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公开(公告)号：US08093707B2
公开(公告)日：2012-01-10
申请号：US12581609
申请日：2009-10-19
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49175 , H01L2224/85051 , H01L2224/85207 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2224/85186 , H01L2224/85181 , H01L2924/00 , H01L2224/48227 , H01L2224/85 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2224/4554
摘要： Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.
摘要翻译： 描述了各种半导体封装布置和方法，其提高了将管芯接地或其它外部触头的引线接合的可靠性。 在一个方面，模具上的选择的接地焊盘被引线接合到位于引线框架的连接杆部分上的接合区域。 连接杆连接到从连接杆的接合区域下降的暴露的管芯附接焊盘。 在一些实施例中，接合区域和引线在模具和管芯附接垫上方处于基本相同的高度。 管芯，接合线以及引线框架的至少一部分可以用塑料密封剂材料封装，同时使裸片附接焊盘的接触表面暴露以便于将管芯附着垫电耦合到外部设备。
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公开(公告)号：US20110089556A1
公开(公告)日：2011-04-21
申请号：US12581609
申请日：2009-10-19
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49175 , H01L2224/85051 , H01L2224/85207 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2224/85186 , H01L2224/85181 , H01L2924/00 , H01L2224/48227 , H01L2224/85 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2224/4554
摘要： Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.
摘要翻译： 描述了各种半导体封装布置和方法，其提高了将管芯接地或其它外部触头的引线接合的可靠性。 在一个方面，模具上的选择的接地焊盘被引线接合到位于引线框架的连接杆部分上的接合区域。 连接杆连接到从连接杆的接合区域下降的暴露的管芯附接焊盘。 在一些实施例中，接合区域和引线在模具和管芯附接垫上方处于基本相同的高度。 管芯，接合线以及引线框架的至少一部分可以用塑料密封剂材料封装，同时使裸片附接焊盘的接触表面暴露以便于将管芯附着垫电耦合到外部设备。
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