Optical sub-assembly module for suppressing optical back-reflection and effectively guiding light from light source to optical waveguide
    1.
    发明授权
    Optical sub-assembly module for suppressing optical back-reflection and effectively guiding light from light source to optical waveguide 失效
    用于抑制光学背反射并有效地将光从光源引导到光波导的光学子组件模块

    公开(公告)号:US06945710B2

    公开(公告)日:2005-09-20

    申请号:US10341477

    申请日:2003-01-10

    CPC classification number: G02B6/4207

    Abstract: An optical sub-assembly (OSA) module for suppressing optical back-reflection and effectively guiding light from a light source to an optical waveguide is disclosed. The module comprises a light source for emitting light to said optical waveguide and at least one light transmitting element installed between said light source and said optical waveguide. The at least one light transmitting element is arranged to have a configuration for avoiding light to reflect back to the light source and to cause a light beam from said light source to point to said core of said optical waveguide. Thereby, the working distance is increased, and the assembling process of the OSA module is simplified. This new optical design scheme will greatly improve the optical characteristics of an OSA module, increase the optical transceiver propagation distance, and reduce the difficulty of OSA assembly process.

    Abstract translation: 公开了一种用于抑制光学背反射并有效地将光从光源引导到光波导的光学子组件(OSA)模块。 该模块包括用于向所述光波导发射光的光源和安装在所述光源和所述光波导之间的至少一个光传输元件。 所述至少一个光传输元件被布置成具有用于避免光反射回光源并使来自所述光源的光束指向所述光波导的所述芯的构造。 因此,工作距离增加,并且简化了OSA模块的组装过程。 这种新的光学设计方案将大大提高OSA模块的光学特性,增加光收发器的传播距离,降低OSA装配过程的难度。

    OPTOELECTRONIC DEVICE WITH IMPROVED LENS CAP
    3.
    发明申请
    OPTOELECTRONIC DEVICE WITH IMPROVED LENS CAP 审中-公开
    具有改进的镜头盖的光电装置

    公开(公告)号:US20130258474A1

    公开(公告)日:2013-10-03

    申请号:US13438686

    申请日:2012-04-03

    CPC classification number: H01L31/0203 H01S5/02212 H01S5/02288

    Abstract: An optoelectronic device includes a base part and a lens cap. The base part has an optoelectronic chip mounted thereon. The lens cap is mounted over the optoelectronic chip and includes a metallic hollow cylindrical part and a plastic inner cylindrical part. The hollow cylindrical part has an opening on a top thereof. The inner cylindrical part is firmly coupled within the hollow cylindrical part, and the inner cylindrical part has a lens part located within the opening and at least three aligning members in contact with an upper circumference of the base part so as to align the lens part with the optoelectronic chip.

    Abstract translation: 光电器件包括基部和透镜盖。 基座部分安装有光电芯片。 透镜盖安装在光电芯片上,并且包括金属中空圆柱形部分和塑料内圆柱形部分。 中空圆柱形部件在其顶部上具有开口。 内圆柱形部分牢固地联接在中空圆柱形部分内,并且内圆柱形部分具有位于开口内的透镜部分,并且至少三个对准部件与基部的上圆周接触,以使透镜部分与 光电芯片。

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