摘要:
A micromechanical resonate device having an extensional wine-glass mode shape is described herein. Different embodiments of the device may employ vibrating polysilicon micromechanical ring resonators, utilizing a unique extensional wine-glass mode shape to achieve lower impedance than previous UHF resonators at frequencies as high as 1.2-GHz with a Q of 3,700, and 1.47-GHz (highest to date for polysilicon micromechanical resonators) with a Q of 2,300. The 1.2-GHz resonator exhibits a measured motional resistance of 560 kΩ with a dc-bias voltage of 20V, which is 6× lower than measured on radial contour mode disk counterparts at the same frequency, and which can be driven down as low as 2 kΩ when a dc-bias voltage of 100V and electrode-to-resonator gap spacing of 460 Å are used. The above high Q and low impedance advantages, together with the multiple frequency, on-chip integration advantages afforded by electrostatically-transduced μmechanical resonators, may be utilized in the front-end RF filtering and oscillator functions needed by wireless communication devices.
摘要:
Micromechanical structures having at least one lateral capacitive transducer gap filled with a dielectric and method of making same are provided. VHF and UHF MEMS-based vibrating micromechanical resonators filled with new solid dielectric capacitive transducer gaps to replace previously used air gaps have been demonstrated at 160 MHz, with Q's˜20,200 on par with those of air-gap resonators, and motional resistances (Rx's) more than 8× smaller at similar frequencies and bias conditions. This degree of motional resistance reduction comes about via not only the higher dielectric constant provided by a solid-filled electrode-to-resonator gap, but also by the ability to achieve smaller solid gaps than air gaps. These advantages with the right dielectric material may now allow capacitively-transduced resonators to match to the 50-377Ω impedances expected by off-chip components (e.g., antennas) in many wireless applications without the need for high voltages.
摘要:
High-Q micromechanical resonator devices and filters utilizing same are provided. The devices and filters include a vibrating polysilicon micromechanical “hollow-disk” ring resonators obtained by removing quadrants of material from solid disk resonators, but purposely leaving intact beams or spokes of material with quarter-wavelength dimensions to non-intrusively support the resonators. The use of notched support attachments closer to actual extensional ring nodal points further raises the Q. Vibrating micromechanical hollow-disk ring filters including mechanically coupled resonators with resonator Q's greater than 10,000 achieve filter Q's on the order of thousands via a low-velocity coupling scheme. A longitudinally mechanical spring is utilized to attach the notched-type, low-velocity coupling locations of the resonators in order to achieve a extremely narrow passband.