公开(公告)号：US09195267B2

公开(公告)日：2015-11-24

申请号：US13606030

申请日：2012-09-07

申请人： Hung-Sung Pan ,  Po-Chin Yu ,  Long-Cheng Chang ,  Ying-Chi Chou ,  Chih-Wei Lu ,  Chun-Liang Wu ,  Chun-Te Shen

发明人： Hung-Sung Pan ,  Po-Chin Yu ,  Long-Cheng Chang ,  Ying-Chi Chou ,  Chih-Wei Lu ,  Chun-Liang Wu ,  Chun-Te Shen

IPC分类号： G06F13/00 ,  G06F1/16

CPC分类号： G06F1/1632 ,  G06F1/1616 ,  G06F1/1628 ,  G06F1/1669 ,  G06F1/1684 ,  G06F2200/1633

摘要： A docking station suitable for a portable device is provided. The docking station includes a base, a pivot assembly, a supporting board and an electrical connection module. The base includes a circuit board, wherein the circuit board has a ring-shaped circuit. The pivot assembly is pivotally connected to the base along a first axis. The supporting board is connected to the pivot assembly and adapted to support the portable device. The supporting board is rotated relative to the base when the pivot assembly is rotated along the first axis. The electrical connection module includes an electrical connection component and a plurality of connecting terminals. The electrical connection component is fixed on the pivot assembly and contacted with the ring-shaped circuit. The connecting terminals are fixed on the pivot assembly and connected to the electrical connection component. The portable device is adapted to be connected to the connecting terminals.

摘要翻译： 提供了适用于便携式设备的坞站。 对接站包括基座，枢轴组件，支撑板和电连接模块。 基座包括电路板，其中电路板具有环形电路。 枢转组件沿着第一轴线枢转地连接到基座。 支撑板连接到枢轴组件并且适于支撑便携式装置。 当枢轴组件沿着第一轴线旋转时，支撑板相对于基座旋转。 电连接模块包括电连接部件和多个连接端子。 电连接部件固定在枢轴组件上并与环形电路接触。 连接端子固定在枢轴组件上并连接到电连接部件。 便携式设备适于连接到连接端子。

公开(公告)号：US20140065818A1

公开(公告)日：2014-03-06

申请号：US13599764

申请日：2012-08-30

申请人： Chih Wei Lu ,  Chung-Ju Lee ,  Hsiang-Huan Lee ,  Tien-I Bao

发明人： Chih Wei Lu ,  Chung-Ju Lee ,  Hsiang-Huan Lee ,  Tien-I Bao

IPC分类号： H01L21/768

CPC分类号： H01L21/76852 ,  H01L21/7682 ,  H01L21/76885 ,  H01L23/53233 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate. A sacrifice layer (SL) is formed and patterned on the substrate. The patterned SL has a plurality of openings. The method also includes forming a metal layer in the openings and then removing the patterned SL to laterally expose at least a portion of the metal layer to form a metal feature, which has a substantial same profile as the opening. A dielectric layer is deposited on sides of the metal feature.

摘要翻译： 公开了制造半导体集成电路（IC）的方法。 该方法包括提供基板。 牺牲层（SL）在衬底上形成并图案化。 图案化SL具有多个开口。 该方法还包括在开口中形成金属层，然后移除图案化的SL以横向暴露金属层的至少一部分以形成具有与开口基本相同的轮廓的金属特征。 电介质层沉积在金属特征的侧面上。

公开(公告)号：US07781854B2

公开(公告)日：2010-08-24

申请号：US12183378

申请日：2008-07-31

申请人： Chih-Wei Lu

发明人： Chih-Wei Lu

IPC分类号： H01L31/0203 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00 ,  H01L29/16 ,  H01L29/417 ,  H01L29/74 ,  H01L31/111

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor chip package structure includes a transparent substrate, a chip, a sealing ring, a number of conductive posts, and a number of conductive bumps. The transparent substrate has a number of through holes. The through holes pass through the transparent substrate. The chip has an active surface, an image sensitive area, and a number of die pads. The image sensitive area and the die pads are located on the active surface. The sealing ring is disposed between the chip and the transparent substrate and surrounds the image sensitive area and the die pads. The conductive posts are disposed in the through holes, respectively. Here, the chip is electrically connected with the conductive posts via the die pads. The conductive bumps are disposed on the die pads, respectively. The conductive bumps are connected with the conductive posts, respectively.

