SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS
    2.
    发明申请
    SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS 有权
    超导集成电路制造系统与方法

    公开(公告)号:US20110089405A1

    公开(公告)日:2011-04-21

    申请号:US12992049

    申请日:2010-02-25

    IPC分类号: H01L39/22 H01L39/24

    摘要: Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.

    摘要翻译: 各种技术和设备允许制造超导电路和结构,例如约瑟夫逊结,其可以例如在量子计算机中有用。 例如,可以制造具有插入在能够超导的两个元件或层之间的电介质结构或层的低磁通量噪声三层结构。 超导通孔可以直接覆盖约瑟夫逊结。 诸如约瑟夫逊结的结构可以承载在平坦化的电介质层上。 可以使用翅片来除去结构中的热量。 能够超导的通孔可以具有小于约1微米的宽度。 该结构可以例如通过通孔和/或带连接器耦合到电阻器。