Manufacturable connectorization process for optical chip-to-chip interconnects
    8.
    发明申请
    Manufacturable connectorization process for optical chip-to-chip interconnects 有权
    用于光芯片到芯片互连的可制造的连接器化过程

    公开(公告)号:US20060067624A1

    公开(公告)日:2006-03-30

    申请号:US10955897

    申请日:2004-09-30

    IPC分类号: G02B6/30

    CPC分类号: G02B6/241 G02B6/30

    摘要: An apparatus comprising a substrate having a trench therein, the trench extending to an edge of the substrate, a waveguide array positioned in the trench, the waveguide array extending to the edge of the substrate, and a ferrule attached at or near the edge of the substrate and spanning a width of the waveguide array, the ferrule being directly in contact with a surface of the waveguide array. A process comprising positioning a waveguide in a trench on a substrate, the waveguide extending to an edge of the substrate, and attaching a ferrule at or near the edge of the substrate, the ferrule including a recess having a bottom, wherein the bottom is in direct contact with a surface of the waveguide.

    摘要翻译: 一种包括其中具有沟槽的衬底的器件,所述沟槽延伸到衬底的边缘,定位在沟槽中的波导阵列,延伸到衬底边缘的波导阵列以及附接在衬底的边缘处或附近的套圈 衬底并跨越波导阵列的宽度,套圈直接与波导阵列的表面接触。 一种方法,包括将波导定位在衬底上的沟槽中,波导延伸到衬底的边缘,以及在衬底的边缘处或附近附接套圈,套圈包括具有底部的凹部,其中底部处于 与波导的表面直接接触。