公开(公告)号：US08930047B2

公开(公告)日：2015-01-06

申请号：US13177802

申请日：2011-07-07

申请人： Brendan H. Robinson ,  John H. Steele, II ,  Clifton Quan ,  Leo H. Hui

发明人： Brendan H. Robinson ,  John H. Steele, II ,  Clifton Quan ,  Leo H. Hui

IPC分类号： G06F17/00 ,  G06F15/00 ,  H01Q3/00 ,  H01Q1/12 ,  H01Q1/28 ,  H01Q21/06 ,  H01Q23/00

CPC分类号： H01Q1/125 ,  H01Q1/28 ,  H01Q3/00 ,  H01Q21/06 ,  H01Q23/00

摘要： Systems and methods for determining a positional state of an airborne array antenna using distributed accelerometers are described. One such method includes receiving and formatting acceleration data from each of a plurality of accelerometers mounted at different locations along the array antenna, receiving position and orientation data from an inertial navigation service (INS) mounted on the array antenna, generating an INS estimated position for each accelerometer based on the position and orientation data from the INS, generating an accelerometer estimated position for each accelerometer based on the acceleration data, determining a position and orientation of each accelerometer based on the respective INS estimated position and the respective accelerometer estimated position, determining an estimated position of a center and an orientation of the array antenna based on the determined position and orientation of each accelerometer, and adjusting a direction of the array antenna based on the estimated position of the array antenna.

摘要翻译： 描述了使用分布式加速度计确定机载阵列天线的位置状态的系统和方法。 一种这样的方法包括从安装在阵列天线的不同位置处的多个加速度计的每一个接收和格式化加速度数据，从安装在阵列天线上的惯性导航服务（INS）接收位置和姿态数据，产生INS估计位置 基于来自INS的位置和取向数据的每个加速度计，基于加速度数据生成每个加速度计的加速度计估计位置，基于相应的INS估计位置和相应的加速度计估计位置确定每个加速度计的位置和取向，确定 基于所确定的每个加速度计的位置和方位的阵列天线的中心和取向的估计位置，以及基于阵列天线的估计位置来调整阵列天线的方向。

公开(公告)号：US08487823B2

公开(公告)日：2013-07-16

申请号：US12617509

申请日：2009-11-12

申请人： Clifton Quan ,  Mark Hauhe

发明人： Clifton Quan ,  Mark Hauhe

IPC分类号： H01Q19/00

CPC分类号： H01Q21/061 ,  H01Q1/422 ,  H01Q15/0006 ,  H01Q15/244

摘要： A switchable microwave fluidic polarizer is provided. In one embodiment, the invention relates to a switchable polarizer for polarizing radio frequency (RF) signals associated with an antenna, the switchable polarizer including a plurality of radiating elements, an RF feed coupled to the plurality of radiating elements, an antenna input coupled to the RF feed, and an antenna cover disposed in proximity to the plurality of radiating elements, the antenna cover including a dielectric substrate including a plurality of channels for enclosing a liquid metal.

摘要翻译： 提供可切换的微波流体偏振器。 在一个实施例中，本发明涉及用于偏置与天线相关联的射频（RF）信号的可切换偏振器，所述可切换偏振器包括多个辐射元件，耦合到所述多个辐射元件的RF馈电，耦合到 所述RF馈送和设置在所述多个辐射元件附近的天线罩，所述天线罩包括包括用于封闭液态金属的多个通道的电介质衬底。

公开(公告)号：US08209846B2

公开(公告)日：2012-07-03

申请号：US12567476

申请日：2009-09-25

申请人： Avery Y. Quil ,  Clifton Quan ,  Alec Ekrnekjl ,  Jason G. Milne

发明人： Avery Y. Quil ,  Clifton Quan ,  Alec Ekrnekjl ,  Jason G. Milne

IPC分类号： H01Q13/00 ,  H01Q21/00

CPC分类号： H01Q21/0087 ,  H01Q13/085 ,  H01Q21/0025 ,  H01Q21/061 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49222

摘要： Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structures and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

摘要翻译： 描述了组装有源阵列系统的方法。 在一个示例性实施例中，具有具有第一阵列电触点的第一表面和具有散热器结构阵列的散热器孔和具有第二阵列电触头的孔安装表面的有源子阵列组件组装在一起。 面板组件的第一表面和散热器孔的孔安装表面与包括微波互连的粘合剂层相接触，所述粘合层具有与第一电触头阵列相对应的图案和第二电触头阵列，使得粘合剂层 位于面板组件的第一表面和散热器孔的孔安装表面之间。 施加压力，热和真空以固化粘合剂并完成微波互连的接合。

公开(公告)号：US20120013514A1

公开(公告)日：2012-01-19

申请号：US12836442

申请日：2010-07-14

申请人： Fangchou Yang ,  Hee Kyung Kim ,  Shahrokh Hashemi-Yeganeh ,  Clifton Quan ,  Alberto F. Viscarra ,  Robert W. Ladera

