中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

21 records (took 0.018 seconds)

    LED ASSEMBLY AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    LED ASSEMBLY AND MANUFACTURING METHOD THEREOF 有权
    LED组装及其制造方法

    公开(公告)号：US20120025257A1

    公开(公告)日：2012-02-02

    申请号：US13024261

    申请日：2011-02-09

    Applicant: Cheng-Tao Wu ,  Fon-Jein Hsieh ,  Xue-Mei Guo

    Inventor： Cheng-Tao Wu ,  Fon-Jein Hsieh ,  Xue-Mei Guo

    IPC: H01L33/62 ,  H01L33/48

    CPC classification number: H01L33/642 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

    Abstract: An LED assembly including a heat sink, a surface treatment dielectric layer, an electrically conductive layer, a thermally conductive layer and an LED chip. The surface treatment dielectric layer is disposed on an upper surface of the heat sink and defines at least one first through hole to expose a portion of the upper surface. The electrically conductive layer is formed on the surface treatment dielectric layer, includes a plurality of electrical traces and defines at least one second through hole corresponding to the first through hole. The thermally conductive layer is formed in the first and the second through holes and directly contacted with a portion of the upper surface exposed from the overlapped region of the first through hole and the second through hole. The LED chip includes a plurality of electrodes electrically connected to the electrical traces and is directly contacted with the thermally conductive layer.

    Abstract translation: 一种LED组件，包括散热器，表面处理电介质层，导电层，导热层和LED芯片。 表面处理电介质层设置在散热器的上表面上并且限定至少一个第一通孔以暴露上表面的一部分。 所述导电层形成在所述表面处理电介质层上，包括多个电迹线并限定与所述第一通孔对应的至少一个第二通孔。 导热层形成在第一通孔和第二通孔中，并且与从第一通孔和第二通孔的重叠区域露出的上表面的一部分直接接触。 LED芯片包括电连接到电迹线并与导热层直接接触的多个电极。

    Mobile phones
    4.
    发明申请
    Mobile phones 审中-公开
    手机

    公开(公告)号：US20060252463A1

    公开(公告)日：2006-11-09

    申请号：US11416323

    申请日：2006-05-03

    Applicant: Kuo-Hung Liao ,  Cheng-Tao Wu

    Inventor： Kuo-Hung Liao ,  Cheng-Tao Wu

    IPC: H04B1/38 ,  H04M1/00 ,  H04K3/00

    CPC classification number: H04M1/0202 ,  H04M19/04 ,  H04M19/047

    Abstract: Mobile phones are provided. A mobile phone, switchable between a standard mode and a vibration mode, includes a main body and a movable anti-slip member. The anti-slip member connects to the main body and is movable between a first position and a second position. When the mobile phone is in standard mode, the anti-slip member is situated in the first position and hidden in the main body. When the mobile phone is switched from standard mode to vibration mode, the anti-slip member moves from the first position to the second position and protrudes from the main body.

    Abstract translation: 提供手机。 可在标准模式和振动模式之间切换的移动电话包括主体和可动防滑部件。 防滑构件连接到主体并且能够在第一位置和第二位置之间移动。 当手机处于标准模式时，防滑构件位于第一位置并隐藏在主体中。 当手机从标准模式切换到振动模式时，防滑构件从第一位置移动到第二位置并从主体突出。

    CONNECTOR MOUNTING APPARATUS WITH EMI SHIELDING CLIP
    6.
    发明申请
    CONNECTOR MOUNTING APPARATUS WITH EMI SHIELDING CLIP 失效
    带EMI屏蔽夹的连接器安装设备

    公开(公告)号：US20120238133A1

    公开(公告)日：2012-09-20

    申请号：US13274548

    申请日：2011-10-17

    Applicant: CONG CAO ,  YA-NI ZHANG ,  CHENG-TAO WU ,  YI-FANG WU

    Inventor： CONG CAO ,  YA-NI ZHANG ,  CHENG-TAO WU ,  YI-FANG WU

    IPC: H01R13/60

    CPC classification number: H01R13/518 ,  H01R13/514 ,  H01R13/6582

    Abstract: A connector mounting apparatus includes a mounting bracket and a receiving member. A receiving space is defined in the mounting bracket. The receiving member includes a main body, a first resilient resisting tab extending outward from a base panel of the main body, and a first resilient contacting tab extending inward from the base panel to resiliently abut a connector interface received inside the main body. The main body is received in the receiving space and the first resisting tab resiliently abuts an inner surface of the receiving space.

