CONDUCTIVE CONNECTIONS ALLOWING XYZ TRANSLATION
    2.
    发明申请
    CONDUCTIVE CONNECTIONS ALLOWING XYZ TRANSLATION 有权
    导向连接允许XYZ翻译

    公开(公告)号:US20140073152A1

    公开(公告)日:2014-03-13

    申请号:US13607317

    申请日:2012-09-07

    IPC分类号: H01R4/58 H05K3/36

    摘要: The embodiments relates generally to the use of conductive connections for electrically grounding a series of conductive substrates. More specifically the embodiments teach configurations of conductive connections that do not overly constrain relative motion between the connected conductive substrates. Conductive pressure sensitive adhesive is used to attach opposing ends of the conductive connectors to the conductive substrates. A substrate portion of the conductive connectors is scored by a cutting device such as a die cutter to reduce rigidity of the substrate portion.

    摘要翻译: 实施例一般涉及使用导电连接来使一系列导电基板电接地。 更具体地,实施例教导不会过度约束连接的导电衬底之间的相对运动的导电连接的构造。 导电压敏粘合剂用于将导电连接器的相对端附接到导电基板。 导电连接器的基板部分通过诸如模切机的切割装置进行刻痕,以降低基板部分的刚性。

    Conductive connections allowing XYZ translation
    4.
    发明授权
    Conductive connections allowing XYZ translation 有权
    导电连接允许XYZ平移

    公开(公告)号:US08895865B2

    公开(公告)日:2014-11-25

    申请号:US13607317

    申请日:2012-09-07

    IPC分类号: H05K1/00

    摘要: The embodiments relates generally to the use of conductive connections for electrically grounding a series of conductive substrates. More specifically the embodiments teach configurations of conductive connections that do not overly constrain relative motion between the connected conductive substrates. Conductive pressure sensitive adhesive is used to attach opposing ends of the conductive connectors to the conductive substrates. A substrate portion of the conductive connectors is scored by a cutting device such as a die cutter to reduce rigidity of the substrate portion.

    摘要翻译: 实施例一般涉及使用导电连接来使一系列导电基板电接地。 更具体地,实施例教导不会过度约束连接的导电衬底之间的相对运动的导电连接的构造。 导电压敏粘合剂用于将导电连接器的相对端附接到导电基板。 导电连接器的基板部分通过诸如模切机的切割装置进行刻痕,以降低基板部分的刚性。