公开(公告)号：US07554194B2

公开(公告)日：2009-06-30

申请号：US11557884

申请日：2006-11-08

申请人： Michael G. Kelly ,  Ki Wook Lee ,  Chang Ho Jang

发明人： Michael G. Kelly ,  Ki Wook Lee ,  Chang Ho Jang

IPC分类号： H01L23/36

CPC分类号： H01L23/13 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has a substrate having a first surface, a second surface, and a through hole opening. A heat spreader has a first surface, a second surface, and a plurality of notches formed on the second surface. A semiconductor die is coupled to the first surface of the heat spreader. The semiconductor die is electrically coupled to the substrate. An encapsulant is used to cover portions of the first surface of the substrate, portions of the first surface of the heat spreader, and the semiconductor die. A first set of solder balls is coupled to the second surface of the substrate. A second set of solder balls is coupled to the second surface of the heat spreader wherein the second set of solder balls is located in the notches.

摘要翻译： 半导体封装具有具有第一表面，第二表面和通孔开口的基板。 散热器具有形成在第二表面上的第一表面，第二表面和多个凹口。 半导体管芯耦合到散热器的第一表面。 半导体管芯电耦合到衬底。 密封剂用于覆盖基板的第一表面的部分，散热器的第一表面的部分和半导体管芯。 第一组焊球耦合到衬底的第二表面。 第二组焊球联接到散热器的第二表面，其中第二组焊球位于凹口中。

公开(公告)号：US20080122068A1

公开(公告)日：2008-05-29

申请号：US11557884

申请日：2006-11-08

申请人： Michael G. Kelly ,  Ki Wook Lee ,  Chang Ho Jang

发明人： Michael G. Kelly ,  Ki Wook Lee ,  Chang Ho Jang

IPC分类号： H01L23/36

CPC分类号： H01L23/13 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has a substrate having a first surface, a second surface, and a through hole opening. A heat spreader has a first surface, a second surface, and a plurality of notches formed on the second surface. A semiconductor die is coupled to the first surface of the heat spreader. The semiconductor die is electrically coupled to the substrate. An encapsulant is used to cover portions of the first surface of the substrate, portions of the first surface of the heat spreader, and the semiconductor die. A first set of solder balls is coupled to the second surface of the substrate. A second set of solder balls is coupled to the second surface of the heat spreader wherein the second set of solder balls is located in the notches.

摘要翻译： 半导体封装具有具有第一表面，第二表面和通孔开口的基板。 散热器具有形成在第二表面上的第一表面，第二表面和多个凹口。 半导体管芯耦合到散热器的第一表面。 半导体管芯电耦合到衬底。 密封剂用于覆盖基板的第一表面的部分，散热器的第一表面的部分和半导体管芯。 第一组焊球耦合到衬底的第二表面。 第二组焊球联接到散热器的第二表面，其中第二组焊球位于凹口中。

公开(公告)号：US06370720B1

公开(公告)日：2002-04-16

申请号：US09288141

申请日：1999-04-08

申请人： Chang-ho Jang

发明人： Chang-ho Jang

IPC分类号： A47L1138

CPC分类号： B43L21/00

摘要： An automatic blackboard erasing apparatus reciprocates, or moves back and forth, horizontally on a blackboard. The automatic blackboard erasing apparatus incorporates a housing, right and left erasing elements each having one or more brushes and one or more wiper members, a variable contact element for controlling the contact state of the erasing elements relative to the blackboard, a washing liquid supplier for providing washing liquid between the brushes and the surface of the blackboard, and a controller for controlling the operation of the erasing apparatus. When the erasing apparatus traverses to the right of the blackboard to erase the blackboard, the left erasing element is in contact with the blackboard, and the right erasing element is not in contact with the blackboard. When the erasing apparatus traverses to the left of the blackboard to erase the blackboard, the right erasing element is in contact with the blackboard.

摘要翻译： 自动黑板擦除装置在黑板上水平地往复移动或前后移动。 自动黑板擦除装置包括：具有一个或多个刷子和一个或多个擦拭器部件的外壳，左右擦除元件，用于控制擦除元件相对于黑板的接触状态的可变接触元件，用于 在刷子和黑板的表面之间提供清洗液，以及用于控制擦除装置的操作的控制器。 当擦除装置穿过黑板的右侧以擦除黑板时，左擦除元件与黑板接触，右擦除元件不与黑板接触。 当擦除装置穿过黑板的左侧以擦除黑板时，正确的擦除元件与黑板接触。