    Abstract translation: 连接器安装装置包括安装支架和接收构件。 在安装支架中定义了一个接收空间。 接收构件包括主体，从主体的基板向外延伸的第一弹性阻挡片，以及从底板向内延伸的第一弹性接触片，以弹性地邻接容纳在主体内的连接器接口。 主体被容纳在接收空间中，第一阻力片弹性地邻接接收空间的内表面。

    Method for Producing Internal Antenna with Anti-Electromagnetic Interference Property Through Vacuum Process
    7.
    发明申请
    Method for Producing Internal Antenna with Anti-Electromagnetic Interference Property Through Vacuum Process 审中-公开
    通过真空过程制造具有抗电磁干扰性能的内部天线的方法

    公开(公告)号：US20090101494A1

    公开(公告)日：2009-04-23

    申请号：US12176708

    申请日：2008-07-21

    Applicant: Cheng-Tao WU ,  Ping-Chen CHANG

    Inventor： Cheng-Tao WU ,  Ping-Chen CHANG

    IPC: C23C14/34

    CPC classification number: H01Q1/2266

    Abstract: A method for producing an internal antenna with an anti-electromagnetic interference property by performing a vacuum process, which includes (1) performing a surface pretreatment process on an insulating substrate to clean the surface thereof, (2) placing the substrate into a vacuum chamber, and performing a first plasma bombardment by using a conductive target material; (3) placing the substrate into another vacuum chamber, and performing a second plasma bombardment by using a passivation target material; (4) removing a certain part of the passivation layer and the conductive layer, such that a planar antenna pattern is remained with a certain distance spaced apart from the surrounding passivation layer and conductive layer. The conductive layer and the passivation layer cover the surface of the substrate for completely shielding the electromagnetic interference, and meanwhile, the planar shape of the antenna saves the cost and the available space within the housing.

    Abstract translation: 一种通过进行真空处理来制造具有抗电磁干扰性的内部天线的方法，其特征在于，包括：（1）对绝缘基板进行表面处理处理，以清洁其表面，（2）将基板放置在真空室 并且通过使用导电靶材料进行第一等离子体轰击; （3）将基板放置到另一个真空室中，并通过使用钝化靶材料进行第二等离子体轰击; （4）去除钝化层和导电层的某一部分，使得与周围的钝化层和导电层间隔一定距离保留平面天线图案。 导电层和钝化层覆盖基板的表面，以完全屏蔽电磁干扰，同时天线的平面形状节省了外壳内的成本和可用空间。

    Connector mounting apparatus having a bracket with recesses abutting resisting tabs of a member received therein
    8.
    发明授权
    Connector mounting apparatus having a bracket with recesses abutting resisting tabs of a member received therein 失效
    连接器安装装置具有支架，其具有与其中容纳的部件的抵接片抵接的凹部

    公开(公告)号：US08444439B2

    公开(公告)日：2013-05-21

    申请号：US13274548

    申请日：2011-10-17

    Applicant: Cong Cao ,  Ya-Ni Zhang ,  Cheng-Tao Wu ,  Yi-Fang Wu

    Inventor： Cong Cao ,  Ya-Ni Zhang ,  Cheng-Tao Wu ,  Yi-Fang Wu

    IPC: H01R4/66 ,  H01R13/648

    CPC classification number: H01R13/518 ,  H01R13/514 ,  H01R13/6582

    Abstract: A connector mounting apparatus includes a mounting bracket and a receiving member. A receiving space is defined in the mounting bracket. The receiving member includes a main body, a first resilient resisting tab extending outward from a base panel of the main body, and a first resilient contacting tab extending inward from the base panel to resiliently abut a connector interface received inside the main body. The main body is received in the receiving space and the first resisting tab resiliently abuts an inner surface of the receiving space.

    Abstract translation: 连接器安装装置包括安装支架和接收构件。 在安装支架中定义了一个接收空间。 接收构件包括主体，从主体的基板向外延伸的第一弹性阻挡片，以及从底板向内延伸的第一弹性接触片，以弹性地邻接容纳在主体内部的连接器接口。 主体被容纳在接收空间中，第一阻力片弹性地邻接接收空间的内表面。

    LED assembly and manufacturing method thereof
    10.
    发明授权
    LED assembly and manufacturing method thereof 有权
    LED组装及其制造方法

    公开(公告)号：US08324724B2

    公开(公告)日：2012-12-04

    申请号：US13024261

    申请日：2011-02-09

    Applicant: Cheng-Tao Wu ,  Fon-Jein Hsieh ,  Xue-Mei Guo

    Inventor： Cheng-Tao Wu ,  Fon-Jein Hsieh ,  Xue-Mei Guo

    IPC: H01L21/00

    CPC classification number: H01L33/642 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

    Abstract: An LED assembly including a heat sink, a surface treatment dielectric layer, an electrically conductive layer, a thermally conductive layer and an LED chip. The surface treatment dielectric layer is disposed on an upper surface of the heat sink and defines at least one first through hole to expose a portion of the upper surface. The electrically conductive layer is formed on the surface treatment dielectric layer, includes a plurality of electrical traces and defines at least one second through hole corresponding to the first through hole. The thermally conductive layer is formed in the first and the second through holes and directly contacted with a portion of the upper surface exposed from the overlapped region of the first through hole and the second through hole. The LED chip includes a plurality of electrodes electrically connected to the electrical traces and is directly contacted with the thermally conductive layer.

    Abstract translation: 一种LED组件，包括散热器，表面处理电介质层，导电层，导热层和LED芯片。 表面处理电介质层设置在散热器的上表面上并且限定至少一个第一通孔以暴露上表面的一部分。 所述导电层形成在所述表面处理电介质层上，包括多个电迹线并限定与所述第一通孔对应的至少一个第二通孔。 导热层形成在第一通孔和第二通孔中，并且与从第一通孔和第二通孔的重叠区域露出的上表面的一部分直接接触。 LED芯片包括电连接到电迹线并与导热层直接接触的多个电极。

Patent Agency Ranking