公开(公告)号：US20170287799A1

公开(公告)日：2017-10-05

申请号：US15088998

申请日：2016-04-01

申请人： Steven A. Klein ,  Aditya S. Vaidya ,  Vijay Krishnan Subramanian ,  Santosh Sankarasubramanian ,  Pramod Malatkar ,  Suriyakala Suriya Ramalingam ,  Ashish Dhall

发明人： Steven A. Klein ,  Aditya S. Vaidya ,  Vijay Krishnan Subramanian ,  Santosh Sankarasubramanian ,  Pramod Malatkar ,  Suriyakala Suriya Ramalingam ,  Ashish Dhall

IPC分类号： H01L23/16 ,  H01L21/54

CPC分类号： H01L23/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/00

摘要： A stiffener, an IC package and methods of fabrication of an IC package including a removable stiffener are shown. A removable stiffener for use with an integrated circuit (IC), including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Such a removable stiffener including at least one removal tab is shown. An IC package including a removable stiffener including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Methods of fabrication of an IC package including a removable stiffener are shown.