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公开(公告)号：US06208501B1
公开(公告)日：2001-03-27
申请号：US09332406
申请日：1999-06-14
IPC分类号： H01G4005
CPC分类号： H01G4/35 , H01G4/06 , H05K3/3442 , H05K2201/09954 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A standing axial-leaded surface mount capacitor is formed of a dielectric chip capacitor sandwiched between first and second blocks. The end blocks have profiles to match the profile of said chip capacitor. The end blocks are conductive at least on their outer surfaces and serve as leads to attaching to metallic surface traces of a printed circuit. In one preferred embodiment, the end blocks are ceramic cubes with metallic surfaces on its faces. The metallized cubes give the device rotational symmetry about its long axis, so that the capacitor will have identical performance in any orientation. This feature makes it possible to automatically pick and place the device onto a circuit board. Preferably, the dielectric chip has a square profile of the same dimension as the ceramic cubes. The profile of the cubes and the chip can be 20 to 25 mils to match the width of a typical printed circuit trace. The capacitors can be of any typical value, i.e., between 0.05 and 300 pf.
摘要翻译： 立体轴向引线的表面贴装电容器由夹在第一和第二块之间的介质芯片电容器形成。 端块具有与所述芯片电容器的轮廓匹配的轮廓。 端块至少在其外表面上是导电的，并且用作连接到印刷电路的金属表面迹线的引线。 在一个优选实施例中，端块是其表面上具有金属表面的陶瓷立方体。 金属化立方体使得器件围绕其长轴旋转对称，使得电容器在任何取向上具有相同的性能。 该功能可以自动将设备拾取并放置到电路板上。 优选地，电介质芯片具有与陶瓷立方体相同尺寸的正方形轮廓。 立方体和芯片的轮廓可以为20至25密耳，以匹配典型印刷电路迹线的宽度。 电容器可以是任何典型值，即在0.05和300pf之间。
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公开(公告)号：US3967939A
公开(公告)日：1976-07-06
申请号：US571162
申请日：1975-04-24
摘要： The subject invention relates to a method and apparatus for removing hot exhaust treatment gases containing tin or titanium compounds associated with glass making operations. The apparatus and method herein described comprises exhausting the treatment gases through a plurality of directed fluid treating patterns whereby the hydroscopic materials are hydrated forming aggregates and the suspended particles are wetted, passing the exhausted gases over a supply of a treating fluid whereby some of the aggregates and wetted particles are removed, exposing thereafter the exhausted gases to ions in an electrostatic field so that the remaining aggregates and wetted particles are charged and travel under the influence of the field, and removing the charged aggregates and particles by a descending fluid film.
摘要翻译： 本发明涉及一种用于去除与玻璃制造操作相关的含有锡或钛化合物的热废气处理气体的方法和装置。 本文所述的装置和方法包括通过多个定向流体处理图案排出处理气体，由此吸湿材料被水合形成聚集体并且悬浮颗粒被润湿，使排出的气体通过处理流体的供应，由此一些聚集体 并且去除湿润的颗粒，然后在静电场中将排出的气体暴露于离子，使得剩余的聚集体和润湿颗粒在场的影响下被带电并行进，并且通过下降的流体膜去除带电的聚集体和颗粒。
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