公开(公告)号：US08879268B2

公开(公告)日：2014-11-04

申请号：US13371497

申请日：2012-02-13

申请人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

发明人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

IPC分类号： H05K7/20

CPC分类号： H05K7/20709 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20545

摘要： The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

摘要翻译： 本发明公开了一种电子机架的冷却系统，包括：电子机架，包括至少一个侧壁; 至少一个电子底盘，其包括顶壁和至少一个侧壁并且设置在所述电子机架内部，用于容纳包括多个电子部件和布置在所述多个电子部件上方的至少一个固定热接口的至少一个模块化电子设备; 布置在所述至少一个电子底盘的顶壁和所述至少一个模块化电子设备之间的第一可拆卸热接口; 以及布置在所述电子机架的所述至少一个侧壁与所述至少一个电子底盘的所述至少一个侧壁之间的至少一个第二可拆卸热接口。

公开(公告)号：US20120250259A1

公开(公告)日：2012-10-04

申请号：US13371497

申请日：2012-02-13

申请人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

发明人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

IPC分类号： H05K7/20

CPC分类号： H05K7/20709 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20545

摘要： The present creation discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

摘要翻译： 本发明公开了一种用于电子机架的冷却系统，包括：包括至少一个侧壁的电子机架; 至少一个电子底盘，其包括顶壁和至少一个侧壁并且设置在所述电子机架内部，用于容纳包括多个电子部件和布置在所述多个电子部件上方的至少一个固定热接口的至少一个模块化电子设备; 布置在所述至少一个电子底盘的顶壁和所述至少一个模块化电子设备之间的第一可拆卸热接口; 以及布置在所述电子机架的所述至少一个侧壁与所述至少一个电子底盘的所述至少一个侧壁之间的至少一个第二可拆卸热接口。

公开(公告)号：US08179222B2

公开(公告)日：2012-05-15

申请号：US12615341

申请日：2009-11-10

申请人： Chung-Shu Lee ,  Shih-Chang Lee ,  Chi-Hsien Weng ,  Fu-Teng Hou

发明人： Chung-Shu Lee ,  Shih-Chang Lee ,  Chi-Hsien Weng ,  Fu-Teng Hou

IPC分类号： H01F27/30

CPC分类号： H01F27/2847 ,  H01F27/303

摘要： A transformer with a conductive plate winding structure includes a hollow core pillar, a partition, a conductive plate winding structure, and an insulating layer. The partition is fixed at the hollow core pillar for partitioning the hollow core pillar into two winding areas. The conductive plate winding structure is sheathed to the hollow core pillar and disposed at one of the two winding areas, and comprised of a plurality of conductive plates, and each conductive plate includes a ring having an opening and two conductive terminals extended out from the opening of the ring. The insulating layer is clamped between any two adjacent conductive plates, such that the conductive plates are stacked to from a winding for increasing the rated normal current and enhancing the assembling convenience.

摘要翻译： 具有导电板绕组结构的变压器包括中空芯柱，隔板，导电板绕组结构和绝缘层。 分隔件固定在空心芯柱上，用于将空心芯柱分隔成两个卷绕区域。 导电板绕组结构被套在中空芯柱上并且设置在两个绕组区域中的一个上并且由多个导电板构成，并且每个导电板包括具有开口的环和从开口延伸出的两个导电端子 的戒指 绝缘层被夹在任何两个相邻的导电板之间，使得导电板从绕组堆叠以增加额定正常电流并增强组装方便性。

公开(公告)号：US20110069513A1

公开(公告)日：2011-03-24

申请号：US12562374

申请日：2009-09-18

申请人： Chung-Shu Lee ,  Shih-Chang Lee

发明人： Chung-Shu Lee ,  Shih-Chang Lee

IPC分类号： H02M3/335

CPC分类号： H02M3/33569 ,  Y02B70/1433

摘要： A current-sharing power supply apparatus with a bridge rectifier circuit includes a conversion circuit, a square-wave generating circuit, a resonant circuit, a rectifier circuit, and a filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and at least one secondary winding. The square-wave generating circuit is electrically connected to a DC voltage to switch the DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier circuit has at least four switch components, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a rectified voltage, and the rectified voltage is outputted to at least one voltage output terminal.

