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公开(公告)号：US09422729B2
公开(公告)日：2016-08-23
申请号：US13978498
申请日：2011-06-13
申请人： Hyun-Jong Kwon , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee , Cheng-Zhe Huang
发明人： Hyun-Jong Kwon , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee , Cheng-Zhe Huang
CPC分类号： E04F15/12 , B32B5/16 , B32B7/12 , B32B27/12 , B32B27/18 , B32B27/36 , B32B2255/10 , B32B2255/26 , B32B2307/412 , B32B2471/00 , E04F15/105 , E04F15/107 , Y10T428/2481 , Y10T428/24876 , Y10T428/24893
摘要： Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.
摘要翻译： 本文公开了使用PLA树脂的镶嵌镶嵌地板材料。 镶嵌地板材料的镶嵌材料包括从地板材料顶部的镶嵌层，尺寸稳定层和基层，其中，所述芯片镶嵌层和基层中的至少一个包括聚乳酸（PLA）树脂作为 粘合剂
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公开(公告)号：US09309628B2
公开(公告)日：2016-04-12
申请号：US13126717
申请日：2009-10-27
申请人： Cheng Zhe Huang , Si Young Lee , Phan Seok Kim
发明人： Cheng Zhe Huang , Si Young Lee , Phan Seok Kim
CPC分类号： D21H27/20 , B32B3/10 , B32B27/10 , B32B27/308 , B32B27/36 , Y10T428/24802 , Y10T428/25 , Y10T428/251 , Y10T428/266 , Y10T428/31504 , Y10T428/31855 , Y10T428/31971 , Y10T428/31993 , Y10T442/674
摘要： The present invention relates to wallpaper and a method for manufacturing the same. The wallpaper may be manufactured at low energy and low costs regardless of an increase in oil price and does not produce greenhouse gases and hazardous substances in the course of manufacture, use or disposal, or during fire. In addition, the wallpaper can decompose readily in the natural environment, even when buried.
摘要翻译： 壁纸及其制造方法技术领域本发明涉及壁纸及其制造方法。 壁纸可以低能耗和低成本制造，不管油价上涨，并且在制造，使用或处置过程中或在火灾期间不产生温室气体和有害物质。 此外，即使在埋藏时，壁纸也能在自然环境中轻易分解。
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公开(公告)号：US09623635B2
公开(公告)日：2017-04-18
申请号：US13510049
申请日：2011-03-07
申请人： Cheng-Zhe Huang , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Hyun-Jong Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee
发明人： Cheng-Zhe Huang , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Hyun-Jong Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee
IPC分类号： B32B27/36 , B32B5/16 , B32B27/06 , B32B21/02 , B32B21/08 , B32B27/30 , B32B27/40 , E04F15/10
CPC分类号： B32B21/02 , B32B21/08 , B32B27/308 , B32B27/40 , B32B2260/026 , B32B2260/046 , B32B2307/584 , B32B2471/00 , E04F15/102 , Y10T428/253 , Y10T428/263 , Y10T428/31591 , Y10T428/3179
摘要： Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
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公开(公告)号：US09517612B2
公开(公告)日：2016-12-13
申请号：US13634485
申请日：2011-03-15
申请人： Cheng-Zhe Huang , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Hyun-Jong Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee
发明人： Cheng-Zhe Huang , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Hyun-Jong Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee
CPC分类号： B32B27/36 , B32B2307/412 , B32B2471/00 , E04F15/105 , E04F15/107 , Y10T428/24868
摘要： Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.
摘要翻译： 公开了使用环保型PLA树脂的地板材料。 根据本发明，使用PLA树脂的地板材料包括：基层; 印刷层，其形成在所述基底层的顶部，并且在其上侧具有印刷图案; 以及形成在所述印刷层的顶部的透明层，其中所述基材层，所述印刷层和所述透明层中的一个或多个包括聚乳酸（PLA）树脂。
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公开(公告)号：US20120231256A1
公开(公告)日：2012-09-13
申请号：US13510049
申请日：2011-03-07
申请人： Cheng-Zhe Huang , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Hyun-Jong Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee
发明人： Cheng-Zhe Huang , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Hyun-Jong Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee
CPC分类号： B32B21/02 , B32B21/08 , B32B27/308 , B32B27/40 , B32B2260/026 , B32B2260/046 , B32B2307/584 , B32B2471/00 , E04F15/102 , Y10T428/253 , Y10T428/263 , Y10T428/31591 , Y10T428/3179
摘要： Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
摘要翻译： 公开了使用PLA树脂的芯片地板材料，其通过使用PLA树脂是环境友好的，并且可以实现天然木材的质感和独特的树木香味。 根据本发明，使用PLA树脂的芯片通过地板材料包括：芯片通过层; 以及形成在所述芯片贯通层的表面上的表面处理层，其中所述芯片通孔层包括PLA树脂。
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公开(公告)号：US20130004751A1
公开(公告)日：2013-01-03
申请号：US13634485
申请日：2011-03-15
申请人： Cheng-Zhe Huang , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Hyun-Jong Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee
发明人： Cheng-Zhe Huang , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Hyun-Jong Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee
CPC分类号： B32B27/36 , B32B2307/412 , B32B2471/00 , E04F15/105 , E04F15/107 , Y10T428/24868
摘要： Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.
