域的一个或多个支撑环。
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