公开(公告)号：US08018053B2

公开(公告)日：2011-09-13

申请号：US12023831

申请日：2008-01-31

申请人： Harvey C. Nathanson ,  Robert M. Young ,  Joseph T. Smith ,  Robert S. Howell ,  Archer S. Mitchell

发明人： Harvey C. Nathanson ,  Robert M. Young ,  Joseph T. Smith ,  Robert S. Howell ,  Archer S. Mitchell

IPC分类号： H01L23/34 ,  H01L35/00

CPC分类号： H01L35/00 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： One example discloses a heat transfer device that can comprise a semiconductor material having a first region and a second region. The first region and the second region are doped to propel a charged carrier from the first region to the second region. The heat transfer device can also comprise an array of pointed tips thermoelectrically communicating with the second region. A heat sink faces the array, and a vacuum tunneling region is formed between the pointed tips and the heat sink. The heat transfer device further can further comprise a power source for biasing the heat sink with respect to the first region. The first region defines an N-type semiconductor material and the second region defines a P-type semiconductor material.

摘要翻译： 一个实例公开了一种传热装置，其可以包括具有第一区域和第二区域的半导体材料。 第一区域和第二区域被掺杂以将带电载体从第一区域推动到第二区域。 传热装置还可以包括与第二区域热电连通的尖端的阵列。 散热器面向阵列，并且在尖端和散热器之间形成真空隧道区域。 传热装置还可以进一步包括用于相对于第一区域偏置散热器的电源。 第一区域限定N型半导体材料，第二区域限定P型半导体材料。

公开(公告)号：US20090194870A1

公开(公告)日：2009-08-06

申请号：US12023831

申请日：2008-01-31

申请人： Harvey C. Nathanson ,  Robert M. Young ,  Joseph T. Smith ,  Robert S. Howell ,  Archer S. Mitchell

发明人： Harvey C. Nathanson ,  Robert M. Young ,  Joseph T. Smith ,  Robert S. Howell ,  Archer S. Mitchell

IPC分类号： H01L23/34 ,  H01L35/00

CPC分类号： H01L35/00 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： The disclosure relates to a Point Cooler based on a combination of principles, including large area, low current density PN junction cooling, and electron emission from heavily doped shallowly-depleted P tips. Using Junction Cooling rather than thermoelectric cooling enables an all silicon device to be made that favorably competes with the commercial thermoelectric cooling systems. Theoretical values of THOT/TCOLD of 6 or more (in contrast to about 1.5 for other solid state refrigerators) predict this single-stage solid state vacuum electronic cooler can approach 50K at light loading, significantly lower than conventional Bismuth Telluride based thermo electrics. The high Z values for PN junction cooling with wire connection and Tunnel heat extraction opens up solid state vibration-less form fit and function replacement cooling.

摘要翻译： 本公开涉及基于原理组合的点冷却器，包括大面积，低电流密度PN结冷却和来自重掺杂的浅耗尽P尖端的电子发射。 使用接合冷却而不是热电冷却使得所有的硅器件能够被制造成与商业热电冷却系统相竞争。 THOT / TCOLD的理论值为6以上（与其他固态冰箱的1.5倍相比）预测，这种单级固态真空电子式冷却器在轻载时可达到50K，明显低于传统的碲化铋基热电。 通过电线连接和隧道热提取的PN结冷却的高Z值打开固态无振动形式配合和功能更换冷却。

公开(公告)号：US4220195A

公开(公告)日：1980-09-02

申请号：US42165

申请日：1979-05-24

申请人： Milton J. Borgoyn ,  Archer S. Mitchell

发明人： Milton J. Borgoyn ,  Archer S. Mitchell

IPC分类号： F28D15/04 ,  F28F13/16 ,  F28D15/00

CPC分类号： F28F13/16 ,  F28D15/04

摘要： Conventional heat pipe performance can be improved by reducing the dependency upon the capillary pumping limitation. Electrodes mounted either in the working fluid vapor or its condensate produce an ion flow directed axially and in the same flow direction. The ion flow, through collision phenomena, picks-up the surrounding low velocity stream, increases its momentum and generates additional pumping pressure for the condensate. Performance can be improved even when low surface tension working fluids are used.

摘要翻译： 传统的热管性能可以通过减少对毛细管泵送限制的依赖性来改善。 安装在工作流体蒸气或其冷凝物中的电极产生轴向和相同流动方向的离子流。 离子流，通过碰撞现象，拾取周围的低速流，增加其动量，并为冷凝水产生额外的泵送压力。 即使使用低表面张力的工作流体，也可以提高性能。

公开(公告)号：US4396055A

公开(公告)日：1983-08-02

申请号：US226319

申请日：1981-01-19

申请人： Archer S. Mitchell, Jr.

发明人： Archer S. Mitchell, Jr.

IPC分类号： F28D15/06 ,  H02N11/00 ,  F28D15/00

CPC分类号： F28D15/06 ,  F04B19/24 ,  F28D15/025 ,  H02N11/006

摘要： An applied traveling potential wave induces a traveling wave of electricalharge in the liquid phase of a dielectric working fluid providing an electrical traction which pumps the working fluid from a condensing section to an evaporating section of an electrohydrodynamic inductively pumped heat pipe. In one embodiment, a surface electrical traction is induced along an open interface that extends along the liquid phase return flow circuit, and in another embodiment, the electrical traction is induced in the liquid bulk of an inhomogeneous dielectric working fluid along the liquid phase return flow circuit.

摘要翻译： 施加的行进电位波在介质工作液体的液相中引起电荷的行波，该电介质工作流体提供将工作流体从冷凝部泵送到电动水电动感应抽吸热管的蒸发部分的电力牵引。 在一个实施例中，沿着沿着液相回流回路延伸的开放界面诱导表面电牵引，并且在另一个实施例中，沿着液相返回流在不均匀的介电工作流体的液体体积中引起电牵引 电路。