利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.017 秒)

    Method and system for improving process control for semiconductor manufacturing operations
    2.
    发明授权
    Method and system for improving process control for semiconductor manufacturing operations 失效
    用于改进半导体制造操作的过程控制的方法和系统

    公开(公告)号：US07010382B2

    公开(公告)日：2006-03-07

    申请号：US10787699

    申请日：2004-02-26

    申请人： Chang Yung Cheng ,  Bob Tseng

    发明人： Chang Yung Cheng ,  Bob Tseng

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/32182 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/22

    摘要： A method and system are disclosed for configuring manufacturing tools in a semiconductor manufacturing flow. After collecting information with regard to one or more product performance features associated with a processing step performed in a process tool, one or more undesired process tool performance excursion patterns may be determined based on the collected information. On the other hand, operational and processing parameters of the process tool are monitored while conducting the processing step. Non-conformance faults of the monitored operational and processing conditions are detected and classified. A correlation between the classified non-conformance faults with the determined excursion patterns is made for adjusting one or more processing parameters of the processing tool.

    摘要翻译： 公开了用于在半导体制造流程中配置制造工具的方法和系统。 在收集关于与处理工具中执行的处理步骤相关联的一个或多个产品性能特征的信息之后，可以基于收集的信息来确定一个或多个不期望的过程工具性能偏移模式。 另一方面，在进行处理步骤时监视处理工具的操作和处理参数。 检测和分类监控的操作和处理条件的不合格故障。 进行分类的不一致性故障与确定的偏移模式之间的相关性，用于调整处理工具的一个或多个处理参数。

    Method and system for virtual metrology in semiconductor manufacturing
    3.
    发明授权
    Method and system for virtual metrology in semiconductor manufacturing 有权
    半导体制造中的虚拟计量方法与系统

    公开(公告)号：US07359759B2

    公开(公告)日：2008-04-15

    申请号：US11378833

    申请日：2006-03-17

    申请人： Chang Yung Cheng ,  Hsueh-Shih Fu ,  Ying-Lang Wang ,  Fan-Tien Cheng

    发明人： Chang Yung Cheng ,  Hsueh-Shih Fu ,  Ying-Lang Wang ,  Fan-Tien Cheng

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/32193 ,  G05B2219/45031 ,  Y02P90/22

    摘要： Provided are a method and a system for virtual metrology in semiconductor manufacturing. Process data and metrology data are received. Prediction data is generated based on the process data and metrology data using a learning control model. The system for virtual metrology in a fabrication facility comprises a fault detection and classification system operable to receive process data, a statistical process control system operable to perform statistical process control on a history of physical metrology data to form metrology data, and a virtual metrology application operable to generate prediction data based on the process data and the metrology data using a learning control model.

    摘要翻译： 提供半导体制造中虚拟计量的方法和系统。 接收过程数据和度量数据。 使用学习控制模型，基于过程数据和度量数据生成预测数据。 制造设施中的虚拟计量系统包括可操作以接收过程数据的故障检测和分类系统，可操作以对物理计量数据的历史执行统计过程控制以形成度量数据的统计过程控制系统，以及虚拟计量应用 可操作以使用学习控制模型基于过程数据和度量数据生成预测数据。

    Method and system for improving process control for semiconductor manufacturing operations
    5.
    发明申请
    Method and system for improving process control for semiconductor manufacturing operations 失效
    用于改进半导体制造操作的过程控制的方法和系统

    公开(公告)号：US20050192698A1

    公开(公告)日：2005-09-01

    申请号：US10787699

    申请日：2004-02-26

    申请人： Chang Yung Cheng ,  Bob Tseng

    发明人： Chang Yung Cheng ,  Bob Tseng

    IPC分类号： G05B19/418 ,  G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/32182 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/22

    摘要： A method and system are disclosed for configuring manufacturing tools in a semiconductor manufacturing flow. After collecting information with regard to one or more product performance features associated with a processing step performed in a process tool, one or more undesired process tool performance excursion patterns may be determined based on the collected information. On the other hand, operational and processing parameters of the process tool are monitored while conducting the processing step. Non-conformance faults of the monitored operational and processing conditions are detected and classified. A correlation between the classified non-conformance faults with the determined excursion patterns is made for adjusting one or more processing parameters of the processing tool.

    摘要翻译： 公开了用于在半导体制造流程中配置制造工具的方法和系统。 在收集关于与处理工具中执行的处理步骤相关联的一个或多个产品性能特征的信息之后，可以基于收集的信息来确定一个或多个不期望的过程工具性能偏移模式。 另一方面，在进行处理步骤时监视处理工具的操作和处理参数。 检测和分类监控的操作和处理条件的不合格故障。 进行分类的不一致性故障与确定的偏移模式之间的相关性，用于调整处理工具的一个或多个处理参数。