摘要:
A photo-curable resin composition for the UV-LED light source, which is rapidly cured and particularly has excellent surface curing property, is disclosed. The resin composition contains (a) polybutadiene (meth)acrylate; (b) a polythiol compound; and (c) a photo radical initiator and is photo-curable by an irradiation with an ultraviolet light-LED. Accordingly, production efficiency can be significantly increased in the production of liquid crystal displays and electrical and electronic components.
摘要:
The objective of the present invention is to provides a cationically curable epoxy resin composition excellent in sealing and adhesive property specifically to glass, excellent reflow resistance property, moisture resistance and water resistance while keeping a good workability intrinsic to a light curable resins. The invention provides a cationically curable epoxy resin composition comprising: (a) an epoxy resin component; (b) a cationic photo-initiator; (c) a cationic thermal-initiator and (d) a filler selected from the group consisting of oxides, hydroxides and carbonates containing a Group II element in the long periodic table.
摘要:
The objective of the present invention is to provides a cationically curable epoxy resin composition excellent in sealing and adhesive property specifically to glass, excellent reflow resistance property, moisture resistance and water resistance while keeping a good workability intrinsic to a light curable resins. The invention provides a cationically curable epoxy resin composition comprising: (a) an epoxy resin component; (b) a cationic photo-initiator; (c) a cationic thermal-initiator and (d) a filler selected from the group consisting of oxides, hydroxides and carbonates containing a Group 1I element in the long periodic table.
摘要:
A photo-curable resin composition for the UV-LED light source, which is rapidly cured and particularly has excellent surface curing property, is disclosed. The resin composition contains (a) polybutadiene (meth)acrylate; (b) a polythiol compound; and (c) a photo radical initiator and is photo-curable by an irradiation with an ultraviolet light-LED. Accordingly, production efficiency can be significantly increased in the production of liquid crystal displays and electrical and electronic components.
摘要:
There is disclosed a method for adhering a first connecting portion comprising a first electrode formed on a transparent substrate and a second connecting portion comprising a second electrode formed on a flexible substrate, whereby electrically connecting the first electrode and the second electrode, the method comprising the steps of: applying a bonding composition on at least one of the first connecting portion and the second connecting portion; aligning the first electrode and the second electrode, and irradiating with light while the first connecting portion and the second connecting portion are pressed so as to contact each other; and allowing the resulting assembly to stand at ambient temperature after the light irradiation; wherein the bonding composition comprises no electrically-conductive particle, but comprises: (a) a curable resin component; (b) a photo cure initiation component; and (c) an anaerobic curing initiation component; and wherein the anaerobic curing is not completed when the photo-irradiation is terminated.
摘要:
The present invention provides a cationically photocurable epoxy resin composition, which contains (a) an epoxy resin component comprising an alicyclic epoxy resin and an aromatic-ring containing epoxy resin, (b) a cationic photoinitiator component, and (c) a filler selected from oxides, hydroxides and carbonates containing a Group II element. This composition exhibits improved adhesive strength to a glass such as an alkali glass, particularly a sodium-containing glass, or a metal.
摘要:
This invention relates to a photocurable resin, in particular, to an epoxy resin composition curable by cation polymerization induced by photoirradiation.
摘要:
A composition useful as a sealing element for electrochromic devices comprises (a) an epoxy resin component including at least two of a dicyclopentadiene epoxy resin, a naphthalene epoxy resin, a bisphenol A epoxy resin, a bisphenol F epoxy resin and a novolac epoxy resin; (b) a toughening agent; and (c) a latent curative.