摘要翻译： 图像传感器芯片封装结构包括透明基板，芯片，密封环，多个导电柱和多个导电凸块。 透明基板具有多个通孔。 通孔穿过透明基板。 芯片具有有源表面，图像敏感区域和多个芯片焊盘。 图像敏感区域和管芯焊盘位于有源表面上。 密封环设置在芯片和透明基板之间，并且包围图像敏感区域和芯片焊盘。 导电柱分别设置在通孔中。 这里，芯片通过管芯焊盘与导电柱电连接。 导电凸块分别设置在芯片焊盘上。 导电凸块分别与导电柱连接。

公开(公告)号：US20100123903A1

公开(公告)日：2010-05-20

申请号：US12410368

申请日：2009-03-24

申请人： Chih-Wei Lu ,  Chia-Wei Sun ,  Gwo-Bin Lee ,  Te-Yang Shen

发明人： Chih-Wei Lu ,  Chia-Wei Sun ,  Gwo-Bin Lee ,  Te-Yang Shen

IPC分类号： G01B11/24

CPC分类号： G01B11/24

摘要： An optical scanning probe is provided and includes a housing, a diaphragm disposed in the housing, a rotor, a conduit, an optical fiber module, and a reflector disposed on the rotor, wherein the diaphragm and the housing forms a chamber. The rotor is movably disposed in the chamber and has several fans. The conduit is disposed in the housing to conduct fluid into the chamber, thus impelling the fans and the rotor. The optical fiber module is disposed in the housing and through the diaphragm to transmit a light beam. The reflector rotates with the rotor and reflects the light beam for 360° scanning.

摘要翻译： 提供了一种光学扫描探针，其包括壳体，设置在壳体中的隔膜，转子，导管，光纤模块和布置在转子上的反射器，其中隔膜和壳体形成腔室。 转子可移动地设置在室中并具有多个风扇。 导管设置在壳体中以将流体引导到腔室中，从而推动风扇和转子。 光纤模块设置在壳体中并通过光阑传输光束。 反射器与转子一起旋转并将光束反射360°扫描。

公开(公告)号：US20100025794A1

公开(公告)日：2010-02-04

申请号：US12183378

申请日：2008-07-31

申请人： Chih-Wei Lu

发明人： Chih-Wei Lu

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor chip package structure includes a transparent substrate, a chip, a sealing ring, a number of conductive posts, and a number of conductive bumps. The transparent substrate has a number of through holes. The through holes pass through the transparent substrate. The chip has an active surface, an image sensitive area, and a number of die pads. The image sensitive area and the die pads are located on the active surface. The sealing ring is disposed between the chip and the transparent substrate and surrounds the image sensitive area and the die pads. The conductive posts are disposed in the through holes, respectively. Here, the chip is electrically connected with the conductive posts via the die pads. The conductive bumps are disposed on the die pads, respectively. The conductive bumps are connected with the conductive posts, respectively.

摘要翻译： 图像传感器芯片封装结构包括透明基板，芯片，密封环，多个导电柱和多个导电凸块。 透明基板具有多个通孔。 通孔穿过透明基板。 芯片具有有源表面，图像敏感区域和多个芯片焊盘。 图像敏感区域和管芯焊盘位于有源表面上。 密封环设置在芯片和透明基板之间，并且包围图像敏感区域和芯片焊盘。 导电柱分别设置在通孔中。 这里，芯片通过管芯焊盘与导电柱电连接。 导电凸块分别设置在芯片焊盘上。 导电凸块分别与导电柱连接。

公开(公告)号：US20090314095A1

公开(公告)日：2009-12-24

申请号：US12191267

申请日：2008-08-13

申请人： Chih-Wei Lu

发明人： Chih-Wei Lu

IPC分类号： G01L9/06 ,  H01L21/00

CPC分类号： G01L19/148 ,  G01L19/141 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A pressure sensing device package including a circuit substrate, a pressure sensing device, a molding compound, and a flexible protection layer is provided. The circuit substrate has an opening. The pressure sensing device is flip chip bonded to the circuit substrate and has a sensing region facing toward the opening. The molding compound encapsulates the pressure sensing device but exposes the sensing region. The flexible protection layer is disposed on the sensing region and exposed by the opening of the circuit substrate.

摘要翻译： 提供了包括电路基板，压力感测装置，模塑料和柔性保护层的压力感测装置封装。 电路基板具有开口。 压力感测装置被倒装芯片接合到电路基板上并且具有面向开口的感测区域。 模制化合物封装压力感测装置，但暴露感测区域。 柔性保护层设置在感测区域上并被电路​​基板的开口暴露。

公开(公告)号：US20060267960A1

公开(公告)日：2006-11-30

申请号：US11429142

申请日：2006-05-08

申请人： Lun-Feng Liao ,  Chih-Wei Lu

发明人： Lun-Feng Liao ,  Chih-Wei Lu

IPC分类号： G09G5/00

CPC分类号： H03K17/962 ,  C25D7/00 ,  H03K2017/9602 ,  H03K2217/960755

摘要： A method for making touch-control acrylic panels, including the following steps: (A) providing an acrylic panel having specific areas; (B) electroplating a metal coating at the back side of the acrylic panel; (C) removing the specific metal coating, together with the acrylic material in contact with the specific metal coating; (D) applying an ink coating at the back side of the acrylic panel; and (E) applying an insulating coating over the ink coating. The touch-control acrylic panels not only can provide a quality feeling of electroplating, but also a function of mirror effect. With a pressure-touch-control switch affixed to the acrylic panel as control buttons, there is no such problem as short circuit in electric conductivity.

