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公开(公告)号：US08093707B2
公开(公告)日：2012-01-10
申请号：US12581609
申请日：2009-10-19
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49175 , H01L2224/85051 , H01L2224/85207 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2224/85186 , H01L2224/85181 , H01L2924/00 , H01L2224/48227 , H01L2224/85 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2224/4554
摘要： Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.
摘要翻译： 描述了各种半导体封装布置和方法，其提高了将管芯接地或其它外部触头的引线接合的可靠性。 在一个方面，模具上的选择的接地焊盘被引线接合到位于引线框架的连接杆部分上的接合区域。 连接杆连接到从连接杆的接合区域下降的暴露的管芯附接焊盘。 在一些实施例中，接合区域和引线在模具和管芯附接垫上方处于基本相同的高度。 管芯，接合线以及引线框架的至少一部分可以用塑料密封剂材料封装，同时使裸片附接焊盘的接触表面暴露以便于将管芯附着垫电耦合到外部设备。
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公开(公告)号：US20110089556A1
公开(公告)日：2011-04-21
申请号：US12581609
申请日：2009-10-19
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49175 , H01L2224/85051 , H01L2224/85207 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2224/85186 , H01L2224/85181 , H01L2924/00 , H01L2224/48227 , H01L2224/85 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2224/4554
摘要： Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.
摘要翻译： 描述了各种半导体封装布置和方法，其提高了将管芯接地或其它外部触头的引线接合的可靠性。 在一个方面，模具上的选择的接地焊盘被引线接合到位于引线框架的连接杆部分上的接合区域。 连接杆连接到从连接杆的接合区域下降的暴露的管芯附接焊盘。 在一些实施例中，接合区域和引线在模具和管芯附接垫上方处于基本相同的高度。 管芯，接合线以及引线框架的至少一部分可以用塑料密封剂材料封装，同时使裸片附接焊盘的接触表面暴露以便于将管芯附着垫电耦合到外部设备。
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公开(公告)号：US20110140253A1
公开(公告)日：2011-06-16
申请号：US12637657
申请日：2009-12-14
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49582 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48639 , H01L2224/73265 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/35121 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.
摘要翻译： 描述了各种半导体封装布置和封装方法，其提高将管芯下模焊接到管芯附接焊盘的接合线的可靠性。 在一个方面，引线框架（其可以是面板形式）的顶表面的选定部分被电镀（例如镀银），以便于引线接合。 电镀覆盖了芯片附着垫的一些但不是全部的芯片附着表面。 在一些优选实施例中，管芯附接垫上的镀层被布置为围绕模具支撑表面的未镀覆的中心区域的周边环。 在其他实施例中，管芯附接垫上的电镀采用不完全覆盖管芯支撑表面的棒或其它几何图案的形式。 模具支撑表面的未镀层的部分被粗糙化以改善模具与管芯附接垫的粘附，从而降低管芯附着垫分层的可能性以及与下焊接焊接线的相关风险。 所描述的引线框架可以用于各种封装。 最常见的是，模具附接到管芯附接垫的管芯支撑表面，并且通过适当的引线接合电连接到引线框架引线。 管芯的接合焊盘（通常为接地焊盘）中的至少一个被下接合到管芯附接焊盘。 然后，模具，接合线和引线框架的至少一部分通常用塑料密封剂材料封装，同时使裸片附接垫的接触表面暴露以便于将管芯附接垫电耦合到外部设备。
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公开(公告)号：US07247931B2
公开(公告)日：2007-07-24
申请号：US11491664
申请日：2006-07-24
申请人： Chuan Kiak Ng , Ein Sun Ng , Yeu Wen Lee
发明人： Chuan Kiak Ng , Ein Sun Ng , Yeu Wen Lee
IPC分类号： H01L23/495 , H05K7/10
CPC分类号： H01L23/49548 , H01L21/4842 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/181 , Y10T29/49204 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.
摘要翻译： 用于半导体封装的引线框在底表面上形成有凹陷。 压痕的一侧用于形成模具锁，其有助于将引线框架固定到半导体封装的封装材料。
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公开(公告)号：US07105378B2
公开(公告)日：2006-09-12
申请号：US10850592
申请日：2004-05-21
申请人： Chuan Kiak Ng , Ein Sun Ng , Yeu Wen Lee
发明人： Chuan Kiak Ng , Ein Sun Ng , Yeu Wen Lee
IPC分类号： H01L21/48 , H01L23/495 , H01R43/16
CPC分类号： H01L23/49548 , H01L21/4842 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/181 , Y10T29/49204 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.
摘要翻译： 用于半导体封装的引线框在底表面上形成有凹陷。 压痕的一侧用于形成模具锁，其有助于将引线框架固定到半导体封装的封装材料。
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