公开(公告)号：US08058567B2

公开(公告)日：2011-11-15

申请号：US12175094

申请日：2008-07-17

Applicant: Meng-Han Lee ,  Wei-Wen Lan ,  Ching-Ming Chuang ,  Shi-Shyan James Shang

Inventor： Meng-Han Lee ,  Wei-Wen Lan ,  Ching-Ming Chuang ,  Shi-Shyan James Shang

IPC: H05K1/11

CPC classification number: H05K3/427 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2203/0554 ,  Y10T29/49165

Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).

Abstract translation: 本发明提供一种高密度封装基板及其制造方法。 提供含有上铜箔和下铜箔的双面铜箔层压板。 底部焊盘设置在下铜箔上，与通孔的预定位置对准。 通孔是通过激光钻孔穿过上铜箔和衬底形成的，而不是通过底垫。 种子层被形成为保形地衬在通孔上，并且通过电镀在种子层上形成金属层以形成电镀通孔（PTH）。

公开(公告)号：US20090283315A1

公开(公告)日：2009-11-19

申请号：US12175094

申请日：2008-07-17

Applicant: Meng-Han Lee ,  Wei-Wen Lan ,  Ching-Ming Chuang ,  Shi-Shyan James Shang

Inventor： Meng-Han Lee ,  Wei-Wen Lan ,  Ching-Ming Chuang ,  Shi-Shyan James Shang

IPC: H05K3/42 ,  H05K1/02

CPC classification number: H05K3/427 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2203/0554 ,  Y10T29/49165

Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).

Abstract translation: 本发明提供一种高密度封装基板及其制造方法。 提供含有上铜箔和下铜箔的双面铜箔层压板。 底部焊盘设置在下铜箔上，与通孔的预定位置对准。 通孔是通过激光钻孔穿过上铜箔和衬底形成的，而不是通过底垫。 种子层被形成为保形地衬在通孔上，并且通过电镀在种子层上形成金属层以形成电镀通孔（PTH）。