公开(公告)号：US20130049009A1

公开(公告)日：2013-02-28

申请号：US13596372

申请日：2012-08-28

Applicant: KyoungJun Kim ,  JongSe Park ,  Donghyun Kim ,  Bohyun Lee ,  MinJu Kim ,  BongHee Jang

Inventor： KyoungJun Kim ,  JongSe Park ,  Donghyun Kim ,  Bohyun Lee ,  MinJu Kim ,  BongHee Jang

IPC: H01L33/32 ,  H01L33/60

CPC classification number: H01L33/0075 ,  H01L33/405

Abstract: A multi-layer substrate for a vertical light-emitting diode (LED) includes a conductive and reflective base substrate and an n-type gallium nitride (GaN) layer formed on the base substrate.

Abstract translation: 用于垂直发光二极管（LED）的多层基板包括形成在基底基板上的导电和反射基底基板和n型氮化镓（GaN）层。

公开(公告)号：US20130029473A1

公开(公告)日：2013-01-31

申请号：US13558932

申请日：2012-07-26

Applicant: Dong-Woon KIM ,  Donghyun Kim ,  Mikyoung Kim ,  MINJU KIM ,  SEUNG YONG PARK ,  Seulgi Bae ,  JOONG WON SHUR ,  Yulia Yu ,  Bohyun Lee ,  BONGHEE JANG

Inventor： Dong-Woon KIM ,  Donghyun Kim ,  Mikyoung Kim ,  MINJU KIM ,  SEUNG YONG PARK ,  Seulgi Bae ,  JOONG WON SHUR ,  Yulia Yu ,  Bohyun Lee ,  BONGHEE JANG

IPC: H01L21/304 ,  H01L21/265

CPC classification number: H01L21/2654 ,  H01L21/324 ,  H01L21/76254 ,  H01L33/0095

Abstract: A method of cleaving a substrate and a method of manufacturing a bonded substrate using the same, in which warping in a cleaved substrate is reduced. The method includes the following steps of: forming an ion implantation layer by implanting ions into a substrate; annealing the substrate in which the ion implantation layer is formed; implanting ions again into the ion implantation layer of the substrate; and cleaving the substrate along the ion implantation layer by heating the substrate into which ions are implanted.

Abstract translation: 切割基板的方法和使用该方法制造键合衬底的方法，其中在劈裂的衬底中的翘曲减小。 该方法包括以下步骤：通过将离子注入衬底形成离子注入层; 对其中形成离子注入层的衬底进行退火; 将离子再次注入到衬底的离子注入层中; 并且通过加热注入离子的衬底沿离子注入层切割衬底。