公开(公告)号：US20130344632A1

公开(公告)日：2013-12-26

申请号：US14003828

申请日：2012-02-20

申请人： Gregory Becker ,  Dorab Bhagwagar ,  Andrew Lovell ,  Michael Strong

发明人： Gregory Becker ,  Dorab Bhagwagar ,  Andrew Lovell ,  Michael Strong

IPC分类号： H01L31/024

CPC分类号： H01L31/024 ,  C08K3/013 ,  C08K5/12 ,  C08K5/5419 ,  C08K2201/001 ,  C08K2201/014 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K3/1225 ,  H05K2201/0162 ,  H05K2201/10106 ,  C08L83/04 ,  H01L2924/00

摘要： This invention is directed to a method for applying a thermal management composition between an LED mounted circuit board and a heat sink, comprising the steps of; (a) applying a deposit of a thermal management composition onto either a second surface of the LED mounted circuit board or onto a surface of a heat sink, through a deposition tool the deposition tool having at least one aperture (401) where the at least one aperture has a perimeter surrounded by sidewalls, where the sidewalls have heights, where the heights are reduced around at least a portion (402) of the perimeter of the apertures on the deposition tool as compared to the average height of the deposition tool and (b) securing the LED mounted circuit board and the heat sink.

摘要翻译： 本发明涉及一种在LED安装电路板和散热片之间施加热管理组合物的方法，包括以下步骤： （a）通过沉积工具将热管理组合物的沉积物施加到LED安装的电路板的第二表面上或散热器的表面上，该沉积工具具有至少一个孔（401），其中至少一个孔 一个孔具有由侧壁包围的周边，其中侧壁具有高度，其中高度在沉积工具上的孔周围的至少一部分（402）周围减小，与沉积工具的平均高度相比（ b）固定LED安装电路板和散热片。