Abstract:
Film-on-wire (FOW) based IC devices and FOW based methods for IC packaging are described. In an embodiment, a method for packaging an IC dies involves applying a film layer to IC dies and bond wires that are attached to a substrate or a leadframe to form a film-on-wire layer, where the IC dies and the bond wires are enclosed by the film-on-wire layer, and cutting the substrate or the leadframe into IC devices. Other embodiments are also described. The FOW based method for IC packaging can eliminate the need for molding in the IC packaging process and consequently, can reduce the cost of IC packaging and the dimensions of packaged IC devices.
Abstract:
A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.
Abstract:
A vertically adjustable supporting structure that comprises a link member whose bottom and top portions disposed with a lower end and a top end; a lower hinge having at least one shaft pivoted on the lower end of the link member so as to render the link member rotatably pivoted between the two lower frames of the lower hinge; an upper hinge having at least one shaft pivotally connected on the upper end of the link member so as to render the link member rotatably pivoted between the two upper frames of the upper hinge; at least a coupling assembly having one lower axle wheel and one upper axle wheel disposed between the lower end and the upper end of one side of the link member and between the lower frame and upper frame, respectively, and pivoted on the lower hinge and upper hinge, respectively, with a flexible cord engagingly secured between the lower and upper axle wheels; and at least an idle wheel pivoted on one side of the link member and between the lower and upper axle wheels to be interlacing engaged with the flexible cord and to form a coupling movement, such that the coupling assembly transforms the circular movement of the link member into a rotation for compensating displacement difference of two upper frames without affecting their original angle.
Abstract:
A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.
Abstract:
The present invention discloses a hinge structure with changeable frictional faces, comprising a spindle socketingly disposed with a first enclosing part and a second enclosing part with the openings of the first and second enclosing parts pointing to the same direction to change the frictional face for torsion from the second enclosing face to the first enclosing part and thus to extend the service life and further to form a frictional face with four steps of different torsions to meet the demands of customers.
Abstract:
The present invention discloses a hinge structure with changeable frictional faces, comprising a spindle socketingly disposed with a first enclosing part and a second enclosing part with the openings of the first and second enclosing parts pointing to the same direction to change the frictional face for torsion from the second enclosing face to the first enclosing part and thus to extend the service life and further to form a frictional face with four steps of different torsions to meet the demands of customers.
Abstract:
A vertically adjustable supporting structure that comprises a link member whose bottom and top portions disposed with a lower end and a top end; a lower hinge having at least one shaft pivoted on the lower end of the link member so as to render the link member rotatably pivoted between the two lower frames of the lower hinge; an upper hinge having at least one shaft pivotally connected on the upper end of the link member so as to render the link member rotatably pivoted between the two upper frames of the upper hinge; at least a coupling assembly having one lower axle wheel and one upper axle wheel disposed between the lower end and the upper end of one side of the link member and between the lower frame and upper frame, respectively, and pivoted on the lower hinge and upper hinge, respectively, with a flexible cord engagingly secured between the lower and upper axle wheels; and at least an idle wheel pivoted on one side of the link member and between the lower and upper axle wheels to be interlacing engaged with the flexible cord and to form a coupling movement, such that the coupling assembly transforms the circular movement of the link member into a rotation for compensating displacement difference of two upper frames without affecting their original angle.
Abstract:
An elevation-adjustable support structure includes a connecting member, a bottom hinge structure, which comprises two bottom brackets, and a shaft fastened to the bottom brackets and pivoted to the bottom end of the connecting member for allowing the connecting member to be turned about the shaft between the two bottom brackets, a top hinge structure, which comprises two top brackets and two shafts respectively fastened to the top brackets and pivoted to the top end of the connecting member for allowing the connecting member to be turned about the shafts between the two top brackets; and two linking mechanisms each having a top wheel and a bottom wheel respectively coupled between the top end of the connecting member and the top brackets and the bottom end of the connecting member and the bottom brackets and a flexible belt member coupled between the top wheel and the bottom wheel for maintaining the angle of inclination of the top brackets upon a rotary motion of the connecting member relative to the top hinge structure and the bottom hinge structure.
Abstract:
An elevation-adjustable support structure includes a connecting member, a bottom hinge structure, which comprises two bottom brackets, and a shaft fastened to the bottom brackets and pivoted to the bottom end of the connecting member for allowing the connecting member to be turned about the shaft between the two bottom brackets, a top hinge structure, which comprises two top brackets and two shafts respectively fastened to the top brackets and pivoted to the top end of the connecting member for allowing the connecting member to be turned about the shafts between the two top brackets; and two linking mechanisms each having a top wheel and a bottom wheel respectively coupled between the top end of the connecting member and the top brackets and the bottom end of the connecting member and the bottom brackets and a flexible belt member coupled between the top wheel and the bottom wheel for maintaining the angle of inclination of the top brackets upon a rotary motion of the connecting member relative to the top hinge structure and the bottom hinge structure.