摘要翻译： 公开了使用环保型PLA树脂的地板材料。 根据本发明，使用PLA树脂的地板材料包括：基层; 印刷层，其形成在所述基底层的顶部，并且在其上侧具有印刷图案; 以及形成在所述印刷层的顶部的透明层，其中所述基材层，所述印刷层和所述透明层中的一个或多个包括聚乳酸（PLA）树脂。
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公开(公告)号：US20130004703A1
公开(公告)日：2013-01-03
申请号：US13634465
申请日：2011-03-30
申请人： Hyun-Jong Kwon , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee , Cheng Zhe Huang
发明人： Hyun-Jong Kwon , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee , Cheng Zhe Huang
IPC分类号： B32B27/36 , B32B15/08 , B32B27/08 , B32B21/02 , B32B27/12 , B32B5/12 , B32B3/26 , B32B17/02 , B32B3/06 , B32B3/10 , B32B18/00 , B32B7/12
CPC分类号： B32B15/08 , B32B9/045 , B32B13/12 , B32B21/08 , B32B27/065 , B32B27/12 , B32B2262/101 , B32B2419/04 , B32B2471/00 , Y10T428/24066 , Y10T428/24612 , Y10T428/24802 , Y10T428/249982 , Y10T428/27 , Y10T428/31515 , Y10T428/31522 , Y10T428/31565 , Y10T428/31616 , Y10T428/31667 , Y10T428/31786 , Y10T428/31797 , Y10T442/3862
摘要： The present invention relates to a board complex having a polylactic acid (PLA) cover. The board complex includes: a cover member having at least one layer containing a PLA resin; and a board formed beneath the cover member, wherein the material for the board is selected from medium-density fiberboard (MDF), plywood, asbestos-free cellulose fiber reinforced cement board, magnesium board, glued laminated timber, high density fiberboard (HDF), particle board, ceramic tile, porcelain tile, ceramic board, and click-fastened board.
摘要翻译： 本发明涉及具有聚乳酸（PLA）覆盖层的基板复合体。 板复合体包括：具有至少一层含有PLA树脂的层的盖构件; 以及形成在盖构件下方的板，其中用于板的材料选自中密度纤维板（MDF），胶合板，无石棉纤维素纤维增强水泥板，镁板，胶合层压木材，高密度纤维板（HDF） ，刨花板，瓷砖，瓷砖，陶瓷板和点击式紧固板。
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公开(公告)号：US20130302577A1
公开(公告)日：2013-11-14
申请号：US13978498
申请日：2011-06-13
申请人： Hyun-Jong Kwon , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee , Cheng-Zhe Huang
发明人： Hyun-Jong Kwon , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee , Cheng-Zhe Huang
CPC分类号： E04F15/12 , B32B5/16 , B32B7/12 , B32B27/12 , B32B27/18 , B32B27/36 , B32B2255/10 , B32B2255/26 , B32B2307/412 , B32B2471/00 , E04F15/105 , E04F15/107 , Y10T428/2481 , Y10T428/24876 , Y10T428/24893
摘要： Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.
摘要翻译： 本文公开了使用PLA树脂的镶嵌镶嵌地板材料。 镶嵌地板材料的镶嵌材料包括从地板材料顶部的镶嵌层，尺寸稳定层和基层，其中，所述芯片镶嵌层和基层中的至少一个包括聚乳酸（PLA）树脂作为 粘合剂
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公开(公告)号：US20110217523A1
公开(公告)日：2011-09-08
申请号：US13126717
申请日：2009-10-27
申请人： Cheng Zhe Huang , Si Young Lee , Phan Seok Kim
发明人： Cheng Zhe Huang , Si Young Lee , Phan Seok Kim
CPC分类号： D21H27/20 , B32B3/10 , B32B27/10 , B32B27/308 , B32B27/36 , Y10T428/24802 , Y10T428/25 , Y10T428/251 , Y10T428/266 , Y10T428/31504 , Y10T428/31855 , Y10T428/31971 , Y10T428/31993 , Y10T442/674
摘要： The present invention relates to wallpaper and a method for manufacturing the same. The wallpaper may be manufactured at low energy and low costs regardless of an increase in oil price and does not produce greenhouse gases and hazardous substances in the course of manufacture, use or disposal, or during fire. In addition, the wallpaper can decompose readily in the natural environment, even when buried.
摘要翻译： 壁纸及其制造方法技术领域本发明涉及壁纸及其制造方法。 壁纸可以低能耗和低成本制造，不管油价上涨，并且在制造，使用或处置过程中或在火灾期间不产生温室气体和有害物质。 此外，即使在埋藏时，壁纸也能在自然环境中轻易分解。
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