摘要翻译： 具有桥式整流电路的分流电源装置包括转换电路，方波发生电路，谐振电路，整流电路和滤波电路。 转换电路具有两个变压器，并且每个变压器具有初级绕组和至少一个次级绕组。 方波发生电路与直流电压电连接，将直流电压切换成脉动电压。 谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。 整流电路具有至少四个开关元件，与变压器次级绕组电连接，将交流输出电压整流为整流电压，整流电压输出至少一个电压输出端子。

公开(公告)号：US20110019439A1

公开(公告)日：2011-01-27

申请号：US12509814

申请日：2009-07-27

申请人： Shih-Chang Lee ,  Chung-Shu Lee

发明人： Shih-Chang Lee ,  Chung-Shu Lee

IPC分类号： H02M3/335

CPC分类号： H02M3/33569 ,  Y02B70/1433

摘要： A power supply apparatus with a current-sharing function includes a conversion circuit, a square-wave generating circuit, a resonant circuit, and a rectifier-filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and two secondary windings. More particularly, two secondary windings of the different transformers are electrically connected in series and then the two in-series secondary windings are electrically connected in parallel. The square-wave generating circuit is used to switch a DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier-filter circuit has at least two switch components and a second capacitor, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a DC output voltage, and the DC output voltage is outputted to at least one output terminal.

摘要翻译： 具有电流共享功能的电源装置包括转换电路，方波发生电路，谐振电路和整流滤波电路。 转换电路具有两个变压器，并且每个变压器具有初级绕组和两个次级绕组。 更具体地，不同变压器的两个次级绕组串联电连接，然后两个串联的次级绕组并联电连接。 方波发生电路用于将直流电压切换为脉动电压。 谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。 整流滤波电路具有至少两个开关部件和第二电容器，并且电连接到变压器的次级绕组以将AC输出电压整流为DC输出电压，并且将DC输出电压输出至少一个输出 终奌站。

公开(公告)号：US07439619B2

公开(公告)日：2008-10-21

申请号：US11028718

申请日：2005-01-03

申请人： Chi-Chih Chu ,  Gwo-Liang Weng ,  Shih-Chang Lee

发明人： Chi-Chih Chu ,  Gwo-Liang Weng ,  Shih-Chang Lee

IPC分类号： H01L23/34

CPC分类号： H01L23/564 ,  H01L21/563 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83102 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip attachment region. At least a baffle is formed on the surface of the chip carrier, between the chip attachment region and the film attachment region. After attaching the thin film to the film attachment region of the chip carrier through an affixture layer, the chip is electrically and physically connected to the chip attachment region of the chip carrier through an adhesive layer. The baffle can effectively prevent the gas that is released from the adhesive layer from damaging the bonding between the thin film and the affixture layer. Therefore, almost no bubbles are formed and good electrical connection between the thin film and the affixture layer is maintained.

摘要翻译： 本发明提供一种电子包装方法。 芯片载体的表面至少包括芯片附着区域和与芯片连接区域相邻的膜附着区域。 在芯片载体的表面上，在芯片安装区域和膜附着区域之间形成至少一个挡板。 在通过粘合层将薄膜附着到芯片载体的膜附着区域之后，芯片通过粘合剂层电连接并且物理地连接到芯片载体的芯片连接区域。 挡板可以有效地防止从粘合剂层释放的气体损害薄膜和固定层之间的粘结。 因此，几乎不形成气泡，并且保持薄膜和附着层之间良好的电连接。

公开(公告)号：US07126221B2

公开(公告)日：2006-10-24

申请号：US10868495

申请日：2004-06-14

申请人： Gwo-Liang Weng ,  Yung-Li Lu ,  Chi-Chih Chu ,  Shih-Chang Lee

发明人： Gwo-Liang Weng ,  Yung-Li Lu ,  Chi-Chih Chu ,  Shih-Chang Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC分类号： H05K3/305 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2924/00014

摘要： A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.