摘要翻译： 一种制造触摸控制丙烯酸板的方法，包括以下步骤：（A）提供具有特定区域的丙烯酸板; （B）在丙烯酸板的背面电镀金属涂层; （C）将特定金属涂层与与特定金属涂层接触的丙烯酸材料一起去除; （D）在丙烯酸板的背面施加油墨涂层; 和（E）在油墨涂层上涂覆绝缘涂层。 触摸控制丙烯酸板不仅可以提供电镀的质量感，而且还具有镜面效果的功能。 将压接触摸控制开关固定在丙烯酸面板上作为控制按钮，不存在电导率短路等问题。

公开(公告)号：US09047051B2

公开(公告)日：2015-06-02

申请号：US13773650

申请日：2013-02-22

申请人： Po-Chin Yu ,  Long-Cheng Chang ,  Chih-Wei Lu ,  Chun-Te Shen

发明人： Po-Chin Yu ,  Long-Cheng Chang ,  Chih-Wei Lu ,  Chun-Te Shen

IPC分类号： G06F1/16

CPC分类号： G06F1/1632 ,  G06F1/1626 ,  G06F1/1679

摘要： The invention provides a docking station, which includes a base, a tray and an electrical connector. The base has a chamber. The tray is slidingly disposed at the chamber. The electrical connector is slidingly disposed at the base and disposed at a side of the tray, in which the tray moves under a pressing force to drive the electrical connector for moving. The invention also provides a display system, which includes an electronic device and a docking station, so that the electronic device is detachably disposed at the docking station to expand the applications thereof.

摘要翻译： 本发明提供一种对接站，其包括基座，托盘和电连接器。 基地有一个房间。 托盘滑动地设置在腔室。 电连接器滑动地设置在基座处并且设置在托盘的一侧，托盘在其一侧按压力移动以驱动电连接器移动。 本发明还提供一种显示系统，其包括电子设备和对接站，使得电子设备可拆卸地设置在对接站以扩展其应用。

公开(公告)号：US08885846B2

公开(公告)日：2014-11-11

申请号：US13746320

申请日：2013-01-22

申请人： Hung-Sung Pan ,  Ying-Chi Chou ,  Chih-Wei Lu ,  Chun-Liang Wu ,  Long-Cheng Chang ,  Po-Chin Yu ,  Wei-Chih Hsu

发明人： Hung-Sung Pan ,  Ying-Chi Chou ,  Chih-Wei Lu ,  Chun-Liang Wu ,  Long-Cheng Chang ,  Po-Chin Yu ,  Wei-Chih Hsu

IPC分类号： H04R25/00 ,  G06F1/16 ,  H05K5/00 ,  H05K5/02

CPC分类号： H05K5/0217 ,  G06F1/1626 ,  G06F1/1632

摘要： An electronic device suitable for connecting with an expansion assembly is provided. The electronic device includes a main body and an expansion module. The expansion module is pivoted to the main body and suitable for rotating relative to the main body between an operating position and an accommodating position. When the expansion module is located at the operating position, the expansion assembly is suitable of being electrically connected to the expansion module and providing a supporting force to the main body.

摘要翻译： 提供了一种适于与扩展组件连接的电子设备。 电子设备包括主体和扩展模块。 膨胀模块枢转到主体并且适于在操作位置和容纳位置之间相对于主体旋转。 当膨胀模块位于操作位置时，膨胀组件适于电连接到膨胀模块并向主体提供支撑力。

公开(公告)号：US08835304B2

公开(公告)日：2014-09-16

申请号：US13599764

申请日：2012-08-30

申请人： Chih Wei Lu ,  Chung-Ju Lee ,  Hsiang-Huan Lee ,  Tien-I Bao

发明人： Chih Wei Lu ,  Chung-Ju Lee ,  Hsiang-Huan Lee ,  Tien-I Bao

IPC分类号： H01L21/00

CPC分类号： H01L21/76852 ,  H01L21/7682 ,  H01L21/76885 ,  H01L23/53233 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate. A sacrifice layer (SL) is formed and patterned on the substrate. The patterned SL has a plurality of openings. The method also includes forming a metal layer in the openings and then removing the patterned SL to laterally expose at least a portion of the metal layer to form a metal feature, which has a substantial same profile as the opening. A dielectric layer is deposited on sides of the metal feature.

摘要翻译： 公开了制造半导体集成电路（IC）的方法。 该方法包括提供基板。 牺牲层（SL）在衬底上形成并图案化。 图案化SL具有多个开口。 该方法还包括在开口中形成金属层，然后移除图案化的SL以横向暴露金属层的至少一部分以形成具有与开口基本相同的轮廓的金属特征。 电介质层沉积在金属特征的侧面上。