公开(公告)号：US20110227118A1

公开(公告)日：2011-09-22

申请号：US13149519

申请日：2011-05-31

申请人： Chia-Fen Hsin

发明人： Chia-Fen Hsin

IPC分类号： H01L33/44

CPC分类号： H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting diode package structure is disclosed. The LED package structure includes a carrier, an LED chip, a first molding compound and a second molding compound. The LED chip is disposed on the carrier. The first molding compound overlays the LED chip, wherein the first molding compound is mixed up with a fluorescent material. The second molding compound overlays the first molding compound.

摘要翻译： 公开了一种发光二极管封装结构。 LED封装结构包括载体，LED芯片，第一模塑料和第二模塑料。 LED芯片设置在载体上。 第一模塑料覆盖LED芯片，其中第一模塑料与荧光材料混合。 第二模塑料覆盖第一模塑料。

公开(公告)号：US20130249387A1

公开(公告)日：2013-09-26

申请号：US13425040

申请日：2012-03-20

申请人： Chia-Fen Hsin ,  Lu-Ming Lai ,  Ying-Zhong Chen

发明人： Chia-Fen Hsin ,  Lu-Ming Lai ,  Ying-Zhong Chen

IPC分类号： H01J1/70 ,  H01J9/00 ,  H01J1/62

CPC分类号： H01L33/505 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light-emitting diode (LED) element including an LED chip having a light emitting surface and at least one pad. A phosphor layer is formed on the light emitting surface and exposes the at least one pad. The phosphor layer includes a plurality of phosphor particles and a matrix. At least some of the phosphor particles have a first portion embedded in the matrix and a second portion protruding from an outer surface of the matrix. A method of forming a gel layer on an LED element includes using capillary action to draw the glue material into a space adjacent the upper surface of the chip.

摘要翻译： 一种发光二极管（LED）元件，包括具有发光表面的LED芯片和至少一个焊盘。 荧光体层形成在发光表面上并使至少一个焊盘露出。 荧光体层包括多个荧光体颗粒和基质。 至少一些荧光体颗粒具有嵌入基质中的第一部分和从基质的外表面突出的第二部分。 在LED元件上形成凝胶层的方法包括使用毛细管作用将胶料吸引到与芯片的上表面相邻的空间中。

公开(公告)号：US20100225230A1

公开(公告)日：2010-09-09

申请号：US12716263

申请日：2010-03-02

申请人： Chia-Fen Hsin

发明人： Chia-Fen Hsin

IPC分类号： H01J1/62 ,  B29C70/00 ,  B29C70/72

CPC分类号： H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A manufacturing method of a light emitting diode package structure is disclosed. First, a carrier and an LED chip are provided, wherein the LED chip is disposed on the carrier. Next, a first molding compound is provided on the LED chip, wherein the first molding compound is mixed up with a fluorescent material. Then, a first baking process to make the first molding compound in semi-cured state is performed. After that, a second molding compound is provided on the first molding compound.

摘要翻译： 公开了一种发光二极管封装结构的制造方法。 首先，提供载体和LED芯片，其中LED芯片设置在载体上。 接下来，在LED芯片上设置第一模塑料，其中第一模塑料与荧光材料混合。 然后，进行使第一成型化合物处于半固化状态的第一烘烤工序。 之后，在第一模塑料上提供第二模塑料。