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    Light emitting diode module, and light emitting diode lamp
    2.
    发明授权
    Light emitting diode module, and light emitting diode lamp 有权
    发光二极管模块和发光二极管灯

    公开(公告)号：US08455888B2

    公开(公告)日：2013-06-04

    申请号：US12978646

    申请日：2010-12-27

    Applicant: Ming-Te Lin ,  Ming-Yao Lin ,  Shang-Pin Ying ,  Chih-Hsuan Liu ,  Kuang-Yu Tai

    Inventor： Ming-Te Lin ,  Ming-Yao Lin ,  Shang-Pin Ying ,  Chih-Hsuan Liu ,  Kuang-Yu Tai

    IPC: H01L33/48

    CPC classification number: F21V3/00 ,  F21K9/232 ,  F21V29/67 ,  F21V29/677 ,  F21V29/70 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens.

    Abstract translation: 提供了一种包括插座的发光二极管（LED）灯，设置在插座上的LED模块和组装到插座的灯壳体。 LED模块包括支撑构件和多个LED封装，其中每个LED封装包括芯片载体，反射构件，LED芯片，透镜和荧光体层。 安装在芯片载体上的反射构件具有用于暴露芯片载体的部分的凹部。 LED芯片设置在凹槽中。 封装LED芯片的透镜具有发光面，与反射构件接合的第一反射面和第二反射面，其中，LED芯片面向透镜的发光面。

    LIGHT EMITTING DIODE MODULE, AND LIGHT EMITTING DIODE LAMP
    3.
    发明申请
    LIGHT EMITTING DIODE MODULE, AND LIGHT EMITTING DIODE LAMP 有权
    发光二极管模块和发光二极管灯

    公开(公告)号：US20110284878A1

    公开(公告)日：2011-11-24

    申请号：US12978646

    申请日：2010-12-27

    Applicant: Ming-Te Lin ,  Ming-Yao Lin ,  Shang-Pin Ying ,  Chih-Hsuan Liu ,  Kuang-Yu Tai

    Inventor： Ming-Te Lin ,  Ming-Yao Lin ,  Shang-Pin Ying ,  Chih-Hsuan Liu ,  Kuang-Yu Tai

    IPC: H01L33/48

    CPC classification number: F21V3/00 ,  F21K9/232 ,  F21V29/67 ,  F21V29/677 ,  F21V29/70 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens.

    Abstract translation: 提供了一种包括插座的发光二极管（LED）灯，设置在插座上的LED模块和组装到插座的灯壳体。 LED模块包括支撑构件和多个LED封装，其中每个LED封装包括芯片载体，反射构件，LED芯片，透镜和荧光体层。 安装在芯片载体上的反射构件具有用于暴露芯片载体的部分的凹部。 LED芯片设置在凹槽中。 封装LED芯片的透镜具有发光面，与反射构件接合的第一反射面和第二反射面，其中，LED芯片面向透镜的发光面。

    Processing method for rendering a 3-dimensional arrow object
    4.
    发明授权
    Processing method for rendering a 3-dimensional arrow object 失效
    渲染三维箭头对象的处理方法

    公开(公告)号：US06774894B1

    公开(公告)日：2004-08-10

    申请号：US09665737

    申请日：2000-09-20

    Applicant: Tsung-Wei Lin ,  Chih-Hsuan Liu ,  Shih-Yang Wang

    Inventor： Tsung-Wei Lin ,  Chih-Hsuan Liu ,  Shih-Yang Wang

    IPC: G06T1500

    CPC classification number: G06T11/00 ,  G06F3/04815

    Abstract: A processing method for rendering a planar arrow object into a 3-dimensional arrow object. The processing method of this invention comprises the steps as follows: setting a total length of an arrow object, wherein the arrow object includes at least one end having the arrowhead portion; determining the arrowhead portion and the line portion of the arrow object; creating a corresponding first mapping data of the line portion, wherein the first mapping data represents the third axis data associated with the pixels of the line portion; extracting a corresponding arrowhead graphical data of the arrowhead portion; creating a corresponding second mapping data of the graphical data of the arrowhead portion, wherein the second mapping data represents the third axis data corresponding to the pixels of the graphical data of the arrowhead portion; creating the respectively corresponding masks of the line portion and the arrowhead portion; superimposing the arrowhead mask and the line mask so as to create an arrow object mask; and creating a 3-dimensional image of the arrow object according to the first mapping data and the second mapping data and utilizing the arrow object mask.

    Abstract translation: 一种用于将平面箭头对象渲染成三维箭头对象的处理方法。 本发明的处理方法包括以下步骤：设置箭头物体的总长度，其中箭头物体包括至少一个具有箭头部分的端部; 确定箭头对象的箭头部分和线部分; 创建所述线部分的对应的第一映射数据，其中所述第一映射数据表示与所述线部分的像素相关联的第三轴数据; 提取箭头部分的相应箭头图形数据; 创建所述箭头部分的图形数据的对应的第二映射数据，其中所述第二映射数据表示对应于所述箭头部分的图形数据的像素的第三轴数据; 创建线部分和箭头部分的分别对应的掩模; 叠加箭头掩码和线条掩码，以创建箭头对象掩码; 以及根据第一映射数据和第二映射数据创建箭头对象的三维图像并利用箭头对象掩码。

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