公开(公告)号：US20050095750A1

公开(公告)日：2005-05-05

申请号：US10948214

申请日：2004-09-24

申请人： Jian-Wen Lo ,  Shin-Hua Chao ,  Chia-Yi Hu

发明人： Jian-Wen Lo ,  Shin-Hua Chao ,  Chia-Yi Hu

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/78 ,  H01L23/31 ,  H01L21/50 ,  H01L21/301 ,  H01L21/44 ,  H01L21/46 ,  H01L21/48

CPC分类号： H01L23/3171 ,  H01L21/56 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/18 ,  H01L24/82 ,  H01L2224/18 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3512

摘要： A process for manufacturing transparent semiconductor packages is disclosed. A wafer having an active surface and a back surface is provided. A plurality of first redistribution lines are formed on the active surface of the wafer to connect the bonding pads of the chips. A transparent polymer is formed over the active surface of the wafer to cover the first redistribution lines. A plurality of first grooves are formed corresponding to the scribe lines and in the back surface of the wafer. Preferably, a back coating is then formed over the back surface to fill the first grooves. Next, a plurality of second grooves are formed corresponding to the first grooves and through the back coating such that the first redistribution lines have exposed portions. A plurality of second redistribution lines on the back coating can extend to the exposed portions of the corresponding first redistribution lines for connecting solder balls on the back surface.

摘要翻译： 公开了一种制造透明半导体封装的工艺。 提供具有活性表面和背面的晶片。 在晶片的有源表面上形成多个第一再分配线以连接芯片的焊盘。 在晶片的有效表面上形成透明聚合物以覆盖第一再分配线。 多个第一槽形成对应于划痕线和晶片的后表面。 优选地，在后表面上形成背涂以填充第一凹槽。 接下来，对应于第一凹槽和通过后涂层形成多个第二凹槽，使得第一再分布线具有暴露部分。 后涂层上的多个第二再分配线可以延伸到相应的第一再分配线的暴露部分，用于连接后表面上的焊球。