公开(公告)号：US07459386B2

公开(公告)日：2008-12-02

申请号：US10988528

申请日：2004-11-16

申请人： Li-Hsin Tseng ,  Gil Huang ,  Huei-Mei Yu ,  Chia-Jen Cheng ,  Ken Sun ,  Chien-Tung Yu ,  Blenny Chang ,  Chih Yang Chan ,  Jian-Wen Luo ,  Owen Chen

发明人： Li-Hsin Tseng ,  Gil Huang ,  Huei-Mei Yu ,  Chia-Jen Cheng ,  Ken Sun ,  Chien-Tung Yu ,  Blenny Chang ,  Chih Yang Chan ,  Jian-Wen Luo ,  Owen Chen

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method for forming solder bumps (or solder balls after reflow) of improved height and reliability is provided. In one embodiment, a semiconductor substrate having at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad is provided. A layer of under bump metal (UBM) is formed above the passivation layer and the contact pad. A first patterned and etched photoresist layer is provided above the UBM layer, the first patterned and etched photoresist layer defining at least one first opening therein. A second patterned and etched photoresist layer is provided above the first patterned and etched photoresist layer, the second patterned and etched photoresist layer defining at least one second opening therein, the second opening being wider than the first opening. A solder material is filled in the at least one first opening and substantially filled in the at least one second opening. The first and second photoresist layers are removed and the solder material is reflown to create a solder ball of increased height.

摘要翻译： 提供了一种改善高度和可靠性的形成焊料凸块（或回流焊球）的方法。 在一个实施例中，提供了具有至少一个接触焊盘和具有形成在其中的至少一个开口的上钝化层的半导体衬底，其暴露接触焊盘的一部分。 在钝化层和接触垫之上形成一层下凸块金属（UBM）。 第一图案化和蚀刻的光致抗蚀剂层设置在UBM层上方，第一图案化和蚀刻光刻胶层在其中限定至少一个第一开口。 第二图案化和蚀刻光刻胶层设置在第一图案化和蚀刻光刻胶层的上方，第二图案化和蚀刻光刻胶层在其中限定至少一个第二开口，第二开口比第一开口更宽。 焊料材料填充在至少一个第一开口中并且基本上填充在至少一个第二开口中。 去除第一和第二光致抗蚀剂层，并且焊料材料被重新喷射以产生增加的高度的焊球。