发明人： Fangchou Yang ,  Hee Kyung Kim ,  Shahrokh Hashemi-Yeganeh ,  Clifton Quan ,  Alberto F. Viscarra ,  Robert W. Ladera

IPC分类号： H01Q9/04 ,  H01Q1/00 ,  H01Q13/10

CPC分类号： H01Q21/062

摘要： Systems and methods for exciting long slot radiators of an RF antenna are provided. In one embodiment, the invention relates to a radiator transition assembly for exciting a long slot radiator of an antenna, the transition assembly including a folded flexible circuit substrate including at least two folds forming a long slot radiator, an excitation circuitry configured to generate signals for exciting the long slot radiator, and a microstrip transmission line coupled to the excitation circuitry and positioned along the folded flexible circuit substrate, where the microstrip transmission line extends across an opening of the long slot radiator.

摘要翻译： 提供用于激发RF天线的长槽辐射器的系统和方法。 在一个实施例中，本发明涉及一种用于激发天线的长缝辐射器的辐射器过渡组件，该转换组件包括折叠的柔性电路衬底，该柔性电路衬底包括形成长缝隙辐射体的至少两个折叠部分，激励电路被配置为产生用于 激励长槽辐射器，以及耦合到激励电路并沿着折叠的柔性电路衬底定位的微带传输线，其中微带传输线延伸穿过长缝辐射器的开口。

公开(公告)号：US08043464B2

公开(公告)日：2011-10-25

申请号：US12620490

申请日：2009-11-17

申请人： Hee Kyung Kim ,  Fangchou Yang ,  Alberto F. Viscarra ,  Clifton Quan ,  Derek Pruden

发明人： Hee Kyung Kim ,  Fangchou Yang ,  Alberto F. Viscarra ,  Clifton Quan ,  Derek Pruden

IPC分类号： B32B37/00 ,  B29C65/00 ,  C09J5/04 ,  H01Q13/10

CPC分类号： H01Q3/30 ,  H01Q1/28 ,  H01Q1/288 ,  H01Q21/0087

摘要： Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.

摘要翻译： 提供了组装轻量RF天线结构的系统和方法。 在一个实施例中，本发明涉及一种用于形成轻型天线的方法，包括用于形成用于天线的第一馈送组件的过程，用于形成第一馈送组件的过程包括提供平坦柔性电路基板，提供形成的柔性电路基板 将粘合剂施加到平坦基板或成形基板的表面上的多个位置，使用粘合剂接合平板基板和成形基板，并加热接合的平坦基板和形成的基板以结合基板。

公开(公告)号：US20100003785A1

公开(公告)日：2010-01-07

申请号：US12557205

申请日：2009-09-10

申请人： Tse E. WONG ,  Samuel D. TONOMURA ,  Stephen E. SOX ,  Timothy E. DEARDEN ,  Clifton QUAN ,  Polwin C. CHAN ,  Mark S. HAUHE

发明人： Tse E. WONG ,  Samuel D. TONOMURA ,  Stephen E. SOX ,  Timothy E. DEARDEN ,  Clifton QUAN ,  Polwin C. CHAN ,  Mark S. HAUHE

IPC分类号： H01L21/60

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In one or more embodiments, a method of producing a stacked integrated circuit assembly includes providing a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC may be disposed between the substrate and the SFIC. The method includes making at least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

摘要翻译： 在一个或多个实施例中，一种制造堆叠集成电路组件的方法包括提供具有至少一个衬底连接焊盘的顶表面的衬底。 第一倒装芯片集成电路（FFIC）设置在基板上方，第二倒装芯片集成电路（SFIC）设置在FFIC上方。 FFIC可以设置在基板和SFIC之间。 该方法包括在衬底连接焊盘和FFIC之间进行至少一个焊接连接以及FFIC和SFIC之间的至少一个焊接连接。

公开(公告)号：US07605477B2

公开(公告)日：2009-10-20

申请号：US11698602

申请日：2007-01-25

申请人： Tse E. Wong ,  Samuel D. Tonomura ,  Stephen E. Sox ,  Timothy E. Dearden ,  Clifton Quan ,  Polwin C. Chan ,  Mark S. Hauhe

发明人： Tse E. Wong ,  Samuel D. Tonomura ,  Stephen E. Sox ,  Timothy E. Dearden ,  Clifton Quan ,  Polwin C. Chan ,  Mark S. Hauhe

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

摘要翻译： 堆叠集成电路组件包括具有至少一个衬底连接焊盘的顶表面的衬底。 第一倒装芯片集成电路（FFIC）设置在基板上方，第二倒装芯片集成电路（SFIC）设置在FFIC上方。 FFIC设置在基板和SFIC之间。 堆叠集成电路组件包括衬底连接焊盘和FFIC之间的至少一个焊接连接以及FFIC和SFIC之间的至少一个焊接连接。

公开(公告)号：US20080258848A1

公开(公告)日：2008-10-23

申请号：US11788140

申请日：2007-04-19

申请人： Clifton Quan ,  David E. Roberts ,  Shahrokh Hashemi-Yeganeh ,  Richard A. Montgomery

发明人： Clifton Quan ,  David E. Roberts ,  Shahrokh Hashemi-Yeganeh ,  Richard A. Montgomery

IPC分类号： H01P1/10 ,  H03H7/38

CPC分类号： H01P5/107 ,  G01R1/06722 ,  H01R13/2421 ,  H03H7/38

摘要： A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed.

