Apparatus for molding glass substrate

    公开(公告)号:US10683228B2

    公开(公告)日:2020-06-16

    申请号:US15034085

    申请日:2014-11-04

    IPC分类号: C03B23/035

    摘要: The present invention relates to an apparatus for molding a glass substrate, and more specifically, to an apparatus for molding a glass substrate capable of forming a glass substrate in a 3D shape and preventing the shape of a vacuum hole from transferring onto the surface of the substrate. To this end, the present invention provides the apparatus for shaping a glass substrate, comprising: a molding frame having a cavity, at least one vacuum hole and at least one decompression hole, wherein the cavity disposed on one surface of the molding frame, the at least one vacuum hole formed in the molding frame below the cavity, the at least one vacuum hole being connected to an external vacuum device, and the at least one decompression hole defined between the cavity and the at least one vacuum hole such that the cavity communicates with the at least one vacuum hole, wherein a width of the at least one decompression hole is greater than a width of the at least one vacuum hole such that the at least one decompression hole lessens vacuum pressure applied to the glass substrate disposed on the cavity through the at least one vacuum hole, wherein all of the at least one vacuum hole are connected to the at least one decompression hole.

    Apparatus for inspecting edge of substrate

    公开(公告)号:US10397456B2

    公开(公告)日:2019-08-27

    申请号:US14596650

    申请日:2015-01-14

    发明人: Siho Seong

    摘要: An apparatus for inspecting an edge portion of a substrate can inspect a defect or a chamfered width on an edge portion of a substrate. First and second right-angled prisms are disposed above and below the edge portion such that inclined surfaces thereof are directed toward the upper surface and lower surface of the edge portion. A lighting part irradiates the edge portion of the substrate with light. A photographing part is disposed adjacent to the edge portion. The photographing part takes an image of the upper surface of the edge portion from light that has passed through the first right-angled prism, an image of the lower surface of the edge portion from light that has passed through the second right-angled prism, and an image of an end surface of the edge portion.

    Substrate for color conversion, manufacturing method therefor, and display device comprising same

    公开(公告)号:US10215907B2

    公开(公告)日:2019-02-26

    申请号:US15515873

    申请日:2015-08-07

    IPC分类号: F21V9/30 F21V8/00 G02F1/1335

    摘要: The present invention relates to a substrate for color conversion, a manufacturing method therefor, and a display device comprising the same and, more specifically, to a substrate for color conversion for not only securing the long-term stability of quantum dots but also exhibiting excellent color conversion efficiency, a manufacturing method therefor, and a display device comprising the same. To this end, the present invention provides a substrate for color conversion, a manufacturing method therefor, and a display device, the substrate for color conversion comprising: a thin plate glass; a coating layer for quantum dots formed on one surface of the thin plate glass; a light guide plate disposed to face the coating layer for quantum dots, a light emitting diode being disposed on the sides thereof; and a sealing material which is formed between the thin plate glass and the light guide plate and which blocks the coating layer for quantum dots from the outside.

    Large area organic light emitting panel

    公开(公告)号:US10162085B2

    公开(公告)日:2018-12-25

    申请号:US15106161

    申请日:2014-12-11

    摘要: The present invention relates to a large area organic light emitting panel and, more particularly, to a large area organic light emitting panel which prevents an observer in front of the panel from recognizing a seam connecting organic light emitting panels, i.e. which can implement a seamless effect. To this end, the present invention provides a large area organic light emitting panel comprising: a plurality of organic light emitting panels arranged vertically and horizontally; and a seam part, formed between the plurality of organic light emitting panels, for connecting the plurality of organic light emitting panels and refracting, to the front, light laterally emitted from the organic light emitting panels by a wave guiding effect.

    Method for manufacturing light extraction substrate

    公开(公告)号:US10033012B2

    公开(公告)日:2018-07-24

    申请号:US15539864

    申请日:2015-12-18

    摘要: The present invention relates to a method for manufacturing a light extraction substrate for an organic light emitting diode, a light extraction substrate for an organic light emitting diode, and an organic light emitting diode comprising same, and more specifically, to a method for manufacturing a light extraction substrate for an organic light emitting diode, a light extraction substrate for an organic light emitting diode, and an organic light emitting diode comprising same, the method capable of complicating or diversifying the path of a light that is emitted by forming cracks on a matrix layer that can induce scattering of the light emitted from the organic light emitting diode, thereby further improving light extraction efficiency of the organic light emitting diode. To this end, provided in the present invention is the method for manufacturing the light extraction substrate for the organic light emitting diode, comprising: a mixture-preparing step of preparing a mixture by mixing a sol-gel solution containing a first metal oxide, and a plurality of scattering particles composed of a second metal oxide having a refractive index different from that of the first metal oxide; a mixture coating step of coating the mixture on a base substrate; and a mixture firing step of firing the mixture which has been coated to form, on the base substrate, the matrix layer comprising the first metal oxide and inside of which the scattering particles are dispersed, wherein in the mixture firing step, cracks that can induce scattering of the light emitted from the light emitting diode are formed on the matrix layer due to the difference in the coefficient of thermal expression (CTE) of the base substrate and the first metal oxide.