公开(公告)号：US08879268B2

公开(公告)日：2014-11-04

申请号：US13371497

申请日：2012-02-13

申请人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

发明人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

IPC分类号： H05K7/20

CPC分类号： H05K7/20709 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20545

摘要： The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

摘要翻译： 本发明公开了一种电子机架的冷却系统，包括：电子机架，包括至少一个侧壁; 至少一个电子底盘，其包括顶壁和至少一个侧壁并且设置在所述电子机架内部，用于容纳包括多个电子部件和布置在所述多个电子部件上方的至少一个固定热接口的至少一个模块化电子设备; 布置在所述至少一个电子底盘的顶壁和所述至少一个模块化电子设备之间的第一可拆卸热接口; 以及布置在所述电子机架的所述至少一个侧壁与所述至少一个电子底盘的所述至少一个侧壁之间的至少一个第二可拆卸热接口。

公开(公告)号：US20120250259A1

公开(公告)日：2012-10-04

申请号：US13371497

申请日：2012-02-13

申请人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

发明人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

IPC分类号： H05K7/20

CPC分类号： H05K7/20709 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20545

摘要： The present creation discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

摘要翻译： 本发明公开了一种用于电子机架的冷却系统，包括：包括至少一个侧壁的电子机架; 至少一个电子底盘，其包括顶壁和至少一个侧壁并且设置在所述电子机架内部，用于容纳包括多个电子部件和布置在所述多个电子部件上方的至少一个固定热接口的至少一个模块化电子设备; 布置在所述至少一个电子底盘的顶壁和所述至少一个模块化电子设备之间的第一可拆卸热接口; 以及布置在所述电子机架的所述至少一个侧壁与所述至少一个电子底盘的所述至少一个侧壁之间的至少一个第二可拆卸热接口。