摘要翻译： 弹簧加载微波互连器（SLMI）。 SLMI包括具有第一侧并与其相对的第二侧的波导探针头，该侧面横向于中心轴线。 耦合到探针头第一侧的弹簧加载的同轴中心导体，并提供远端导电尖端。 同轴中心导体沿着中心轴线延伸。 电介质套筒围绕与第一侧相邻的同轴电缆中心导体设置。 远端导电尖端在处于延伸位置时延伸超出介质套管并且当处于压缩毒物时与电介质套管大致平齐。 还公开了利用多个SLMI多端口PCB组件的多端口波导，其中多端口波导和PCB具有弯曲轮廓。

公开(公告)号：US20080191950A1

公开(公告)日：2008-08-14

申请号：US11705213

申请日：2007-02-13

申请人： Ike Y. Chang ,  Richard W. Nichols ,  Clifton Quan ,  Jonathan D. Gordon ,  Irwin L. Newberg

发明人： Ike Y. Chang ,  Richard W. Nichols ,  Clifton Quan ,  Jonathan D. Gordon ,  Irwin L. Newberg

IPC分类号： H01Q1/27 ,  H01Q1/38 ,  H01Q9/04

CPC分类号： H01Q1/276 ,  H01Q3/34 ,  H01Q13/106 ,  H01Q13/18 ,  H01Q21/0075 ,  H01Q21/064

摘要： A phased array antenna adapted to be mounted in a helmet. In the illustrative embodiment, the antenna comprises a substrate and an array of radiating elements disposed on said substrate, each of the elements including a-resonant cavity and a mechanism for feeding the cavity with an electromagnetic signal., The cavity is formed in a multi-layer structure between a ground plane and a layer of metallization. A radiating slot or slots are provided in the layer of metallization. A first layer of dielectric material is disposed within the cavity. The feed mechanism is a microstrip feed disposed in the first layer of dielectric material parallel to a plane of a portion of the substrate over which an associated element is disposed. A layer of foam is disposed between the layer of dielectric material and the ground plane. Second and third parallel layers of dielectric material are included in each element. The second layer is disposed adjacent to the ground plane. A layer of element interconnection circuitry is disposed between the second and third layers of dielectric material. A transmit/receive module or circuitry for each element is secured to the third layer of dielectric material. The substrate may be conformal or conformable, as well as rigid. An arrangement is included for steering a beam transmitted or received by the antenna.

摘要翻译： 适合安装在头盔中的相控阵天线。 在说明性实施例中，天线包括衬底和布置在所述衬底上的辐射元件阵列，每个元件包括谐振腔和用于向空腔馈送电磁信号的机构，空腔形成为多 在地平面和金属化层之间的层结构。 在金属化层中提供辐射槽或槽。 介电材料的第一层设置在空腔内。 馈送机构是布置在电介质材料的第一层中的平行于衬底部分的平面的微带馈电，相关元件设置在该平面上。 一层泡沫体设置在介电材料层和接地平面之间。 介电材料的第二和第三平行层包括在每个元件中。 第二层设置在接地平面附近。 元件互连电路层设置在介电材料的第二和第三层之间。 用于每个元件的发射/接收模块或电路固定到第三层电介质材料。 衬底可以是适形的或适形的，以及刚性的。 包括用于控制由天线发送或接收的波束的布置。

公开(公告)号：US20080030413A1

公开(公告)日：2008-02-07

申请号：US11499593

申请日：2006-08-04

申请人： Jar J. Lee ,  Clifton Quan ,  Stanley W. Livingston

发明人： Jar J. Lee ,  Clifton Quan ,  Stanley W. Livingston

IPC分类号： H01Q1/28

CPC分类号： H01Q1/1292 ,  H01Q1/286 ,  H01Q3/46 ,  H01Q5/42 ,  H01Q21/0018

摘要： A space-fed conformal array for a high altitude airship includes a primary array lens assembly adapted for conformal mounting to a non-planar airship surface. The lens assembly includes a first set of radiator elements and a second set of radiator elements, the first set and the second set spaced apart by a spacing distance. The first set of radiators faces outwardly from the airship surface to provide a radiating aperture. The second set of radiators faces inwardly toward an inner space of the airship, for illumination by a feed array spaced from the second set of radiators.

摘要翻译： 用于高空飞艇的空间馈电保形阵列包括适于安装到非平面飞艇表面的主阵列透镜组件。 透镜组件包括第一组散热器元件和第二组散热器元件，第一组和第二组间隔开间隔距离。 第一组散热器从飞艇表面向外面向外提供辐射孔。 第二组散热器向内朝向飞艇的内部空间，用于通过与第二组散热器间隔开的进给阵列进行照明。