公开(公告)号：US06809408B2

公开(公告)日：2004-10-26

申请号：US10109755

申请日：2002-03-29

Applicant: Chen Shih Yu ,  Chih-Jen Yang ,  Hung Jui-Hsiang ,  Chin Jeng Liu ,  Chen-Hsung Yang

Inventor： Chen Shih Yu ,  Chih-Jen Yang ,  Hung Jui-Hsiang ,  Chin Jeng Liu ,  Chen-Hsung Yang

IPC: H01L23495

CPC classification number: H01L24/32 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: A semiconductor package with a die pad having a recessed portion is proposed, wherein a lead frame is used, having a die pad formed with at least a through hole, and a plurality of leads. A chip is mounted on the die pad and covers the through hole, with a bottom surface of the chip being partly exposed out the through hole. The through hole is formed at its peripheral edge with a recessed portion that dents from a top surface of the die pad and is associated with the through hole. During a molding process, the recessed portion is entirely filled with an encapsulating compound used for encapsulating the chip and die pad. This prevents forming of voids between the chip and die pad, and assures packaged products to be free of die crack or popcorn effect, thereby significantly improving yield and reliability of the packaged products.

Abstract translation: 提出了一种具有凹陷部分的管芯焊盘的半导体封装，其中使用具有至少形成有通孔的管芯焊盘和多个引线的引线框架。 芯片安装在芯片焊盘上并覆盖通孔，芯片的底表面部分地露出通孔。 通孔在其周边边缘处形成有凹陷部分，凹陷部分从模片垫的顶表面凹陷并与通孔相关联。 在成型过程中，凹部完全填充有用于封装芯片和管芯焊盘的封装化合物。 这防止在芯片和芯片焊盘之间形成空隙，并且确保封装的产品没有模具裂纹或爆米花效应，从而显着地提高了封装产品的产量和可靠性。