公开(公告)号：US06274010B1

公开(公告)日：2001-08-14

申请号：US09114122

申请日：1998-07-13

申请人： Paul Henington ,  Chun Pan Fung ,  Kwok Wah Li ,  Chi Chung Lee

发明人： Paul Henington ,  Chun Pan Fung ,  Kwok Wah Li ,  Chi Chung Lee

IPC分类号： C25B1500

CPC分类号： H05K3/241 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/06 ,  Y10S204/07

摘要： An apparatus for electroplating at least one substrate is disclosed as including a trough, two anodes, at least one bath and two poly-tetrafluoroethylene sheets or a number of substantially rigid polypropylene plates, in which the trough supports the substrate and is in an electrically conductive relationship therewith, and the bath contains the anodes, the trough and an electrolyte, in which, in operation, an electric field exists in the electrolyte between the trough and the anodes, and in which the poly-tetrafluoroethylene sheets or the polypropylene plates are movable to vary the amount of electric current passing between the trough and the anodes.

摘要翻译： 公开了一种用于电镀至少一个基底的设备，包括槽，两个阳极，至少一个浴和两个聚四氟乙烯片或多个基本上刚性的聚丙烯板，其中槽支撑基底并处于导电 并且浴中含有阳极，槽和电解质，其中在操作中电解槽存在于槽和阳极之间的电场中，并且其中聚四氟乙烯片或聚丙烯板是可移动的 以改变在槽和阳极之间通过的电流量。