Abstract:
A probe device includes a probe body having a plurality of first holes extending through a first face thereof and a plurality of second holes aligned with the first holes and extending through an opposite second face thereof, a plurality of spaced-apart first probe pins inserted fittingly and removably into respective first holes and each including a first contact portion extending out of the first face, and a first connecting portion extending into the respective first hole, and a plurality of spaced-apart second probe pins inserted fittingly and removably into respective second holes and each including a second contact portion extending out of the second face, and a second connecting portion extending into the respective second hole and having an insert space. The first connecting portion is inserted fittingly and removably into the insert space, and mates with the second connecting portion.
Abstract:
A liquid crystal display (LCD) panel including a first substrate, a second substrate, a liquid crystal layer, a sealant and an electrostatic protection structure is provided. The first substrate and the second substrate are disposed in parallel. The sealant is for sealing the liquid crystal layer between the first substrate and the second substrate. The electrostatic protection structure is disposed within a non-display area outside the sealant. The electrostatic protection structure includes a first line disposed on the first substrate and surrounding the edge of the first substrate.
Abstract:
An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source. The heat sink backplate module includes a body having a plurality of holes, at least a heat pipe, a fins assembly, and a heat spreader. The pluralities of fixing elements of the heat sink are fixed in the holes such that the heat sink is disposed firmly on the heat source. The heat spreader is disposed on a surface close to the circuit board. The heat pipe passing through the body is suitable for heat conducting from the bottom of the circuit board to the fins assembly so that the temperature of the bottom of the circuit board is decreased.
Abstract:
An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source. The heat sink backplate module includes a body having a plurality of holes, at least a heat pipe, a fins assembly, and a heat spreader. The pluralities of fixing elements of the heat sink are fixed in the holes such that the heat sink is disposed firmly on the heat source. The heat spreader is disposed on a surface close to the circuit board. The heat pipe passing through the body is suitable for heat conducting from the bottom of the circuit board to the fins assembly so that the temperature of the bottom of the circuit board is decreased.
Abstract:
An electronic device includes a circuit board and a heat spreader. The circuit board has a first surface, a second surface, and an electronic component. The first surface is opposite to the second surface, and the electronic component is located on the first surface. The heat spreader is disposed on the circuit board has a first portion, a second portion, and a third portion. The first portion is located on the first surface of the circuit board and contacts the electronic component. The second portion is located on the second surface of the circuit board, and the third portion is connected between the first portion and the second portion.
Abstract:
A cooling apparatus for dissipating a heat from a heat source by a fluid includes a cooling fin set, a water-cooling pipe, and a heat tube. The water-cooling pipe and the heat tube are penetrating through the cooling fin set. The cooling apparatus further includes a base, and the heat tube is coupled on the base for supporting the cooling pipe and the cooling fins. The cooling pipe further includes an influent combined with the base. A part of the heat from the fluid is transferred to the heat tube from the base and transferred to the cooling fin set from the heat tube and then dissipated. Another part of the heat is transferred to the cooling fin set from the water-cooling pipe. A cooling system with the cooling apparatus is also disclosed.
Abstract:
A probe device includes a probe body having a plurality of first holes extending through a first face thereof and a plurality of second holes aligned with the first holes and extending through an opposite second face thereof, a plurality of spaced-apart first probe pins inserted fittingly and removably into respective first holes and each including a first contact portion extending out of the first face, and a first connecting portion extending into the respective first hole, and a plurality of spaced-apart second probe pins inserted fittingly and removably into respective second holes and each including a second contact portion extending out of the second face, and a second connecting portion extending into the respective second hole and having an insert space. The first connecting portion is inserted fittingly and removably into the insert space, and mates with the second connecting portion.
Abstract:
A portable data storage device includes a first storage unit having a data storing zone and a reserved zone for bad blocks in the first storage unit, and a second storage unit having a look-up table. The look-up table lists a number of configuration modes for the portable data storage device, each defining specific allocation sizes for the reserved zone and the data storing zone. The portable data storage device is configured to use a kth configuration mode. A method for dynamic memory management includes: i) determining a number of the bad blocks assigned to the reserved zone; ii) with reference to the look-up table, determining if this number is greater than a limit associated with the kth configuration mode; and iii) if so, reconfiguring the portable data storage device to use a (k+1)th configuration mode.
Abstract:
A liquid crystal display panel with electrostatic discharge protection capability has an array substrate having an active area, a driver IC, a Vcom wire and an electrostatic reduction element formed on. The driver IC is formed beside the active area. The Vcom wire is formed around the active area and is connected with the electrostatic reduction element to the driver IC. When an electrostatic discharge current flows on the Vcom wire to the driver IC, the electrostatic reduction element mitigates or obviates damage to the driver IC.
Abstract:
An electronic device with a heat dissipation device is described. A printed circuit board has a first electronic component and a second electronic component thereon. The first dissipation device is attached to the first electronic component. The second dissipation device is attached to the second electronic component. At least one heat pipe includes a first straight section, a second straight section and a bent section between the former two. The heat pipe penetrates the first dissipation device and the second dissipation device, wherein the second dissipation device has at least one side engraved slot for securing the heat pipe inside.