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    Piezoresistive Micromechanical Sensor Component and Corresponding Measuring Method
    2.
    发明申请
    Piezoresistive Micromechanical Sensor Component and Corresponding Measuring Method 有权
    压电微机械传感器部件及相应的测量方法

    公开(公告)号：US20130098154A1

    公开(公告)日：2013-04-25

    申请号：US13635581

    申请日：2011-01-19

    申请人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

    发明人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

    IPC分类号： G01P15/09

    CPC分类号： G01P15/09 ,  G01P15/0802 ,  G01P15/12 ,  G01P15/123

    摘要： A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

    摘要翻译： 压阻微机电传感器部件包括基板，抗震块，至少一个压阻棒和测量装置。 地震质量从基板悬挂使其能够偏转。 所述至少一个压阻棒设置在所述基底和所述抗震块之间，并且当所述地震质量被偏转时，所述至少一个压阻棒经受阻力的变化。 至少一个压阻棒具有至少部分地覆盖压阻棒并延伸到衬底的区域中的横向和/或上部和/或下部导体轨道。 测量装置电连接到基板和导体轨道，并且被配置成测量电路的电阻变化，该电阻通过基板通过压阻棒和从压阻棒通过横向和/或上部和/ 或下导体轨道。

    Method for producing a micromechanical component
    3.
    发明授权
    Method for producing a micromechanical component 有权
    微机械部件的制造方法

    公开(公告)号：US08492188B2

    公开(公告)日：2013-07-23

    申请号：US13296923

    申请日：2011-11-15

    申请人： Heiko Stahl ,  Christina Leinenbach ,  Axel Franke ,  Jochen Reinmuth ,  Ando Feyh ,  Christian Rettig

    发明人： Heiko Stahl ,  Christina Leinenbach ,  Axel Franke ,  Jochen Reinmuth ,  Ando Feyh ,  Christian Rettig

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00777

    摘要： A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material.

    摘要翻译： 对微机械部件的制造方法进行说明。 该方法包括提供具有包括位于基板上的绝缘材料的层系统的基板，与导电层部分连接的导电层部分和保护层结构，其与绝缘材料的一部分相接触。 该方法还包括进行用于去除绝缘材料的一部分，导电层部分和保护层结构的各向同性蚀刻工艺，以防止去除绝缘材料的边界部分; 以及正在开发的结构元件，其包括导电层部分，保护层结构和绝缘材料的边界部分。

    MICROSYSTEM
    4.
    发明申请
    MICROSYSTEM 审中-公开
    微阵列

    公开(公告)号：US20120291543A1

    公开(公告)日：2012-11-22

    申请号：US13558772

    申请日：2012-07-26

    申请人： Christian RETTIG ,  Axel Franke ,  Ando Feyh

    发明人： Christian RETTIG ,  Axel Franke ,  Ando Feyh

    IPC分类号： B81B3/00 ,  G01P15/00

    CPC分类号： G01C19/56 ,  B81B7/0041 ,  B81B7/02 ,  B81C2203/0109 ,  G01P15/0802 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T428/13

    摘要： A microsystem, e.g., a micromechanical sensor, has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint.

    摘要翻译： 微系统，例如微机械传感器，具有与周围环境密封的第一空腔和与周围环境密封的第二空腔。 第一腔体由第一接合接头限定，第二腔体由第二接合接头限定。 第一接合接头或第二接合接头是共晶接合接头或扩散焊接接头。

    Microsystem
    6.
    发明授权
    Microsystem 有权
    微系统

    公开(公告)号：US08286854B2

    公开(公告)日：2012-10-16

    申请号：US12806135

    申请日：2010-08-06

    申请人： Christian Rettig ,  Axel Franke ,  Ando Feyh

    发明人： Christian Rettig ,  Axel Franke ,  Ando Feyh

    IPC分类号： B23K20/00

    CPC分类号： G01C19/56 ,  B81B7/0041 ,  B81B7/02 ,  B81C2203/0109 ,  G01P15/0802 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T428/13

    摘要： A microsystem has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint.

    摘要翻译： 微系统具有与周围环境密封的第一空腔和与周围环境密封的第二空腔。 第一腔体由第一接合接头限定，第二腔体由第二接合接头限定。 第一接合接头或第二接合接头是共晶接合接头或扩散焊接接头。

    Piezoresistive micromechanical sensor component and corresponding measuring method
    7.
    发明授权
    Piezoresistive micromechanical sensor component and corresponding measuring method 有权
    压电微机械传感器元件及相应的测量方法

    公开(公告)号：US09110090B2

    公开(公告)日：2015-08-18

    申请号：US13635581

    申请日：2011-01-19

    申请人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

    发明人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

    IPC分类号： G01P15/12 ,  G01P15/09 ,  G01P15/08

    CPC分类号： G01P15/09 ,  G01P15/0802 ,  G01P15/12 ,  G01P15/123

    摘要： A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

    摘要翻译： 压阻微机电传感器部件包括基板，抗震块，至少一个压阻棒和测量装置。 地震质量从基板悬挂使其能够偏转。 所述至少一个压阻棒设置在所述基底和所述抗震块之间，并且当所述地震质量被偏转时，所述至少一个压阻棒经受阻力的变化。 至少一个压阻棒具有至少部分地覆盖压阻棒并延伸到衬底的区域中的横向和/或上部和/或下部导体轨道。 测量装置电连接到基板和导体轨道，并且被配置成测量电路的电阻变化，该电阻通过基板通过压阻棒和从压阻棒通过横向和/或上部和/ 或下导体轨道。

    METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
    8.
    发明申请
    METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT 有权
    生产微生物组分的方法

    公开(公告)号：US20120129291A1

    公开(公告)日：2012-05-24

    申请号：US13296923

    申请日：2011-11-15

    申请人： Heiko Stahl ,  Christina Leinenbach ,  Axel Franke ,  Jochen Reinmuth ,  Ando Feyh ,  Christian Rettig

    发明人： Heiko Stahl ,  Christina Leinenbach ,  Axel Franke ,  Jochen Reinmuth ,  Ando Feyh ,  Christian Rettig

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00777

    摘要： A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material.

    摘要翻译： 对微机械部件的制造方法进行说明。 该方法包括提供具有包括位于基板上的绝缘材料的层系统的基板，与导电层部分连接的导电层部分和保护层结构，其与绝缘材料的一部分相接触。 该方法还包括进行用于去除绝缘材料的一部分，导电层部分和保护层结构的各向同性蚀刻工艺，以防止去除绝缘材料的边界部分; 以及正在开发的结构元件，其包括导电层部分，保护层结构和绝缘材料的边界部分。

    Microsystem
    9.
    发明申请
    Microsystem 有权
    微系统

    公开(公告)号：US20110048132A1

    公开(公告)日：2011-03-03

    申请号：US12806135

    申请日：2010-08-06

    申请人： Christian Rettig ,  Axel Franke ,  Ando Feyh

    发明人： Christian Rettig ,  Axel Franke ,  Ando Feyh

    IPC分类号： G01P15/08 ,  B81C3/00

    CPC分类号： G01C19/56 ,  B81B7/0041 ,  B81B7/02 ,  B81C2203/0109 ,  G01P15/0802 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T428/13

    摘要： A microsystem, e.g., a micromechanical sensor, has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint.

    摘要翻译： 微系统，例如微机械传感器，具有与周围环境密封的第一空腔和与周围环境密封的第二空腔。 第一腔体由第一接合接头限定，第二腔体由第二接合接头限定。 第一接合接头或第二接合接头是共晶接合接头或扩散焊接接头。