摘要翻译： 一种半导体封装，包括通过倒装芯片接合设置在衬底上的衬底和半导体器件。 本发明的特征在于设置在半导体器件和基板之间的连接结构，该连接结构沿着半导体器件的底表面的周边延伸。 结果，它可以优选地在两者之间提供附加的安装支撑。 连接结构可以由固化的粘合剂形成。 本发明还提供一种半导体封装的制造方法。

公开(公告)号：US07122757B2

公开(公告)日：2006-10-17

申请号：US10868496

申请日：2004-06-14

申请人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

发明人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

IPC分类号： H03K17/975

CPC分类号： H03K17/975 ,  H03K17/98 ,  Y10T428/30

摘要： A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

摘要翻译： 接触传感器封装具有衬底，膜，密封剂和设置在衬底上的多个接触传感器。 接触传感器设置在由基板，膜和密封剂限定的封闭空间内。 接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。 静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。

公开(公告)号：US07019407B2

公开(公告)日：2006-03-28

申请号：US10707609

申请日：2003-12-24

申请人： Yu-Wen Chen ,  Ming-Lun Ho ,  Shih-Chang Lee ,  Chih-Huang Chang

发明人： Yu-Wen Chen ,  Ming-Lun Ho ,  Shih-Chang Lee ,  Chih-Huang Chang

IPC分类号： H01L23/48

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81194 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/112 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/09518 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2224/05599

摘要： A flip chip package structure comprising a chip, a substrate, at least a first bump and a plurality of second bumps is provided. The chip has a first bump-positioning region and the substrate has a second bump-positioning region. The substrate has at least a first hole and multiple second holes. The first hole and the second holes are located within the second bump-positioning region. The first hole has a depth greater than that of the second hole. The first bump is set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The first bump is bonded to the substrate through the first holes. The second bumps are set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The second bumps are bonded to the substrate through the second holes. The first bump has a volume greater than the volume of the second bump.

摘要翻译： 提供了包括芯片，基板，至少第一凸块和多个第二凸块的倒装芯片封装结构。 芯片具有第一凸块定位区域，并且基板具有第二凸起定位区域。 衬底具有至少第一孔和多个第二孔。 第一孔和第二孔位于第二凸起定位区域内。 第一孔的深度大于第二孔的深度。 第一凸块设置在芯片的第一凸点定位区域和衬底的第二凸起定位区域之间。 第一凸起通过第一孔结合到基底。 在芯片的第一凸块定位区域和基板的第二凸块定位区域之间设置第二凸块。 第二凸起通过第二孔结合到基底。 第一凸起的体积大于第二凸块的体积。

公开(公告)号：US07002805B2

公开(公告)日：2006-02-21

申请号：US10747037

申请日：2003-12-30

申请人： Shih-Chang Lee ,  Su Tao ,  Chian-Chi Lin

发明人： Shih-Chang Lee ,  Su Tao ,  Chian-Chi Lin

IPC分类号： H05K7/20

CPC分类号： H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity. The cavity not only accommodates the first package, the first carrier, the second package, the second carrier and the intermediate substrate but also provides alignment mechanism by the supporting portion and the alignment portion to prevent the dislocation after all the components of the thermal enhance MCM package are connected with each other. Furthermore, the first carrier has a first side and the second carrier has a second side. The first side and the second side both have grounding portions, for example recessed portions and metal layers, for providing a ground shielding of the first package and the second package against the outside. In addition, the grounding portions also provide thermal paths to increase the ability of the heat dissipation. Besides, a method for manufacturing the thermal enhance MCM package is provided.

摘要翻译： 热增强多芯片模块（MCM）封装主要包括第一封装，第一载体，第二封装，第二载体，中间基板和帽状散热器。 中间基板具有开口。 第一载体和第二载体分别电连接到第一封装和第二封装。 第二包装被容纳在开口中并且经由第一载体，第二载体和中间载体电连接到第一封装。 帽状散热器具有支撑部分和对准部分，其中支撑部分连接到对准部分以限定空腔。 空腔不仅容纳第一封装，第一载体，第二封装，第二载体和中间基板，而且还通过支撑部分和对准部分提供对准机构，以防止在热增强MCM的所有部件的所有部件之后的位错 包装相互连接。 此外，第一载体具有第一侧，第二载体具有第二侧。 第一侧和第二侧都具有接地部分，例如凹部和金属层，用于提供第一包装和第二包装的接地屏蔽抵抗外部。 此外，接地部分还提供热路径以增加散热能力。 此外，还提供了一种用于制造热增强MCM封装的方法。